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    Chip on glass package
    3.
    发明授权
    Chip on glass package 有权
    芯片上的玻璃包装

    公开(公告)号：US07049689B2

    公开(公告)日：2006-05-23

    申请号：US10947176

    申请日：2004-09-23

    申请人： Ying-Tsai Yeh ,  Chih-Huang Chang ,  Yung Li Lu

    发明人： Ying-Tsai Yeh ,  Chih-Huang Chang ,  Yung Li Lu

    IPC分类号： H01L31/0203 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L23/40

    CPC分类号： G06K9/00053 ,  H01L27/14618 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A chip on glass package. A glass substrate has a top surface and a corresponding bottom surface. A plurality of chips are flip-chip mounted on the top surface of the glass substrate. The bottom surface of the glass substrate is secured to and electrically connected with a carrier. An encapsulation material is formed around the glass substrate to seal the chips. The encapsulation material has a cavity to expose the contact area of the top surface of the glass substrate. Therefore the chip on glass package is to possess a better protection and electrical connection of the glass substrate.

    摘要翻译： 玻璃包装芯片。 玻璃基板具有顶表面和相应的底表面。 多个芯片被倒装安装在玻璃基板的顶表面上。 玻璃基板的底面被固定并与载体电连接。 在玻璃基板周围形成密封材料以密封芯片。 封装材料具有用于暴露玻璃基板的顶表面的接触面积的空腔。 因此，玻璃封装上的芯片具有更好的玻璃基板的保护和电连接。

    Sensor chip packaging structure
    4.
    发明授权
    Sensor chip packaging structure 有权
    传感器芯片封装结构

    公开(公告)号：US07187067B2

    公开(公告)日：2007-03-06

    申请号：US11163869

    申请日：2005-11-02

    申请人： Gwo-Liang Weng ,  Yung-Li Lu ,  Ying-Tsai Yeh

    发明人： Gwo-Liang Weng ,  Yung-Li Lu ,  Ying-Tsai Yeh

    IPC分类号： H01L23/02

    CPC分类号： H01L27/14618 ,  G06K9/00013 ,  H01L24/73 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/10156 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A sensor chip for defining an exposed molding region is disclosed. The sensor chip includes a semiconductor chip and a metal dam bar protruding from the active surface of the semiconductor chip. The active surface of the semiconductor chip includes a sensing region and at least one bonding pad is disposed on the active surface. The metal dam bar separates the sensing region and the bonding pad to prevent contamination of the sensing region by the mold flash. Preferably, a step is formed on the periphery of the active surface of the semiconductor chip, such that the semiconductor chip includes a T-shaped profile. Additionally, the metal dam bar is extended to the step to form an enclosed ring thereby effectively defining an exposed molding region that contains the sensing region.

    摘要翻译： 公开了一种用于限定暴露的成型区域的传感器芯片。 传感器芯片包括从半导体芯片的有源表面突出的半导体芯片和金属阻挡条。 半导体芯片的有源表面包括感测区域，并且至少一个焊盘设置在有源表面上。 金属阻挡条分隔感测区域和接合焊盘，以防止模具闪光灯对感测区域的污染。 优选地，在半导体芯片的有源表面的周围形成台阶，使得半导体芯片包括T形轮廓。 此外，金属阻挡杆延伸到台阶以形成封闭的环，从而有效地限定包含感测区域的暴露的模制区域。

    Sensor chip packaging structure
    5.
    发明申请
    Sensor chip packaging structure 有权
    传感器芯片封装结构

    公开(公告)号：US20060091515A1

    公开(公告)日：2006-05-04

    申请号：US11163869

    申请日：2005-11-02

    申请人： Gwo-Liang Weng ,  Yung-Li Lu ,  Ying-Tsai Yeh

    发明人： Gwo-Liang Weng ,  Yung-Li Lu ,  Ying-Tsai Yeh

    IPC分类号： H01L23/02

    CPC分类号： H01L27/14618 ,  G06K9/00013 ,  H01L24/73 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/10156 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A sensor chip for defining an exposed molding region is disclosed. The sensor chip includes a semiconductor chip and a metal dam bar protruding from the active surface of the semiconductor chip. The active surface of the semiconductor chip includes a sensing region and at least one bonding pad is disposed on the active surface. The metal dam bar separates the sensing region and the bonding pad to prevent contamination of the sensing region by the mold flash. Preferably, a step is formed on the periphery of the active surface of the semiconductor chip, such that the semiconductor chip includes a T-shaped profile. Additionally, the metal dam bar is extended to the step to form an enclosed ring thereby effectively defining an exposed molding region that contains the sensing region.

