公开(公告)号：US5265649A

公开(公告)日：1993-11-30

申请号：US907188

申请日：1992-07-01

申请人： Yoshimi Iwano ,  Yoichi Makino ,  Tetsuya Furuta

发明人： Yoshimi Iwano ,  Yoichi Makino ,  Tetsuya Furuta

IPC分类号： D03J1/00 ,  D03D49/00

CPC分类号： D03J1/001

摘要： A full roll transferred from a cloth wind-up position in a weaving machine to a temporary full-roll storage position on a transfer carriage is prevented from rotation by meshing with a gear mounted stationarily. The transfer carriage is equipped with empty roll supporting arms and cutter supporting arms having free ends at which a cloth cutting mechanism is supported. An empty roll is supported by a holding device mounted at free ends of the empty roll supporting arms so as to be rotated by an empty roll driving motor. Owing to rotation of the empty roll, tension is applied to a cloth between the full roll and the empty roll so that it is cut by the cloth cutting mechanism in a tensioned stationary state.

公开(公告)号：US07669317B2

公开(公告)日：2010-03-02

申请号：US11464230

申请日：2006-08-14

申请人： Yoichi Makino ,  Akira Kabeshita

发明人： Yoichi Makino ,  Akira Kabeshita

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53478 ,  Y10T156/1702

摘要： In a chip reversing method for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

摘要翻译： 在用于保持并垂直反转由接合喷嘴放置的芯片的芯片反转方法中，芯片被保持在设置在反转构件中的切屑保持单元上，并且通过在反转轴上向下转动反向构件而垂直反转。 在由芯片接收单元接收到反向芯片之后，该芯片接收单元下降到缩回位置，以将反向构件返回到原始位置。 在这种状态下，芯片接收单元升高以将芯片定位在芯片转移动作的高度L处。 结果，反转构件不突出到用于芯片转移的高度水平以上，从而干扰另一机构，使得可以使芯片安装动作有效。

公开(公告)号：US07437818B2

公开(公告)日：2008-10-21

申请号：US10564275

申请日：2004-08-25

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

摘要： A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

摘要翻译： 一种用于将多个部件安装在板上的部件安装装置和方法。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。

公开(公告)号：US06235626B1

公开(公告)日：2001-05-22

申请号：US09201151

申请日：1998-11-30

申请人： Yoichi Makino ,  Hironobu Miyamoto

发明人： Yoichi Makino ,  Hironobu Miyamoto

IPC分类号： H01L214763

CPC分类号： H01L21/28587 ,  H01L21/76804

摘要： The present invention provides a method of forming a gate recess in an insulating film on a substrate for depositing a gate electrode film being in contact with a part of the substrate and also extending at least within the gate recess. The method comprises the steps of: forming an etching mask pattern with a first opening pattern on the insulating film; carrying out a first anisotropic etching process by use of the etching mask pattern at a first selective ratio of the etching mask pattern to the insulating film, thereby to form a first recessed portion having a bottom which lies at a first level higher than an interface level between the insulating film and the substrate; and carrying out a second anisotropic etching process by use of the etching mask pattern again at a second selective ratio of the etching mask pattern to the insulating film, wherein the second selective ratio is higher than the first selective ratio, thereby to form a gate recess which comprises a second recessed portion both having a bottom which lies at the interface level and having first side walls of a first oblique angle and a third recessed portion both having a bottom united with a top of the second recessed portion and having second side walls of a second oblique angle which is smaller than the first oblique angle.

摘要翻译： 本发明提供一种在衬底上形成绝缘膜中的栅极凹槽的方法，用于沉积与衬底的一部分接触的栅电极膜，并且至少在栅极凹槽内延伸。 该方法包括以下步骤：在绝缘膜上形成具有第一开口图案的蚀刻掩模图案; 通过使用蚀刻掩模图案以与蚀刻掩模图案相对于绝缘膜的第一选择比进行第一各向异性蚀刻处理，从而形成第一凹陷部分，其具有位于比界面高度高的第一高度 在绝缘膜和基板之间; 并且以与蚀刻掩模图案相对于绝缘膜的第二选择比率再次利用蚀刻掩模图案进行第二各向异性蚀刻处理，其中第二选择比高于第一选择比，从而形成栅极凹部 其包括第二凹部，所述第二凹部具有位于界面水平处的底部，并且具有第一倾斜角的第一侧壁和具有与第二凹部的顶部结合的底部的第三凹部，并且具有第二侧壁 第二斜角小于第一斜角。

