公开(公告)号：US20080007930A1

公开(公告)日：2008-01-10

申请号：US11700792

申请日：2007-02-01

申请人： Osamu Daikuhara ,  Yuko Ohse ,  Shigeyuki Takizawa ,  Toshio Hashi

发明人： Osamu Daikuhara ,  Yuko Ohse ,  Shigeyuki Takizawa ,  Toshio Hashi

IPC分类号： H05K7/02 ,  H04B10/00 ,  H05K13/04

CPC分类号： G02B6/4227 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4246 ,  Y10T29/49137 ,  Y10T29/5313

摘要： A method of assembling a photoelectric conversion module is disclosed. The photoelectric conversion module includes a circuit board on which are mounted a light emitting element, a light receiving element, and an optical element optically connected to the light emitting element and the light receiving element. The light emitting element is positioned on the circuit board based on a positioning mark formed on the circuit board beforehand. The light receiving element and the optical element are positioned based on a position of a light emission point of the light emitting element.

摘要翻译： 公开了组装光电转换模块的方法。 光电转换模块包括电路板，其上安装有发光元件，光接收元件和与发光元件和光接收元件光学连接的光学元件。 发光元件预先基于形成在电路板上的定位标记而位于电路板上。 光接收元件和光学元件基于发光元件的发光点的位置而定位。

公开(公告)号：US09075208B2

公开(公告)日：2015-07-07

申请号：US11700792

申请日：2007-02-01

申请人： Osamu Daikuhara ,  Yuko Ohse ,  Shigeyuki Takizawa ,  Toshio Hashi

发明人： Osamu Daikuhara ,  Yuko Ohse ,  Shigeyuki Takizawa ,  Toshio Hashi

IPC分类号： H05K3/30 ,  G02B6/42

CPC分类号： G02B6/4227 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/4246 ,  Y10T29/49137 ,  Y10T29/5313

摘要： A method of assembling a photoelectric conversion module is disclosed. The photoelectric conversion module includes a circuit board on which are mounted a light emitting element, a light receiving element, and an optical element optically connected to the light emitting element and the light receiving element. The light emitting element is positioned on the circuit board based on a positioning mark formed on the circuit board beforehand. The light receiving element and the optical element are positioned based on a position of a light emission point of the light emitting element.

摘要翻译： 公开了组装光电转换模块的方法。 光电转换模块包括电路板，其上安装有发光元件，光接收元件和与发光元件和光接收元件光学连接的光学元件。 发光元件预先基于形成在电路板上的定位标记而位于电路板上。 光接收元件和光学元件基于发光元件的发光点的位置而定位。

公开(公告)号：US20080150163A1

公开(公告)日：2008-06-26

申请号：US11797883

申请日：2007-05-08

申请人： Yuko Ohse ,  Osamu Daikuhara ,  Hideki Takauchi

发明人： Yuko Ohse ,  Osamu Daikuhara ,  Hideki Takauchi

IPC分类号： H01L23/48

CPC分类号： H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/00014 ,  H01L2924/2065 ,  H01L2924/00 ,  H01L2924/00012

摘要： A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a paste adhesive onto the surface of the die pad and placing the semiconductor element on the die pad so as to press and spread the adhesive between the lower surface of the semiconductor element and the die pad. A wire extends between the semiconductor element and a terminal pad disposed around the die pad. The die pad includes plural grooves in the surface thereof. Each of the grooves extends from the center of the die pad toward a peripheral edge of the die pad and ends at the inner side of the peripheral edge of the die pad.

摘要翻译： 公开了一种用于半导体元件的安装结构。 半导体元件通过粘合剂膜粘合到芯片焊盘上，粘合剂膜通过将预定量的糊状粘合剂施加到芯片焊盘的表面上并将半导体元件放置在芯片焊盘上而使其粘合 在半导体元件的下表面和芯片焊盘之间。 导线延伸在半导体元件和设置在管芯焊盘周围的端子焊盘之间。 芯片焊盘在其表面上包括多个凹槽。 每个凹槽从芯片焊盘的中心朝向芯片焊盘的周边边缘延伸，并在芯片焊盘的周缘的内侧终止。

公开(公告)号：US20080037934A1

公开(公告)日：2008-02-14

申请号：US11711035

申请日：2007-02-27

申请人： Osamu Daikuhara ,  Yuko Ohse ,  Shigeyuki Takizawa ,  Toshio Hashi ,  Hideo Miyazawa

发明人： Osamu Daikuhara ,  Yuko Ohse ,  Shigeyuki Takizawa ,  Toshio Hashi ,  Hideo Miyazawa

IPC分类号： G02B6/42

CPC分类号： G02B6/3825 ,  G02B6/3879 ,  G02B6/3885 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4292

摘要： An optical connector is disclosed. The optical connector includes a first waveguide member that includes a first waveguide, a first lens disposed at one end surface of the first waveguide, and a second lens disposed at the other end surface of the first waveguide.

