Adjustable box wrench
    5.
    发明授权
    Adjustable box wrench 失效
    可调式手扳手

    公开(公告)号:US5988024A

    公开(公告)日:1999-11-23

    申请号:US785655

    申请日:1997-01-17

    IPC分类号: B25B13/14 B25B13/16

    CPC分类号: B25B13/14 B25B13/16

    摘要: An improved adjustable box wrench having a mouth (9) with a plurality of gripping surfaces (27, 31, 32) for surrounding a nut, bolt or the like. A movable jaw (5) allows the size of the mouth to be altered when a worm screw (8) is turned. The worm screw (8) has gear (24) which fit between teeth (20) in an arm (4) extending from the movable jaw (5). The adjustment arm (4) and worm screw (8) fit into cavities (14, 17) in the wrench body (1). Increased lateral support for the movable jaw is provided by protrusions (19) on each side (21) of the jaw which fit into and move longitudinally within channels (26) in fixed gripping surfaces (32) on opposite sides of the mouth (9). A removable closure plate (6) covers the adjustment arm (4) and the worm screw (8) and facilitates assembly of the wrench and disassembly for repair or other purposes.

    摘要翻译: 一种改进的可调式盒式扳手,其具有带有多个用于包围螺母,螺栓等的多个夹紧表面(27,31,32)的口部(9)。 当可旋转的蜗杆(8)转动时,活动夹爪(5)允许改变口腔的尺寸。 蜗杆(8)具有装配在从可动夹爪(5)延伸的臂(4)中的齿(20)之间的齿轮(24)。 调节臂(4)和蜗杆(8)装配在扳手主体(1)中的空腔(14,17)中。 对于可动钳口的增加的侧向支撑由钳口的每一侧(21)上的突起(19)提供,所述突起(19)在口(9)的相对侧上的固定抓握表面(32)中的通道(26)内纵向配合并纵向移动, 。 可拆卸的封闭板(6)覆盖调节臂(4)和蜗杆(8),并且便于组装扳手和拆卸以进行修理或其它目的。

    Semiconductor package having integrated metal parts for thermal enhancement
    6.
    发明授权
    Semiconductor package having integrated metal parts for thermal enhancement 失效
    具有用于热增强的集成金属部件的半导体封装

    公开(公告)号:US07084494B2

    公开(公告)日:2006-08-01

    申请号:US10871645

    申请日:2004-06-18

    IPC分类号: H01L23/34

    摘要: A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

    摘要翻译: 一种半导体器件,包括具有第一表面(103a)和第二表面(103b)的金属引线框架(103)。 引线框架包括芯片焊盘(104)和多个段(107); 所述芯片垫由多个带(105)保持,其中每个带具有凹槽(106)。 芯片(101)安装在芯片焊盘上并电连接到段上。 散热器(110)设置在引线框架的第一表面上; 散热器具有在芯片连接件(108)上方间隔开的中心部分(110a),并且还具有从中心部分的边缘向外延伸的定位构件(110b),使得它们搁置在带的凹槽中。 封装材料围绕芯片,电连接和扩展器定位构件,并且填充扩展器和芯片之间的空间,同时使第二引线框表面和中心扩展器部分露出。

    Thermally enhanced single inline package (SIP)
    9.
    发明授权
    Thermally enhanced single inline package (SIP) 有权
    热增强型单列直插封装(SIP)

    公开(公告)号:US08053285B2

    公开(公告)日:2011-11-08

    申请号:US12565976

    申请日:2009-09-24

    IPC分类号: H01L21/44 H01L21/48 H01L21/50

    摘要: In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330).

    摘要翻译: 在用于制造热增强型半导体器件(200,300)的方法和系统中,封装为通孔单列直插封装(SIP)。 具有用于连接IC管芯(230,330)的管芯焊盘(220,320,420)的引线框架(210,310,410),由第一部分形成的第一多个导电引线(240,340,430) 金属片(432)和设置在作为第一多个导电引线的IC管芯(230,330)的相反侧的金属片(440)的第二部分从金属片冲压。 第一多个导电引线(240,340,430)被布置成单根线,并且能够根据SIP而通孔安装。 金属片(440)的第二部分包括模板(420),以形成呈金属片形式的散热器(260,360)。 散热器(260,360)为由IC芯片(230,330)产生的热提供散热。

    Adjustable box wrench
    10.
    发明授权
    Adjustable box wrench 失效
    可调式手扳手

    公开(公告)号:US06240814B1

    公开(公告)日:2001-06-05

    申请号:US09444681

    申请日:1999-11-22

    IPC分类号: B25B1316

    CPC分类号: B25B13/14 B25B13/16

    摘要: An improved adjustable box wrench having a mouth (9) with a plurality of gripping surfaces (27, 31, 32) for surrounding a nut, bolt or the like. A movable jaw (5) allows the size of the mouth to be altered when a worm screws (8) is turned. The worm screw (8) has gear (24) which fit between teeth (20) in an arm (4) extending from the movable jaw (5). The adjustment arm (4) and worm screw (8) fit into cavities (14, 17) in the wrench body (1). Increased lateral support for the movable jaw is provided by at least one protrusion (19) on a side (21) of the jaw which fits into and moves longitudinally within at least one channel or groove (26) in fixed gripping surfaces (32) on opposite sides of the mouth (9). At least one removal slot (33) is provided to enable assembly and disassembly of the at least one protrusion (19) into the at least one channel or groove (26). A removable closure plate (6) covers the adjustment arm (4) and the worm screw (8) and facilitates assembly of the wrench and disassembly for repair or other purposes.

    摘要翻译: 一种改进的可调式盒式扳手,其具有带有多个用于包围螺母,螺栓等的多个夹紧表面(27,31,32)的口部(9)。 当可旋转的蜗杆(8)转动时,可移动的钳口(5)允许改变口腔的尺寸。 蜗杆(8)具有装配在从可动夹爪(5)延伸的臂(4)中的齿(20)之间的齿轮(24)。 调节臂(4)和蜗杆(8)装配在扳手主体(1)中的空腔(14,17)中。 增加的可移动钳口的侧向支撑由钳口的侧面(21)上的至少一个突起(19)提供,所述突起(19)装配在固定的抓握表面(32)中的至少一个通道或凹槽(26)中并纵向移动 嘴的对面(9)。 提供至少一个移除槽(33)以使得能够将至少一个突起(19)组装和拆卸到至少一个通道或凹槽(26)中。 可拆卸的封闭板(6)覆盖调节臂(4)和蜗杆(8),并且便于组装扳手和拆卸以进行修理或其它目的。