公开(公告)号：US20070039686A1

公开(公告)日：2007-02-22

申请号：US11464230

申请日：2006-08-14

申请人： Yoichi Makino ,  Akira Kabeshita

发明人： Yoichi Makino ,  Akira Kabeshita

IPC分类号： B32B37/00 ,  H01L21/00 ,  B32B38/00 ,  B32B38/18

CPC分类号： H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53478 ,  Y10T156/1702

摘要： In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

摘要翻译： 在用于保持并垂直反转由接合喷嘴放置的芯片的芯片安装装置中的芯片反转装置中，芯片被保持在设置在反转构件中的芯片保持单元上，并且通过向后转动反向构件而垂直反转 反转轴。 在由芯片接收单元接收到反向芯片之后，该芯片接收单元下降到缩回位置，以将反向构件返回到原始位置。 在这种状态下，芯片接收单元升高以将芯片定位在芯片转移动作的高度L处。 结果，反转构件不突出到用于芯片转移的高度水平以上，从而干扰另一机构，使得可以使芯片安装动作有效。

公开(公告)号：US20130071844A1

公开(公告)日：2013-03-21

申请号：US13636446

申请日：2011-03-23

申请人： Yoichi Makino ,  Akio Yamane ,  Masato Nakayama

发明人： Yoichi Makino ,  Akio Yamane ,  Masato Nakayama

IPC分类号： C12Q1/68

CPC分类号： C12Q1/6869 ,  C12Q1/6827 ,  C12Q1/6858 ,  C12Q2531/119 ,  C12Q2537/161 ,  C12Q2531/143 ,  C12Q2531/113 ,  C12Q2525/161 ,  C12Q2525/185 ,  C12Q2525/204 ,  C12Q2535/125 ,  C12Q2549/101 ,  C12Q2563/107 ,  C12Q2565/101

摘要： Disclosed is a method of detecting a target base sequence having a polymorphic base, the method including: (a) a step of adding to a nucleic acid sample having a target nucleic acid that includes a base sequence including the target base sequence: at least one type of detection primer, at least one type of competitive primer, and at least one type of common primer; (b) a step of annealing the detection primer and the competitive primer to the target nucleic acid in a competitive manner, thereby synthesizing an extension product A; (c) a step of annealing the common primer to the extension product A obtained in the step (b) or in the following step (d), thereby synthesizing an extension product B; (d) a step of annealing the detection primer or the competitive primer to the extension product B obtained in the previous step (c), thereby synthesizing the extension product A; and (e) a step of detecting the extension product A or the extension product B.

摘要翻译： 公开了一种检测具有多态性碱基的靶碱基序列的方法，所述方法包括：（a）向具有目标核酸的核酸样品中添加包含目标碱基序列的碱基序列的步骤：至少一种 检测引物的类型，至少一种类型的竞争性引物和至少一种类型的共同引物; （b）以竞争方式将检测引物和竞争性引物退火至目标核酸，由此合成延伸产物A; （c）将通用引物退火到步骤（b）或后续步骤（d）中获得的延伸产物A的步骤，从而合成延伸产物B; （d）将检测引物或竞争性引物退火至前述步骤（c）中获得的延伸产物B的步骤，从而合成延伸产物A; 和（e）检测扩展产品A或扩展产品B的步骤。

公开(公告)号：US07637714B2

公开(公告)日：2009-12-29

申请号：US10568501

申请日：2004-09-07

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Shozo Minamitani ,  Yoichi Makino ,  Noriyuki Tani

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Shozo Minamitani ,  Yoichi Makino ,  Noriyuki Tani

IPC分类号： B29C63/00

CPC分类号： H01L21/67132 ,  Y10T156/1132 ,  Y10T156/1944

摘要： While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the adhesion region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change an adhesive surface bond of the semiconductor chip to the adhesive sheet to point bonding. Further, the removing member is moved along the bottom surface of the semiconductor chip so as to change the position of the point bonding and decrease the adhesive bonding force to the adhesive sheet. Then, the semiconductor chip is removed from the adhesive sheet.

摘要翻译： 在与半导体芯片的粘接区域相对应的压敏粘合片的底面侧区域的附近被吸引保持时，移除部件的多个突出部与底面 的半导体芯片通过粘合片在粘合区域。 此外，粘合片被吸入各个突出部分之间，以便改变半导体芯片与粘合片的粘合表面粘结以进行点焊。 此外，移除构件沿着半导体芯片的底表面移动，以便改变点接合的位置，并降低粘合剂粘合力。 然后，将半导体芯片从粘合片上取出。

公开(公告)号：US20060285965A1

公开(公告)日：2006-12-21

申请号：US10568501

申请日：2004-09-07

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Shozo Minamitani ,  Yoichi Makino ,  Noriyuki Tani

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Shozo Minamitani ,  Yoichi Makino ,  Noriyuki Tani

IPC分类号： B65G1/133

CPC分类号： H01L21/67132 ,  Y10T156/1132 ,  Y10T156/1944

摘要： While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by-adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.

