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公开(公告)号：US11101148B2
公开(公告)日：2021-08-24
申请号：US15779519
申请日：2016-03-18
发明人： Sophia Wen , Zhikai Wang
摘要： A semiconductor processing apparatus is provided. The apparatus includes a body portion, which includes at least one semiconductor processing unit that has a recess formed on an upper surface of the body portion, wherein a bottom surface of the recess has at least one location and a peripheral. The bottom surface ascends from the at least one location toward the peripheral against a direction of gravity or descends from the at least one location toward the peripheral following the direction of gravity. Each semiconductor processing unit also includes a first channel that connects to the recess at the at least one location, and at least one second channel connecting to the recess at the peripheral. Each of the first and second channels serves as an inlet or an outlet via which a fluid enters or exits the recess.
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公开(公告)号：US10586717B2
公开(公告)日：2020-03-10
申请号：US15779514
申请日：2015-12-21
发明人： Sophia Wen , Zhikai Wang
IPC分类号： H01L21/67 , H01L21/673 , H01L21/677 , H01L21/02 , H01L21/687 , H01L21/683
摘要： A semiconductor processing apparatus is provided. The apparatus includes a first chamber portion and a second chamber portion movable relative to the first chamber portion between an open position and a closed position. The first chamber portion includes a recessed area formed on an internal surface of the first chamber portion. The first chamber portion also includes one or more through-holes connected to respective locations of the recessed area. When the second chamber portion is in the closed position and a semiconductor wafer is housed in the micro chamber, the recessed area is sealed by a surface of the semiconductor wafer to form a closed channel. The surface may be processed by a processing fluid flowing in the closed channel. Accordingly, a flowing direction and a flowing speed of the processing fluid may be accurately controlled, and an amount of the processing fluid consumed may be greatly reduced.
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公开(公告)号：US10196172B2
公开(公告)日：2019-02-05
申请号：US15125584
申请日：2015-03-10
发明人： Sophia Wen
IPC分类号： B65D8/02 , B65D6/00 , B29C45/00 , B65D6/34 , B65D1/20 , B65D1/16 , B29L31/00 , B29C65/00 , B29C65/02
摘要： The present disclosure provides a chemical container and a method for manufacturing the same. The chemical container comprises a head portion having a top wall and a head sidewall extending from an edge of the top wall, as well as a body portion jointed with the head portion and defining a chamber together with the head portion. The top wall has a mouth structure configured for one or more pipelines to pass through and connect with the chamber. The manufacturing method is simple and of low cost, and the resulted chemical container is able to withstand a greater internal pressure and is configured to collect any leaking liquid chemicals.
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公开(公告)号：US20200243349A1
公开(公告)日：2020-07-30
申请号：US16848011
申请日：2020-04-14
发明人： Sophia Wen , Zhikai Wang
摘要： A semiconductor processing apparatus is provided. The apparatus includes a body portion, which includes at least one semiconductor processing unit. Each semiconductor processing unit includes a recess formed on an upper surface of the body portion, wherein a bottom surface of the recess has at least one location and a peripheral. The bottom surface ascends from the at least one location toward the peripheral against a direction of gravity or descends from the at least one location toward the peripheral following the direction of gravity. Each semiconductor processing unit also includes a first channel that connects to the recess at the at least one location, as well as at least one second channel connecting to the recess at the peripheral. Each of the first channel and the at least one second channel serves as an inlet or an outlet via which a fluid enters or exits the recess. A method according to the present disclosure may control a flowing direction of a fluid flowing across a substrate surface. When the fluid flow as programmed, the fluid may contact the substrate surface and process the surface via various physical and/or chemical reactions.
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公开(公告)号：US20190071212A1
公开(公告)日：2019-03-07
申请号：US16182412
申请日：2018-11-06
发明人： Sophia Wen
IPC分类号： B65D8/02
摘要： The present disclosure provides a chemical container and a method for manufacturing the same. The chemical container comprises a head portion having a top wall and a head sidewall extending from an edge of the top wall, as well as a body portion jointed with the head portion and defining a chamber together with the head portion. The top wall has a mouth structure configured for one or more pipelines to pass through and connect with the chamber. The manufacturing method is simple and of low cost, and the resulted chemical container is able to withstand a greater internal pressure and is configured to collect any leaking liquid chemicals.