摘要翻译： 公开了一种光连接器。 光连接器包括：第一波导构件，其包括第一波导，设置在第一波导的一个端面处的第一透镜，以及设置在第一波导的另一端面的第二透镜。

公开(公告)号：US20090016733A1

公开(公告)日：2009-01-15

申请号：US12071177

申请日：2008-02-15

申请人： Masahiro Hamazaki ,  Osamu Daikuhara ,  Yuko Ohse

发明人： Masahiro Hamazaki ,  Osamu Daikuhara ,  Yuko Ohse

IPC分类号： H04B10/00 ,  G02B6/00

CPC分类号： G02B6/421 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4292

摘要： An optical transceiver using an optical waveguide holding member is disclosed. The optical transceiver includes a printed circuit board and the optical waveguide holding member. Photoelectric conversion elements are formed in the printed circuit board. An optical waveguide including core members is formed in the optical waveguide holding member. The optical waveguide optically connects the photoelectric conversion elements to external optical fibers. An element side lens is formed at one end of the core member so as to face a light receiving and emitting section of the photoelectric conversion element. Flanges are formed on the corresponding side walls of the optical waveguide holding member. The fixed centers of the flanges and optical centers of the element side lenses are arrayed on the same straight line.

公开(公告)号：US07625138B2

公开(公告)日：2009-12-01

申请号：US12071177

申请日：2008-02-15

申请人： Masahiro Hamazaki ,  Osamu Daikuhara ,  Yuko Ohse

发明人： Masahiro Hamazaki ,  Osamu Daikuhara ,  Yuko Ohse

IPC分类号： G02B6/36 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B6/421 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4292

摘要： An optical transceiver using an optical waveguide holding member is disclosed. The optical transceiver includes a printed circuit board and the optical waveguide holding member. Photoelectric conversion elements are formed in the printed circuit board. An optical waveguide including core members is formed in the optical waveguide holding member. The optical waveguide optically connects the photoelectric conversion elements to external optical fibers. An element side lens is formed at one end of the core member so as to face a light receiving and emitting section of the photoelectric conversion element. Flanges are formed on the corresponding side walls of the optical waveguide holding member. The fixed centers of the flanges and optical centers of the element side lenses are arrayed on the same straight line.

摘要翻译： 公开了一种使用光波导保持构件的光收发器。 光收发器包括印刷电路板和光波导保持构件。 光电转换元件形成在印刷电路板中。 包括芯构件的光波导形成在光波导保持构件中。 光波导将光电转换元件光连接到外部光纤。 元件侧透镜形成在芯构件的一端，以面对光电转换元件的光接收和发射部分。 法兰形成在光波导保持构件的相应侧壁上。 元件侧透镜的凸缘和光学中心的固定中心排列在相同的直线上。

公开(公告)号：US07948091B2

公开(公告)日：2011-05-24

申请号：US11797883

申请日：2007-05-08

申请人： Yuko Ohse ,  Osamu Daikuhara ,  Hideki Takauchi

发明人： Yuko Ohse ,  Osamu Daikuhara ,  Hideki Takauchi

IPC分类号： H01L23/50 ,  H01L23/12 ,  H01L23/48 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/00014 ,  H01L2924/2065 ,  H01L2924/00 ,  H01L2924/00012

摘要： A mounting structure for a semiconductor element is disclosed. The semiconductor element is bonded to a die pad through an adhesive film, which is formed by applying a predetermined amount of a paste adhesive onto the surface of the die pad and placing the semiconductor element on the die pad so as to press and spread the adhesive between the lower surface of the semiconductor element and the die pad. A wire extends between the semiconductor element and a terminal pad disposed around the die pad. The die pad includes plural grooves in the surface thereof. Each of the grooves extends from the center of the die pad toward a peripheral edge of the die pad and ends at the inner side of the peripheral edge of the die pad.

摘要翻译： 公开了一种用于半导体元件的安装结构。 半导体元件通过粘合剂膜粘合到芯片焊盘上，粘合剂膜通过将预定量的糊状粘合剂施加到芯片焊盘的表面上并将半导体元件放置在芯片焊盘上而使其粘合 在半导体元件的下表面和芯片焊盘之间。 导线在半导体元件和设置在管芯焊盘周围的端子焊盘之间延伸。 芯片焊盘在其表面上包括多个凹槽。 每个凹槽从芯片焊盘的中心朝向芯片焊盘的周边边缘延伸，并在芯片焊盘的周缘的内侧终止。