    摘要翻译： 公开了一种用于限定暴露的成型区域的传感器芯片。 传感器芯片包括从半导体芯片的有源表面突出的半导体芯片和金属阻挡条。 半导体芯片的有源表面包括感测区域，并且至少一个焊盘设置在有源表面上。 金属阻挡条分隔感测区域和接合焊盘，以防止模具闪光灯对感测区域的污染。 优选地，在半导体芯片的有源表面的周围形成台阶，使得半导体芯片包括T形轮廓。 此外，金属阻挡杆延伸到台阶以形成封闭的环，从而有效地限定包含感测区域的暴露的模制区域。

    Chip on glass package
    6.
    发明申请
    Chip on glass package 有权
    芯片上的玻璃包装

    公开(公告)号：US20050062142A1

    公开(公告)日：2005-03-24

    申请号：US10947176

    申请日：2004-09-23

    申请人： Ying-Tsai Yeh ,  Chih-Huang Chang ,  Yung Lu

    发明人： Ying-Tsai Yeh ,  Chih-Huang Chang ,  Yung Lu

    IPC分类号： G06K9/00 ,  H01L21/44 ,  H01L23/14 ,  H01L27/146

    CPC分类号： G06K9/00053 ,  H01L27/14618 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A chip on glass package. A glass substrate has a top surface and a corresponding bottom surface. A plurality of chips are flip-chip mounted on the top surface of the glass substrate. The bottom surface of the glass substrate is secured to and electrically connected with a carrier. An encapsulation material is formed around the glass substrate to seal the chips. The encapsulation material has a cavity to expose the contact area of the top surface of the glass substrate. Therefore the chip on glass package is to possess a better protection and electrical connection of the glass substrate.

    摘要翻译： 玻璃包装芯片。 玻璃基板具有顶表面和相应的底表面。 多个芯片被倒装安装在玻璃基板的顶表面上。 玻璃基板的底面被固定并与载体电连接。 在玻璃基板周围形成密封材料以密封芯片。 封装材料具有用于暴露玻璃基板的顶表面的接触面积的空腔。 因此，玻璃封装上的芯片具有更好的玻璃基板的保护和电连接。

    Contact sensor package structure
    9.
    发明授权
    Contact sensor package structure 有权
    接触传感器封装结构

    公开(公告)号：US07122757B2

    公开(公告)日：2006-10-17

    申请号：US10868496

    申请日：2004-06-14

    申请人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

    发明人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

    IPC分类号： H03K17/975

    CPC分类号： H03K17/975 ,  H03K17/98 ,  Y10T428/30

    摘要： A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.

    摘要翻译： 接触传感器封装具有衬底，膜，密封剂和设置在衬底上的多个接触传感器。 接触传感器设置在由基板，膜和密封剂限定的封闭空间内。 接触传感器封装还具有至少形成在基板上的接地导电迹线和形成在膜的表面上并电连接到接地导电迹线的静电电荷耗散层。 静电电荷耗散层具有作为用于检测接触工件的接触面的上表面。

    Contact sensor package structure
    10.
    发明申请
    Contact sensor package structure 有权
    接触传感器封装结构

    公开(公告)号：US20050274597A1

    公开(公告)日：2005-12-15

    申请号：US10868496

    申请日：2004-06-14

    申请人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

    发明人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

    IPC分类号： H03K17/975

    CPC分类号： H03K17/975 ,  H03K17/98 ,  Y10T428/30

    摘要： A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.

    摘要翻译： 接触传感器封装具有衬底，膜，密封剂和设置在衬底上的多个接触传感器。 接触传感器设置在由基板，膜和密封剂限定的封闭空间内。 接触传感器封装还具有至少形成在基板上的接地导电迹线和形成在膜的表面上并电连接到接地导电迹线的静电电荷耗散层。 静电电荷耗散层具有作为用于检测接触工件的接触面的上表面。