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    Semiconductor package having integrated metal parts for thermal enhancement
    1.
    发明授权
    Semiconductor package having integrated metal parts for thermal enhancement 失效
    具有用于热增强的集成金属部件的半导体封装

    公开(公告)号：US07084494B2

    公开(公告)日：2006-08-01

    申请号：US10871645

    申请日：2004-06-18

    申请人： Anthony L. Coyle ,  William D. Boyd ,  Chris Haga ,  Leland S. Swanson

    发明人： Anthony L. Coyle ,  William D. Boyd ,  Chris Haga ,  Leland S. Swanson

    IPC分类号： H01L23/34

    CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

    摘要翻译： 一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。 引线框架包括芯片焊盘（104）和多个段（107）; 所述芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。 芯片（101）安装在芯片焊盘上并电连接到段上。 散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。 封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。

    Semiconductor package having integrated metal parts for thermal enhancement
    2.
    发明申请
    Semiconductor package having integrated metal parts for thermal enhancement 失效
    具有用于热增强的集成金属部件的半导体封装

    公开(公告)号：US20050280124A1

    公开(公告)日：2005-12-22

    申请号：US10871645

    申请日：2004-06-18

    申请人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

    发明人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

    IPC分类号： H01L23/433 ,  H01L23/495

    CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

    摘要翻译： 一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。 引线框架包括芯片焊盘（104）和多个段（107）; 芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。 芯片（101）安装在芯片焊盘上并电连接到段上。 散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。 封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。

    Thermally enhanced BGA package with ground ring
    3.
    发明授权
    Thermally enhanced BGA package with ground ring 有权
    具有接地环的热增强型BGA封装

    公开(公告)号：US07498203B2

    公开(公告)日：2009-03-03

    申请号：US11407836

    申请日：2006-04-20

    申请人： Chris Haga ,  Leland Swanson

    发明人： Chris Haga ,  Leland Swanson

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： H01L23/50 ,  H01L21/563 ,  H01L23/24 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01057 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00

    摘要： The invention provides thermally enhanced BGAs and methods for their fabrication with a ground ring suitable for operably coupling to either the frontside or backside, or both, of an IC chip mounted on a substrate. The methods and devices of the invention disclosed include the fabrication of a ground ring on the surface of a BGA substrate prepared for receiving the frontside of the chip. A heat spreader has ground ring corresponding to substrate round ring and is attached at the backside of the chip with a conductive material. A conductive material is interposed between the heat spreader and substrate ground rings, electrically coupling them. Thus, the backside of the chip may be electrically connected to the ground ring as well as, or instead of, the frontside.

    摘要翻译： 本发明提供了热增强的BGA及其制造方法，该接地环适用于可操作地耦合到安装在基板上的IC芯片的前侧或后侧或两者。 所公开的本发明的方法和装置包括在准备接收芯片前侧的BGA衬底的表面上制造接地环。 散热器具有对应于衬底圆环的接地环，并且用导电材料附接在芯片的背面。 在散热器和基板接地环之间插入导电材料，将它们电耦合。 因此，芯片的背面可以电连接到接地环，也可以或者代替前端。

    Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement
    5.
    发明申请
    Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement 审中-公开
    具有集成金属部件用于热增强的半导体封装

    公开(公告)号：US20060226521A1

    公开(公告)日：2006-10-12

    申请号：US11426166

    申请日：2006-06-23

    申请人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

    发明人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

    IPC分类号： H01L23/495

    CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

    摘要翻译： 一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。 引线框架包括芯片焊盘（104）和多个段（107）; 芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。 芯片（101）安装在芯片焊盘上并电连接到段上。 散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。 封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。

    Thermally enhanced BGA package with ground ring
    7.
    发明申请
    Thermally enhanced BGA package with ground ring 有权
    具有接地环的热增强型BGA封装

    公开(公告)号：US20070246823A1

    公开(公告)日：2007-10-25

    申请号：US11407836

    申请日：2006-04-20

    申请人： Chris Haga ,  Leland Swanson

    发明人： Chris Haga ,  Leland Swanson

    IPC分类号： H01L23/34

    CPC分类号： H01L23/50 ,  H01L21/563 ,  H01L23/24 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01057 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00

    摘要： The invention provides thermally enhanced BGAs and methods for their fabrication with a ground ring suitable for operably coupling to either the frontside or backside, or both, of an IC chip mounted on a substrate. The methods and devices of the invention disclosed include the fabrication of a ground ring on the surface of a BGA substrate prepared for receiving the frontside of the chip. A heat spreader has ground ring corresponding to substrate round ring and is attached at the backside of the chip with a conductive material. A conductive material is interposed between the heat spreader and substrate ground rings, electrically coupling them. Thus, the backside of the chip may be electrically connected to the ground ring as well as, or instead of, the frontside.

    摘要翻译： 本发明提供了热增强的BGA及其制造方法，该接地环适用于可操作地耦合到安装在基板上的IC芯片的前侧或后侧或两者。 所公开的本发明的方法和装置包括在准备接收芯片前侧的BGA衬底的表面上制造接地环。 散热器具有对应于衬底圆环的接地环，并且用导电材料附接在芯片的背面。 在散热器和基板接地环之间插入导电材料，将它们电耦合。 因此，芯片的背面可以电连接到接地环，也可以或者代替前端。