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    Contact sensor package structure
    2.
    发明授权
    Contact sensor package structure 有权
    接触传感器封装结构

    公开(公告)号：US07122757B2

    公开(公告)日：2006-10-17

    申请号：US10868496

    申请日：2004-06-14

    申请人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

    发明人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

    IPC分类号： H03K17/975

    CPC分类号： H03K17/975 ,  H03K17/98 ,  Y10T428/30

    摘要： A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.

    摘要翻译： 接触传感器封装具有衬底，膜，密封剂和设置在衬底上的多个接触传感器。 接触传感器设置在由基板，膜和密封剂限定的封闭空间内。 接触传感器封装还具有至少形成在基板上的接地导电迹线和形成在膜的表面上并电连接到接地导电迹线的静电电荷耗散层。 静电电荷耗散层具有作为用于检测接触工件的接触面的上表面。

    Contact sensor package structure
    3.
    发明申请
    Contact sensor package structure 有权
    接触传感器封装结构

    公开(公告)号：US20050274597A1

    公开(公告)日：2005-12-15

    申请号：US10868496

    申请日：2004-06-14

    申请人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

    发明人： Shih-Chang Lee ,  Cheng-Yin Lee ,  Yung-Li Lu ,  Ying-Tsai Yeh ,  Pei-Chi Lin

    IPC分类号： H03K17/975

    CPC分类号： H03K17/975 ,  H03K17/98 ,  Y10T428/30

    摘要： A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.

    摘要翻译： 接触传感器封装具有衬底，膜，密封剂和设置在衬底上的多个接触传感器。 接触传感器设置在由基板，膜和密封剂限定的封闭空间内。 接触传感器封装还具有至少形成在基板上的接地导电迹线和形成在膜的表面上并电连接到接地导电迹线的静电电荷耗散层。 静电电荷耗散层具有作为用于检测接触工件的接触面的上表面。

    CHIP PACKAGE STRUCTURE
    5.
    发明申请
    CHIP PACKAGE STRUCTURE 审中-公开
    芯片包装结构

    公开(公告)号：US20070075441A1

    公开(公告)日：2007-04-05

    申请号：US11463404

    申请日：2006-08-09

    申请人： Cheng-Yin Lee ,  Yung-Li Lu ,  Po-Ching Su

    发明人： Cheng-Yin Lee ,  Yung-Li Lu ,  Po-Ching Su

    IPC分类号： H01L23/28

    CPC分类号： H01L27/14618 ,  G06K9/00013 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/48 ,  H01L27/14683 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A chip package structure including a chip, a carrier, a plurality of bonding wires and a molding compound is provided. The chip has an active surface, a back surface opposite to the active surface, a plurality of side surfaces, and a plurality of flash-preventing surfaces located between the active surface and the side surfaces. The carrier is connected to the back surface of the chip to carry the chip. The chip is electrically connected to the carrier via the bonding wires. The molding compound is disposed on the carrier and encapsulates the bonding wires, a portion of the active surface, the side surfaces, and at least a portion of the flash-preventing surfaces. The flash-preventing surfaces prevent excess molding compound from contaminating the active surface of the chip.

    摘要翻译： 提供了包括芯片，载体，多个接合线和模塑料的芯片封装结构。 芯片具有活性表面，与活性表面相反的后表面，多个侧表面和位于活性表面和侧表面之间的多个防闪光表面。 载体连接到芯片的背面以承载芯片。 芯片通过接合线与载体电连接。 成型化合物设置在载体上并封装接合线，活性表面的一部分，侧表面和防闪光表面的至少一部分。 防闪光表面防止多余的模塑料污染芯片的活性表面。

    Low latency working VPLS
    10.
    发明申请
    Low latency working VPLS 有权
    低延迟工作VPLS

    公开(公告)号：US20070058622A1

    公开(公告)日：2007-03-15

    申请号：US11224057

    申请日：2005-09-13

    申请人： Cheng-Yin Lee

    发明人： Cheng-Yin Lee

    IPC分类号： H04L12/56 ,  H04L12/28

    CPC分类号： H04L45/302 ,  H04L12/4633 ,  H04L45/04 ,  H04L45/48 ,  H04L45/50 ,  H04L45/742 ,  H04L49/351 ,  H04L49/602

    摘要： A system and method are provided for forwarding packets through a fully meshed communication network when the destination MAC address may not be known. Each network element maintains a mapping of MAC addresses and IP addresses, each MAC address having an associated IP address which indicates to where packets are to be forwarded. If a network element receives a packet but has not yet associated an IP address with the destination MAC address of the packet, then the network element forwards the packet along a tree. If a network element receives a packet and has associated an IP address with the destination MAC address, in other words has learned of the IP address for the MAC address, the network element sends the packet directly to the IP address unless a direct link to the IP address is not available. If a direct link is not available, the network element forwards the packet along the tree. A network element receiving a packet from an attachment circuit encapsulates its own IP address in the message, permitting other network elements to learn of the IP address associated with the source MAC address. The invention provides reliable forwarding of packets to both known and unknown destination MAC addresses, while taking advantage of shortest paths provided by a fully meshed network.

    摘要翻译： 提供了一种系统和方法，用于当目的MAC地址可能不知道时，通过全网状通信网络转发数据包。 每个网元维护MAC地址和IP地址的映射，每个MAC地址具有指示要转发到哪个数据包的相关联的IP地址。 如果一个网络元件接收到一个数据包，但还没有将一个IP地址与该数据包的目标MAC地址相关联，那么该网络元素将沿着一个树转发数据包。 如果一个网络元件接收到一个分组，并将一个IP地址与目标MAC地址相关联，换句话说，已经知道了MAC地址的IP地址，则网络单元将数据包直接发送到IP地址，除非直接链接到 IP地址不可用。 如果直接链路不可用，则网络元素沿着树转发数据包。 从附件电路接收分组的网络元件将其自己的IP地址封装在消息中，允许其他网络元件了解与源MAC地址相关联的IP地址。 本发明提供了可靠地将分组转发到已知和未知的目的地MAC地址，同时利用由全网状网络提供的最短路径。