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6.发明申请公开(公告)号：US20170271147A1
公开(公告)日：2017-09-21
申请号：US15503682
申请日：2015-07-29
发明人： Sophia WEN , Nitao ZHANG
CPC分类号： H01L21/02052 , B08B3/08 , B08B3/14 , B08B2203/005 , H01L21/02233 , H01L21/205 , H01L21/67023 , H01L21/67051
摘要： An apparatus and a method for processing one or more surfaces of a semiconductor wafer with one or more ozone-containing fluids are provided. The apparatus includes an ozone generator, a solvent flask, a gas-liquid mixing device, and a processing chamber capable of receiving the semiconductor wafer. The apparatus may also include one or more gas-liquid separation devices and switching valves. The processing chamber allows the ozone-containing fluids to enter the processing chamber for treating the wafer surface. The effectiveness of the treatment is ensured by enhancing the ozone concentration of the ozone-containing fluids inside the processing chamber, in either or both gas and liquid phases. The employment of a micro chamber as the processing chamber also helps to reduce the consumption of the treatment gas and liquid, as well as the resulted waste emission.
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公开(公告)号：US20160376056A1
公开(公告)日：2016-12-29
申请号：US15125584
申请日：2015-03-10
发明人： Sophia Wen
CPC分类号： B65D11/08 , B29C45/0053 , B29C65/02 , B29C66/1142 , B29C66/54 , B29C66/543 , B29C66/71 , B29L2031/712 , B29L2031/7154 , B29L2031/7156 , B65D1/16 , B65D1/20 , B65D11/22 , Y10S220/01 , B29K2023/12 , B29K2027/18 , B29K2027/16 , B29K2027/12
摘要： The present disclosure provides a chemical container and a method for manufacturing the same. The chemical container comprises a head portion having a top wall and a head sidewall extending from an edge of the top wall, as well as a body portion jointed with the head portion and defining a chamber together with the head portion. The top wall has a mouth structure configured for one or more pipelines to pass through and connect with the chamber. The manufacturing method is simple and of low cost, and the resulted chemical container is able to withstand a greater internal pressure and is configured to collect any leaking liquid chemicals.
摘要翻译： 本公开提供了一种化学容器及其制造方法。 化学容器包括具有从顶壁的边缘延伸的顶壁和头侧壁的头部，以及与头部连接并与头部一起限定室的主体部分。 顶壁具有构造成用于一个或多个管道通过并与腔室连接的口部结构。 该制造方法简单且成本低，所得到的化学容器能够承受更大的内部压力并且构造成收集任何泄漏的液体化学品。
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公开(公告)号：US20190035644A1
公开(公告)日：2019-01-31
申请号：US15779519
申请日：2016-03-18
发明人： Sophia Wen , Zhikai Wang
摘要： A semiconductor processing apparatus is provided. The apparatus includes a body portion, which includes at least one semiconductor processing unit. Each semiconductor processing unit includes a recess formed on an upper surface of the body portion, wherein a bottom surface of the recess has at least one location and a peripheral. The bottom surface ascends from the at least one location toward the peripheral against a direction of gravity or descends from the at least one location toward the peripheral following the direction of gravity. Each semiconductor processing unit also includes a first channel that connects to the recess at the at least one location, as well as at least one second channel connecting to the recess at the peripheral. Each of the first channel and the at least one second channel serves as an inlet or an outlet via which a fluid enters or exits the recess.
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公开(公告)号：US20180350635A1
公开(公告)日：2018-12-06
申请号：US15779514
申请日：2015-12-21
发明人： Sophia Wen , Zhikai Wang
IPC分类号： H01L21/67 , H01L21/673 , H01L21/677
摘要： A semiconductor processing apparatus is provided. The apparatus includes a first chamber portion and a second chamber portion movable relative to the first chamber portion between an open position and a closed position. The first chamber portion includes a recessed area formed on an internal surface of the first chamber portion. The first chamber portion also includes one or more through-holes connected to respective locations of the recessed area. When the second chamber portion is in the closed position and a semiconductor wafer is housed in the micro chamber, the recessed area is sealed by a surface of the semiconductor wafer to form a closed channel. The surface may be processed by a processing fluid flowing in the closed channel. Accordingly, a flowing direction and a flowing speed of the processing fluid may be accurately controlled, and an amount of the processing fluid consumed may be greatly reduced.
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公开(公告)号：US11417542B2
公开(公告)日：2022-08-16
申请号：US16848011
申请日：2020-04-14
发明人： Sophia Wen , Zhikai Wang
摘要： A semiconductor processing apparatus is provided. The apparatus includes a body portion, which includes at least one semiconductor processing unit. Each semiconductor processing unit includes a recess formed on an upper surface of the body portion, wherein a bottom surface of the recess has at least one location and a peripheral. The bottom surface ascends from the at least one location toward the peripheral against a direction of gravity or descends from the at least one location toward the peripheral following the direction of gravity. Each semiconductor processing unit also includes a first channel that connects to the recess at the at least one location, as well as at least one second channel connecting to the recess at the peripheral. Each of the first channel and the at least one second channel serves as an inlet or an outlet via which a fluid enters or exits the recess. A method according to the present disclosure may control a flowing direction of a fluid flowing across a substrate surface. When the fluid flow as programmed, the fluid may contact the substrate surface and process the surface via various physical and/or chemical reactions.
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