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1.发明授权Method for electroplating using stabilized dispersions of conductive particles 失效使用稳定的导电颗粒分散体进行电镀的方法
公开(公告)号：US6039859A
公开(公告)日：2000-03-21
申请号：US82437
申请日：1998-05-20
摘要： The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic--lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
摘要翻译： 本发明涉及用于不同目的的导电分散体，例如用于电镀非导体的基底。 分散体的特征在于使用稳定剂量的具有重复的烯丙基氧基基团和亲水 - 亲油平衡的稳定剂超过12个。已经发现，用于本发明组合物中的稳定剂确实导致显着的导电性损失 由分散体形成的涂层。
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公开(公告)号：US5800739A
公开(公告)日：1998-09-01
申请号：US626636
申请日：1996-04-11
摘要： The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic-lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.
摘要翻译： 本发明涉及用于不同目的的导电分散体，例如用于电镀非导体的基底。 分散体的特征在于使用稳定剂量的具有重复的烯丙基氧基基团和亲水 - 亲油平衡的稳定剂超过12个。已经发现，用于本发明组合物中的稳定剂确实导致显着的导电性损失 由分散体形成的涂层。
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公开(公告)号：US5667662A
公开(公告)日：1997-09-16
申请号：US625126
申请日：1996-04-01
CPC分类号： C25D5/54 , H05K3/424 , Y10S205/92
摘要： A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer containing a polymeric stabilizer having repeating alkylene oxide groups and a hydrophilic--lipophilic balance of at least 10.
摘要翻译： 一种用于电镀非导电衬底的方法，包括在非导电衬底的表面上形成导电聚合物膜并在其上电解金属沉积。 导电膜是通过将所述导电聚合物从所述聚合物的水性悬浮液沉积到所述表面上而形成的，所述聚合物含有具有重复环氧烷基团和亲水 - 亲油平衡的至少10重量份的聚合物稳定剂。
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公开(公告)号：US6017967A
公开(公告)日：2000-01-25
申请号：US626671
申请日：1996-04-01
申请人： Egon Matijevic , Matthias Schultz , Wade Sonnenberg , John J. Bladon , Patrick J. Houle , Thong B. Luong
发明人： Egon Matijevic , Matthias Schultz , Wade Sonnenberg , John J. Bladon , Patrick J. Houle , Thong B. Luong
摘要： The invention relates to a metal sulfide dispersion used for electroplating nonconductors such as substrates used for the formation of a printed circuit board. A printed circuit board made using the dispersion could have metallized through-holes comprising electrodeposited copper on the walls of the holes with an adsorbed layer of metal sulfide particles between the circuit board base material and the copper on the walls of the through-holes. The metal sulfide is characterized by spherical particles having a mean diameter of less than 100 nanometers and a particle size distribution where less than 10 percent of the particles within the dispersion have a diameter twice that of the mean diameter of all particles within the dispersion.
摘要翻译： 本发明涉及用于电镀非导体（例如用于形成印刷电路板的基板）的金属硫化物分散体。 使用分散体制成的印刷电路板可以在电路板基材和通孔壁上的铜之间，在孔的壁上具有包含电沉积铜的金属化通孔和金属硫化物颗粒的吸附层。 金属硫化物的特征在于平均直径小于100纳米的球形颗粒和分散体内少于10％的颗粒的直径是分散体内所有颗粒的平均直径的两倍的粒度分布。
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5.发明授权Conductive polymer colloidal compositions with selectivity for non-conductive surfaces 有权导电聚合物胶体组合物，对非导电表面具有选择性公开(公告)号：US06899829B2
公开(公告)日：2005-05-31
申请号：US09998117
申请日：2001-11-30
摘要： A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
摘要翻译： 导电聚合物胶体组合物，其选择性地在非导电表面上形成涂层。 导电聚合物胶体组合物由聚合物和磺酸盐掺杂剂组成。 导电聚合物胶体组合物还可以含有导电胶体颗粒，例如导电碳或金属盐颗粒，氧化剂，稳定剂和防腐剂。 可以使用导电聚合物胶体组合物来选择性地涂覆印刷线路板的非导电部分，使得可以在导电聚合物涂层上沉积均匀的金属层。 除了在导电聚合物上形成均匀的金属层之外，还提高了金属层和印刷线路板之间的粘附性。
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公开(公告)号：US06440642B1
公开(公告)日：2002-08-27
申请号：US09397301
申请日：1999-09-15
IPC分类号： G03F7004
CPC分类号： G03F7/038 , H01B3/30 , H01B3/40 , H05K3/4661 , H05K2201/015 , H05K2201/0154 , H05K2201/0158 , Y10S428/901 , Y10T428/31504
摘要： Low VOC, dielectric compositions suitable for use in circuit board manufacture are disclosed. Also disclosed are methods of making circuit boards using the low VOC, dielectric compositions.
摘要翻译： 公开了适用于电路板制造的低VOC介电组合物。 还公开了制造使用低VOC电介质组合物的电路板的方法。
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公开(公告)号：US06123995A
公开(公告)日：2000-09-26
申请号：US36235
申请日：1998-03-06
CPC分类号： H05K3/424
摘要： A method of providing an electrically conductive polymer coating on a copper clad circuit board prior to electroplating is disclosed. The method teaches the application of certain organic solvents to a conductive polymer composition already applied to the board but before drying the conductive polymer composition to remove liquids therefrom to form a conductive polymer film.
摘要翻译： 公开了一种在电镀之前在铜包覆电路板上提供导电聚合物涂层的方法。 该方法教导了将某些有机溶剂应用于已经施加到板上的导电聚合物组合物，但是在干燥导电聚合物组合物以从其中除去液体以形成导电聚合物膜之前。
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8.发明授权Electroplating composition and process for plating through holes in printed circuit boards 失效电镀组合物和电镀印刷电路板上的孔的方法
公开(公告)号：US4897165A
公开(公告)日：1990-01-30
申请号：US235051
申请日：1988-08-23
CPC分类号： C25D3/38 , H05K3/42 , H05K3/423 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.Also disclosed is a device for measuring throwing power of a plating solution. The device comprises two anodes and a cathode suspended in a chamber adapted to contain a plating solution. The cathode is suspended between said anodes and comprises two flat electrode portions in electrical contact with each other, in parallel relationship to each other and spaced apart from each other to define a space containing plating solution. Each of said flat electrode portions has electrode portions electrically isolated from a center electrode and means for measuring the current on said first electrode portions and center electrode.
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公开(公告)号：US5051154A
公开(公告)日：1991-09-24
申请号：US471381
申请日：1990-01-29
CPC分类号： H05K3/42 , C25D3/38 , H05K3/423 , H05K2203/162
摘要： The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.
摘要翻译： 本发明公开了使用酸性镀铜浴的添加剂，其基于产生电镀液的电荷转移超电位的变化的标准来选择; 或者替代地，在高宽比电路板的表面和这种板的凹部之间产生差分超电势。 添加剂可以是单组分或多组分添加剂。
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10.发明授权Method and apparatus for determining throwing power of an electroplating solution 失效用于确定电镀溶液的投射功率的方法和装置
公开(公告)号：US4932518A
公开(公告)日：1990-06-12
申请号：US438021
申请日：1989-11-20
CPC分类号： H05K3/42 , C25D3/38 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
摘要翻译： 一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以每升溶液约1至10克的浓度存在，并且所述酸以浓度存在，其中酸 铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。
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