摘要翻译： 在与半导体芯片（1）的粘合区域（R 1）对应的粘合片（3）的底面侧区域的附近被吸住并保持的情况下，将多个突起部（30） 移除部件（21）通过该区域的粘合片与半导体芯片的底面接触。 此外，粘合片被吸入各个突出部分之间，以便将半导体芯片与粘合片的表面粘合改变为点粘合，并且还可以沿着半导体的底表面移动移除构件 从而改变点粘合的位置，并通过粘合降低粘合片的粘合力。 然后，将半导体芯片从粘合片上取出。

公开(公告)号：US5276627A

公开(公告)日：1994-01-04

申请号：US982241

申请日：1992-11-25

申请人： Yoichi Makino ,  Hiroshi Tanizaki ,  Akio Arakawa

发明人： Yoichi Makino ,  Hiroshi Tanizaki ,  Akio Arakawa

IPC分类号： D03D51/00 ,  G06F15/46

CPC分类号： D03J1/005 ,  D03D51/005 ,  D03D51/007

摘要： A method of controlling operation of a loom machine by a computer equipped with a data input unit incorporating a display imparted with a function for generating a first list of weaving conditions at least for a weft insertion apparatus and a function for generating an alteration confirmation list when the conditions in the first list are altered. Upon inputting of data representing a desired fabric parameter, weaving conditions corresponding to the fabric parameter are selected from those previously stored in the computer, whereupon the selected weaving conditions are displayed in the first list. Before the selected weaving conditions are validated for controlling the loom operation, a confirmation list is again displayed for allowing the weaving conditions to be altered. When altered, the updated list containing the altered conditions is again generated for confirmation. When acknowledgement is input for the first list or the updated list, the corresponding weaving conditions in the list are transferred to a relevant controller. By generating the display for confirmation, alteration or change of the weaving conditions as desired can be reliably effectuated without suffering errors.

摘要翻译： 一种控制织机的操作的方法，所述计算机配备有包含显示器的数据输入单元，所述显示器具有至少针对引纬装置生成第一列编织条件的功能，以及用于产生改变确认列表的功能 第一个列表中的条件被更改。 在输入表示期望的织物参数的数据时，从先前存储在计算机中的织物参数中选择与织物参数相对应的织造条件，由此在第一列表中显示所选择的织造条件。 在选择的织造条件被验证用于控制织机操作之前，再次显示确认列表以允许改变织造条件。 当更改时，再次生成包含更改条件的更新列表以进行确认。 当为第一个列表或更新的列表输入确认时，列表中相应的编织条件被传送到相关的控制器。 通过生成用于确认的显示，可以可靠地实现根据需要改变或改变编织条件而不会出现错误。

公开(公告)号：US5095953A

公开(公告)日：1992-03-17

申请号：US549288

申请日：1990-07-06

申请人： Yoichi Makino

发明人： Yoichi Makino

IPC分类号： D03D47/30 ,  D03D47/38

CPC分类号： D03D47/3053 ,  D03D47/304 ,  D03D47/3046

摘要： A weft insertion control apparatus for a multi-color jet loom comprises a plurality of solenoid valves for controlling supply of a pressurized fluid to weft inserting auxiliary nozzles, an on/off controller for controlling these valves independently of one another, a first memory for storing a weft color selection pattern, and a second memory for storing on/off timing for the individual valves on a weft basis. The on/off controller reads out the weft color selection pattern stored in the first memory for every rotation of the loom and selects the preset on/off timing from the second memory on the basis of the result of the reading thereby controlling the valves.

摘要翻译： 一种用于多色喷射织机的引纬控制装置，包括多个电磁阀，用于控制加压流体向引纬辅助喷嘴的供给，用于彼此独立地控制这些阀的开/关控制器，用于存储 纬纱颜色选择图案，以及用于以纬纱方式存储各个阀门的开/关定时的第二存储器。 开/关控制器读出存储在第一存储器中的纬纱颜色选择模式，用于织机的每次旋转，并且基于读取结果从第二存储器中选择预设的开/关定时，从而控制阀。