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    METHOD FOR PRODUCING A SOLAR CELL
    1.
    发明申请
    METHOD FOR PRODUCING A SOLAR CELL 审中-公开
    生产太阳能电池的方法

    公开(公告)号：US20140299182A1

    公开(公告)日：2014-10-09

    申请号：US14112180

    申请日：2012-04-19

    申请人： Christine Meyer ,  Tobias Droste ,  Yvonne Gassenbauer ,  Jens Dirk Moschner ,  Peter Roth

    发明人： Christine Meyer ,  Tobias Droste ,  Yvonne Gassenbauer ,  Jens Dirk Moschner ,  Peter Roth

    IPC分类号： H01L31/0224

    CPC分类号： H01L31/02245 ,  H01L31/022458 ,  Y02E10/50

    摘要： A method for producing an MWT-PERC solar cell is provided, in which openings in the substrate of the solar cell have contact passages and emitter regions that are present on the back side of the solar cell are completely removed outside the contact passages and a dielectric layer is applied on the back side, whereby a paste, which does not act in an electrically contacting manner opposite the substrate, is used for the contact passages.

    摘要翻译： 提供了一种制造MWT-PERC太阳能电池的方法，其中太阳能电池基板中的开口具有接触通道，并且存在于太阳能电池的背面上的发射极区域在接触通道外完全除去，并且电介质 在背面施加层，由此将不与基板相反的以电接触方式起作用的糊状物用于接触通道。

    Method for producing a metal contact on a coated semiconductor substrate
    2.
    发明授权
    Method for producing a metal contact on a coated semiconductor substrate 失效
    在涂覆的半导体衬底上制造金属接触的方法

    公开(公告)号：US08481419B2

    公开(公告)日：2013-07-09

    申请号：US13125815

    申请日：2009-11-26

    申请人： Jorg Horzel ,  Gunnar Schubert ,  Stefan Dauwe ,  Peter Roth ,  Tobias Droste ,  Wilfried Schmidt ,  Ingrid Ernst

    发明人： Jorg Horzel ,  Gunnar Schubert ,  Stefan Dauwe ,  Peter Roth ,  Tobias Droste ,  Wilfried Schmidt ,  Ingrid Ernst

    IPC分类号： H01L21/4763

    CPC分类号： H01L31/022425 ,  H01L31/068 ,  Y02E10/547

    摘要： A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate.

    摘要翻译： 一种在半导体元件上制造导电金属接触的方法，该半导体元件在半导体衬底的表面上具有涂层。 为了保持转印阻力低，同时保持良好的机械强度，本发明提出将含颗粒的流体施加到涂层上，其中颗粒至少含有金属颗粒和玻璃料，固化流体同时在基板中形成金属区域，通过 热处理，去除固化的流体和被流体覆盖的涂层的区域，并且为了形成接触而不使用中间层，沉积，将导电材料从溶液导电到半导体组件的其中涂层是 同时导电地连接存在于基板上的所述区域中的金属区域。

    METHOD FOR PRODUCING A METAL CONTACT ON A SEMICONDUCTOR SUBSTRATE PROVIDED WITH A COATING
    4.
    发明申请
    METHOD FOR PRODUCING A METAL CONTACT ON A SEMICONDUCTOR SUBSTRATE PROVIDED WITH A COATING 失效
    在用涂料提供的半导体衬底上生产金属接触的方法

    公开(公告)号：US20110201196A1

    公开(公告)日：2011-08-18

    申请号：US13125815

    申请日：2009-11-26

    申请人： Jorg Horzel ,  Gunnar Schubert ,  Stefan Dauwe ,  Peter Roth ,  Tobias Droste ,  Wilfried Schmidt ,  Ingrid Ernst

    发明人： Jorg Horzel ,  Gunnar Schubert ,  Stefan Dauwe ,  Peter Roth ,  Tobias Droste ,  Wilfried Schmidt ,  Ingrid Ernst

    IPC分类号： H01L21/288

    CPC分类号： H01L31/022425 ,  H01L31/068 ,  Y02E10/547

    摘要： A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate.

    摘要翻译： 一种在具有在半导体衬底的表面上具有涂层的半导体部件上制造导电金属接触的方法。 为了保持转印阻力低，同时保持良好的机械强度，本发明提出将含颗粒的流体施加到涂层上，其中颗粒至少含有金属颗粒和玻璃料，固化流体同时在基板中形成金属区域，通过 热处理，去除固化的流体和被流体覆盖的涂层的区域，并且为了形成接触而不使用中间层，沉积，将导电材料从溶液导电到半导体组件的其中涂层是 同时导电地连接存在于基板上的所述区域中的金属区域。