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11 条记录 (耗时 0.02 秒)

    NOVEL ENVIRONMENTAL-PROTECTION SHOE TREE
    3.
    发明申请
    NOVEL ENVIRONMENTAL-PROTECTION SHOE TREE 审中-公开
    新型环保型鞋

    公开(公告)号：US20110094045A1

    公开(公告)日：2011-04-28

    申请号：US12606191

    申请日：2009-10-27

    申请人： YU-HUA KAO

    发明人： YU-HUA KAO

    IPC分类号： A43D3/00

    CPC分类号： A43D3/1433

    摘要： The present invention relates to the manufacture of a novel environmental-protection shoe tree, and particularly to the manufacture of an environmental-protection shoe tree made by molding a primary material of rice husk, in which fibrous plant materials, such as rice husks and wheat husks are sieved and pulverized and are mixed with natural rubber and additives, followed by mechanical mixing to carry out a uniform mixing operation for forming an environmental-protection material block, which is then processed by a rolling machine to uniformly mix with a crosslinking agent and form an environmental-protection material plate, which is then cut into a desired size and put in a mold to be heated and pressurized by a hydraulic machine for performing molding to eventually form a final product of a shoe tree showing characteristics of environmental protection.

    摘要翻译： 本发明涉及一种新型环保鞋树的制造，特别涉及通过模制稻壳的初级材料制成的环保鞋树，其中纤维性植物材料如稻壳和小麦 将外壳筛分并粉碎并与天然橡胶和添加剂混合，然后机械混合，进行均匀的混合操作，形成环保材料块，然后用滚压机加工，与交联剂均匀混合， 形成环保材料板，然后将其切割成所需的尺寸，并放入模具中，通过用于进行模塑的液压机进行加热和加压，最终形成具有环保特性的鞋树的最终产品。

    RUBBER SHOE SOLE
    5.
    发明申请
    RUBBER SHOE SOLE 审中-公开
    橡胶鞋子

    公开(公告)号：US20080166536A1

    公开(公告)日：2008-07-10

    申请号：US11554031

    申请日：2006-10-30

    申请人： Yu-Hua Kao

    发明人： Yu-Hua Kao

    IPC分类号： D04H13/00

    CPC分类号： D04H1/42 ,  Y10T428/249924

    摘要： An environment-conservation rubber shoe sole is made of vegetable fibrous materials including disposed rice/wheat husks, together with natural and synthetic rubbers with suitable amounts of curing additive, activation prompter, and filler, which, after being fully mixed and stirred, are subject to pressurization to form material sheets of suitable thickness for subsequent deposition in a forming mold for curing and molding by heating and pressurizing to complete formation of shoe sole made of environment-conversation material, whereby a de-molded product can be finished with simple trimming whereby low-cost, comfortable, and easy-to-recycle environment-conservation rubber shoe sole can be manufactured and true non-pollution use of shoe sole can be realized.

    摘要翻译： 环保橡胶鞋底由植物纤维材料制成，包括配置的米/麦壳，以及天然和合成橡胶以及适量的固化添加剂，活化促进剂和填料，经充分混合搅拌后， 加压形成适当厚度的材料片，随后通过加热和加压固化和成型成型模具中沉积，以完成由环保材料制成的鞋底的形成，从而可以简单的修剪完成脱模产品，由此 可以制造低成本，舒适，易于回收的环保橡胶鞋底，实现鞋底真正的无污染使用。

    Method of preparing silicon-on-insulator substrates particularly suited for microwave applications
    6.
    发明授权
    Method of preparing silicon-on-insulator substrates particularly suited for microwave applications 失效
    制备特别适用于微波应用的绝缘体上硅衬底的方法

    公开(公告)号：US06548375B1

    公开(公告)日：2003-04-15

    申请号：US09527095

    申请日：2000-03-16

    申请人： Héctor J. De Los Santos ,  Yu-Hua Kao Lin

    发明人： Héctor J. De Los Santos ,  Yu-Hua Kao Lin

    IPC分类号： H01L2130

    CPC分类号： H01L21/76251 ,  H01L21/2007 ,  H01L21/31612

    摘要： A method of directly and indirectly bonding a microwave substrate 14 and a silicon substrate 12 is described. The method for directly bonding a silicon substrate includes the steps of cleaning the microwave substrate and cleaning the silicon substrate. Then, the microwave substrate and the silicon substrate are stacked together. The stack is placed in a furnace. The temperature of the furnace is increased to a predetermined temperature at a predetermined rate. The temperature of the furnace is reduced at a second predetermined rate. The method of indirectly bonding includes sputtering a silicon dioxide layer on the microwave substrate and silicon substrate prior to placing them together.

