System for patterning flexible foils
    2.
    发明授权
    System for patterning flexible foils 有权
    柔性箔图案系统

    公开(公告)号:US08570491B2

    公开(公告)日:2013-10-29

    申请号:US12919966

    申请日:2009-02-27

    摘要: According to one aspect, the invention provides a table for compensating deformation in flexible foils (1) The table comprises a supportive base (2) and a deformation compensation system (3). This system comprises a plurality of movable elements (4), supported by the base (2), wherein the movable elements form a surface for supporting the flexible foil. The movable elements comprise clamps (6) for clamping the foil (5). The movable elements (4) are individually movable parallel to the surface for supporting the foil, so as to stretch the clamped foil into a predefined shape. The table for compensating deformation in flexible foils may be used in a manufacturing process of flexible functional foils to compensate deformation of the foils during sequential patterning.

    摘要翻译: 根据一个方面,本发明提供了一种用于补偿柔性箔中的变形的表(1)。该表包括支撑基座(2)和变形补偿系统(3)。 该系统包括由基部(2)支撑的多个可移动元件(4),其中可移动元件形成用于支撑柔性箔片的表面。 可移动元件包括用于夹紧箔片(5)的夹具(6)。 可移动元件(4)能够平行于用于支撑箔片的表面移动,从而将夹持的箔片拉伸成预定形状。 用于补偿柔性箔中的变形的表可以用于柔性功能箔的制造过程中,以在顺序图案化期间补偿箔的变形。

    Measuring the bonding of bonded substrates
    7.
    发明申请
    Measuring the bonding of bonded substrates 审中-公开
    测量粘合基材的粘结

    公开(公告)号:US20080083818A1

    公开(公告)日:2008-04-10

    申请号:US11544000

    申请日:2006-10-06

    IPC分类号: B23K31/00

    CPC分类号: B23K31/02 B23K2101/40

    摘要: A method of measuring bonding quality of a bonded substrate having an upper substrate on top of a lower substrate, the method comprising etching one or more windows in the upper substrate such that overlay measurement alignment marks on the upper substrate may be seen by a measurement system and overlay measurement alignment marks on the lower substrate may be seen by the measurement system, using the measurement system to measure the positions of the overlay measurement alignment marks, determining the distance between corresponding overlay measurement alignment marks on the upper and lower substrates, and adjusting the determined distance to take into account an offset between the overlay measurement alignment marks on the upper substrate and the overlay measurement alignment marks on the lower substrate.

    摘要翻译: 一种在下基板的顶部测量具有上基板的键合衬底的接合质量的方法,所述方法包括蚀刻上衬底中的一个或多个窗口,使得可通过测量系统看到上衬底上的覆盖测量对准标记 并且通过测量系统可以看到下部基板上的覆盖测量对准标记,使用测量系统来测量覆盖测量对准标记的位置,确定上和下基板上相应的覆盖测量对准标记之间的距离,以及调整 考虑到上基板上的覆盖测量对准标记与下基板上的覆盖测量对准标记之间的偏移的确定的距离。