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    Measuring the bonding of bonded substrates
    1.
    发明申请
    Measuring the bonding of bonded substrates 审中-公开
    测量粘合基材的粘结

    公开(公告)号：US20080083818A1

    公开(公告)日：2008-04-10

    申请号：US11544000

    申请日：2006-10-06

    申请人： Keith Frank Best ,  Cheng-Qun Gui ,  Budiman Sutedja ,  Wilhelmus Johannes Maria De Laat

    发明人： Keith Frank Best ,  Cheng-Qun Gui ,  Budiman Sutedja ,  Wilhelmus Johannes Maria De Laat

    IPC分类号： B23K31/00

    CPC分类号： B23K31/02 ,  B23K2101/40

    摘要： A method of measuring bonding quality of a bonded substrate having an upper substrate on top of a lower substrate, the method comprising etching one or more windows in the upper substrate such that overlay measurement alignment marks on the upper substrate may be seen by a measurement system and overlay measurement alignment marks on the lower substrate may be seen by the measurement system, using the measurement system to measure the positions of the overlay measurement alignment marks, determining the distance between corresponding overlay measurement alignment marks on the upper and lower substrates, and adjusting the determined distance to take into account an offset between the overlay measurement alignment marks on the upper substrate and the overlay measurement alignment marks on the lower substrate.

    摘要翻译： 一种在下基板的顶部测量具有上基板的键合衬底的接合质量的方法，所述方法包括蚀刻上衬底中的一个或多个窗口，使得可通过测量系统看到上衬底上的覆盖测量对准标记 并且通过测量系统可以看到下部基板上的覆盖测量对准标记，使用测量系统来测量覆盖测量对准标记的位置，确定上和下基板上相应的覆盖测量对准标记之间的距离，以及调整 考虑到上基板上的覆盖测量对准标记与下基板上的覆盖测量对准标记之间的偏移的确定的距离。

    Lithographic apparatus and device manufacturing method
    2.
    发明授权
    Lithographic apparatus and device manufacturing method 有权
    平版印刷设备和器件制造方法

    公开(公告)号：US07567340B2

    公开(公告)日：2009-07-28

    申请号：US11529732

    申请日：2006-09-29

    申请人： Cheng-Qun Gui ,  Keith Frank Best ,  Enno Van Den Brink ,  Budiman Sutedja ,  Peter Ten Berge

    发明人： Cheng-Qun Gui ,  Keith Frank Best ,  Enno Van Den Brink ,  Budiman Sutedja ,  Peter Ten Berge

    IPC分类号： G03B27/58 ,  G03B27/52

    CPC分类号： G03F7/70333 ,  G03F7/703

    摘要： A device manufacturing method is disclosed that includes providing a substrate on a substrate table, the substrate having a target region comprising a plurality of generally planar surfaces, each surface having a different height relative to the substrate table, determining the relative heights of each generally planar surface, projecting a patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of one of the generally planar surfaces, moving the substrate table in a direction substantially parallel to the axis of the beam, and projecting the patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of another of the generally planar surfaces.

    摘要翻译： 公开了一种器件制造方法，其包括在衬底台上提供衬底，所述衬底具有包括多个大体上平坦的表面的目标区域，每个表面相对于衬底台具有不同的高度，确定每个大致平面的相对高度 将图案化的辐射束投影到基板的目标区域上，使得光束的焦平面基本上与大体上平坦的表面之一的平面重合，使基板台沿基本上平行于基板平面的方向移动 并且将所述图案化的辐射束投影到所述基板的目标区域上，使得所述光束的焦平面基本上与所述大体上平坦的表面中的另一个的平面重合。

    Lithographic apparatus and device manufacturing method
    3.
    发明申请
    Lithographic apparatus and device manufacturing method 有权
    平版印刷设备和器件制造方法

    公开(公告)号：US20080085462A1

    公开(公告)日：2008-04-10

    申请号：US11529732

    申请日：2006-09-29

    申请人： Keith Frank Best ,  Enno Van Den Brink ,  Cheng-Qun Gui ,  Budiman Sutedja ,  Peter Ten Berge

    发明人： Keith Frank Best ,  Enno Van Den Brink ,  Cheng-Qun Gui ,  Budiman Sutedja ,  Peter Ten Berge

    IPC分类号： G03C5/00

    CPC分类号： G03F7/70333 ,  G03F7/703

    摘要： A device manufacturing method is disclosed that includes providing a substrate on a substrate table, the substrate having a target region comprising a plurality of generally planar surfaces, each surface having a different height relative to the substrate table, determining the relative heights of each generally planar surface, projecting a patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of one of the generally planar surfaces, moving the substrate table in a direction substantially parallel to the axis of the beam, and projecting the patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of another of the generally planar surfaces.

    摘要翻译： 公开了一种器件制造方法，其包括在衬底台上提供衬底，所述衬底具有包括多个大体上平坦的表面的目标区域，每个表面相对于衬底台具有不同的高度，确定每个大致平面的相对高度 将图案化的辐射束投影到基板的目标区域上，使得光束的焦平面基本上与大体上平坦的表面之一的平面重合，使基板台沿基本上平行于基板平面的方向移动 并且将所述图案化的辐射束投影到所述基板的目标区域上，使得所述光束的焦平面基本上与所述大体上平坦的表面中的另一个的平面重合。