    摘要翻译： 描述了直接和间接地结合微波衬底14和硅衬底12的方法。 直接接合硅衬底的方法包括清洁微波衬底和清洁硅衬底的步骤。 然后，将微波衬底和硅衬底堆叠在一起。 将堆叠放置在炉中。 炉子的温度以预定的速率增加到预定的温度。 炉的温度以第二预定速率降低。 间接结合的方法包括在将微波衬底和硅衬底放置在一起之前溅射二氧化硅层。

    Method of fabricating a microwave microstrip/waveguide transition structure
    7.
    发明授权
    Method of fabricating a microwave microstrip/waveguide transition structure 失效
    制造微波微带/波导过渡结构的方法

    公开(公告)号：US06467152B1

    公开(公告)日：2002-10-22

    申请号：US09460184

    申请日：1999-12-11

    申请人： Hector J. De Los Santos ,  Yu-Hua Kao Lin ,  Andrew H. Kwon ,  Eric D. Ditmars ,  John R. Dunwoody

    发明人： Hector J. De Los Santos ,  Yu-Hua Kao Lin ,  Andrew H. Kwon ,  Eric D. Ditmars ,  John R. Dunwoody

    IPC分类号： H01Q1700

    CPC分类号： H01P5/107 ,  H01P11/00 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/4913 ,  Y10T29/49156

    摘要： A microwave microstrip/waveguide transition structure includes a substrate, an elongated microstrip layer residing on a surface of the substrate, and an elongated integral hollow waveguide on the surface of the substrate. The microstrip layer and a side of the hollow waveguide constitute a single continuous piece of metal. The transition structure is fabricated by providing a substrate, depositing a metallic layer on the substrate, and depositing a metallic hollow housing continuous with a portion of a length of the metallic layer. The metallic hollow waveguide bounded by the metallic layer and the metallic hollow housing and having a contained volume therewithin is thereby defined.

    摘要翻译： 微波微带/波导过渡结构包括衬底，驻留在衬底表面上的细长微带层和衬底表面上的细长整体中空波导。 微带层和中空波导的一侧构成单个连续的金属片。 通过提供衬底，在衬底上沉积金属层，以及沉积与金属层的一部分长度连续的金属中空壳体来制造过渡结构。 因此限定了由金属层和金属中空壳体限定并具有容纳体积的金属中空波导管。

    Microelectromechanical device
    9.
    发明授权
    Microelectromechanical device 有权
    微机电装置

    公开(公告)号：US6040611A

    公开(公告)日：2000-03-21

    申请号：US150901

    申请日：1998-09-10

    申请人： Hector J. De Los Santos ,  Yu-Hua Kao ,  Arturo L. Caigoy ,  Eric D. Ditmars

    发明人： Hector J. De Los Santos ,  Yu-Hua Kao ,  Arturo L. Caigoy ,  Eric D. Ditmars

    IPC分类号： B81B3/00 ,  H01H59/00 ,  H01L27/14 ,  H01L29/82 ,  H01L29/84

    CPC分类号： H01H59/0009 ,  H01H2059/0054

    摘要： A microelectromechanical (MEM) device includes a substrate and a flexible cantilever beam. The substrate has positioned thereon a first interconnection line separated by a first gap and a second interconnection line separated by a second gap parallel to the first interconnection line. The substrate also has positioned thereon a first and second primary control electrode wherein one of the first and second primary control electrodes is positioned on one side of one of the first and second interconnection lines and the other one is positioned on the other side of the other first and second interconnection lines. The flexible cantilever beam has a top surface and a bottom surface and a beam width slightly larger than the gap widths at the gaps. A flexible anchor is secured to the bottom surface of the beam at a center of the beam and attached to a center of the substrate so as to position the beam orthogonally to the first and second interconnection lines. Secondary control electrodes are secured to the bottom surface of the beam and positioned opposite the primary control electrodes. First and second contact pads are secured to the bottom surface of the beam and positioned opposite the first and second interconnection lines.

    摘要翻译： 微机电（MEM）装置包括基板和柔性悬臂梁。 衬底上定位有由第一间隙隔开的第一互连线和由与第一互连线平行的第二间隙分开的第二互连线。 基板还在其上定位有第一和第二主要控制电极，其中第一和第二主要控制电极中的一个位于第一和第二互连线之一的一侧，另一个位于另一个的另一侧 第一和第二互连线。 柔性悬臂梁具有顶部表面和底部表面以及稍大于间隙处的间隙宽度的梁宽度。 柔性锚固件在梁的中心处固定到梁的底表面并且附接到基板的中心，以便将梁垂直定位到第一和第二互连线。 二次控制电极固定到梁的底表面并且与主控制电极相对定位。 第一和第二接触垫固定到梁的底表面并与第一和第二互连线相对定位。