公开(公告)号：US06958546B2

公开(公告)日：2005-10-25

申请号：US10437373

申请日：2003-05-13

申请人： Fu-Jier Fan ,  Cheng-Yu Chu ,  Kuo Wei Lin ,  Shih-Jang Lin ,  Yang-Tung Fran ,  Chiou-Shian Peng

发明人： Fu-Jier Fan ,  Cheng-Yu Chu ,  Kuo Wei Lin ,  Shih-Jang Lin ,  Yang-Tung Fran ,  Chiou-Shian Peng

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/48

CPC分类号： H01L24/11 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2224/05552

摘要： A new method and processing sequence is provided for the formation of solder bumps that are in contact with underlying aluminum contact pads. A patterned layer of negative photoresist is interposed between a patterned layer of PE Si3N4 and a patterned layer of polyamide insulator. The patterned negative photoresist partially overlays the aluminum contact pad and prevents contact between the layer of polyamide insulator and the aluminum contact pad. By forming this barrier no moisture that is contained in the polyamide insulator can come in contact with the aluminum contact pad, therefore no corrosion in the surface of the aluminum contact pad can occur.

摘要翻译： 提供了一种新的方法和处理顺序，用于形成与下面的铝接触焊盘接触的焊料凸块。 负型光致抗蚀剂的图案化层插入在PE 3 N 4 N 4的图案化层和聚酰胺绝缘体的图案化层之间。 图案化的负光致抗蚀剂部分覆盖铝接触垫，并防止聚酰胺绝缘体层与铝接触垫之间的接触。 通过形成该屏障，聚酰胺绝缘体中所含的水分不能与铝接触垫接触，因此铝接触垫的表面中不会发生腐蚀。