公开(公告)号：US06620650B2

公开(公告)日：2003-09-16

申请号：US10277834

申请日：2002-10-23

申请人： Yoshikazu Nakata ,  Takeshi Kasai

发明人： Yoshikazu Nakata ,  Takeshi Kasai

IPC分类号： H01L2144

CPC分类号： H05K3/062 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4864 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49872 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K3/0061 ,  H05K3/108 ,  H05K3/427 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ball pads is low, so that the adhesion tends to be unstable. In the present invention, no leads for plating are formed, while the adhesive strength of solder balls to ball pads is improved by electroplating the ball pads with a Ni/Au layer. In addition, an increase in the density of interconnections and an improvement of the electrical properties is also obtained. The Ni/Au layer is formed by electroplating on the base metal layer surface which is not covered with a DFR (Dry Film Resist) by applying an electric current to the base metal layer.

公开(公告)号：US06249053B1

公开(公告)日：2001-06-19

申请号：US09250282

申请日：1999-02-16

申请人： Yoshikazu Nakata ,  Takeshi Kasai

发明人： Yoshikazu Nakata ,  Takeshi Kasai

IPC分类号： H01L2348

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49872 ,  H01L24/48 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K3/0061 ,  H05K3/062 ,  H05K3/108 ,  H05K3/427 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ball pads is low, so that the adhesion tends to be unstable. In the present invention, no leads for plating are formed, while the adhesive strength of solder balls to ball pads is improved by electroplating the ball pads with a Ni/Au layer. In addition, an increase in the density of interconnections and an improvement of the electrical properties is also obtained. The Ni/Au layer is formed by electroplating on the base metal layer surface which is not covered with a DFR (Dry Film Resist) by applying an electric current to the base metal layer.

摘要翻译： 在芯片封装中，当Ni / Au的层是通过无电解电镀形成，所以使用互连等的密度增加，由于引线的电镀和领带不形成条没有问题。 然而，焊球到球垫的粘合强度是低的，从而使粘合性容易变得不稳定。 在本发明中，对于电镀没有引线形成，而焊球球垫的粘合强度是通过用Ni / Au的层电镀球垫改善。 此外，还获得增加互连的密度和电性能的改善。 在Ni / Au层通过电镀，其未覆盖有通过施加电流到基底金属层的DFR（干膜抗蚀剂）的基底金属层表面上形成。

公开(公告)号：US06495394B1

公开(公告)日：2002-12-17

申请号：US09584144

申请日：2000-05-31

申请人： Yoshikazu Nakata ,  Takeshi Kasai

发明人： Yoshikazu Nakata ,  Takeshi Kasai

IPC分类号： H01L2144

CPC分类号： H05K3/062 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4864 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49872 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K3/0061 ,  H05K3/108 ,  H05K3/427 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ball pads is low, so that the adhesion tends to be unstable. In the present invention, no leads for plating are formed, while the adhesive strength of solder balls to ball pads is improved by electroplating the ball pads with a Ni/Au layer. In addition, an increase in the density of interconnections and an improvement of the electrical properties is also obtained. The Ni/Au layer is formed by electroplating on the base metal layer surface which is not covered with a DFR (Dry Film Resist) by applying an electric current to the base metal layer.

摘要翻译： 在芯片封装中，当通过无电解电镀形成Ni / Au层时，由于不形成用于电镀和连接条的引线，因此互连等的密度增加没有问题。 然而，焊球对焊盘的粘合强度低，使得粘合趋于不稳定。 在本发明中，不形成电镀用引线，同时通过用Ni / Au层电镀球垫来提高焊球对球垫的粘合强度。 此外，还获得了互连密度的增加和电性能的改善。 通过向基底金属层施加电流，在未被DFR（干膜抗蚀剂）覆盖的基底金属层表面上电镀Ni / Au层。

公开(公告)号：US6074893A

公开(公告)日：2000-06-13

申请号：US863279

申请日：1997-05-27

申请人： Yoshikazu Nakata ,  Syozo Otomo ,  Kazunari Tanaka ,  Koichi Uno

发明人： Yoshikazu Nakata ,  Syozo Otomo ,  Kazunari Tanaka ,  Koichi Uno

IPC分类号： H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/20 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L21/4867 ,  H05K3/1258 ,  H05K3/207 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0376 ,  H05K2203/0156 ,  H05K2203/0568 ,  Y10T29/4921 ,  Y10T29/49211

摘要： A process for forming fine thick-film conductor patterns on a ceramic substrate which comprises the steps of forming grooves in a positive-working photoresist layer on the substrate by the photolithographic technology, filling the grooves with a conductive paste by squeezing with a squeegee, removing the photoresist layer by a wet process, and firing the remaining conductive paste pattern is improved. By the improvements, the conductive paste is squeezed into the grooves by the screen printing technique using a mask, and/or the solvent in the conducive paste consists essentially of one or more hydrocarbons, and/or the squeegee is made of a material having a flexural modulus in a range of 30-200 kgf/mm.sup.2. The formation of the grooves may be accomplished by laser beam machining; in this case a negative-working photoresist or any other soluble resin may be used to form the grooves therein. Also provided are a process for forming a fine thick-film conductor pattern by means of transfer of a conductive paste pattern formed on a support film to a green sheet, as well as a process for forming bumps on a ceramic circuit substrate.

摘要翻译： 一种用于在陶瓷基片上形成精细厚膜导体图案的方法，包括以下步骤：通过光刻技术在基片上的正性光致抗蚀剂层中形成凹槽，用刮板挤压导电浆料填充凹槽， 通过湿法处理光致抗蚀剂层，并且烧制剩余的导电浆料图案。 通过改进，通过使用掩模的丝网印刷技术将导电浆料挤压入凹槽中，和/或导电浆料中的溶剂基本上由一种或多种烃组成，和/或刮板由具有 弯曲模量在30-200kgf / mm2的范围内。 凹槽的形成可以通过激光束加工来实现; 在这种情况下，可以使用负性光致抗蚀剂或任何其它可溶性树脂在其中形成凹槽。 还提供了通过将形成在支撑膜上的导电浆料图案转印到生片上而形成精细厚膜导体图案的工艺，以及在陶瓷电路基板上形成凸块的工艺。