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公开(公告)号:US20140346143A1
公开(公告)日:2014-11-27
申请号:US14367990
申请日:2012-07-26
申请人: Takashi Miyamoto , Yuko Sawada , Yukio Ozaki , Hitoshi Sadakuni , Shohei Sasayama , Kazuki Kubo , Tatsuya Okawa
发明人: Takashi Miyamoto , Yuko Sawada , Yukio Ozaki , Hitoshi Sadakuni , Shohei Sasayama , Kazuki Kubo , Tatsuya Okawa
CPC分类号: H01B3/56 , C09D163/00 , H01B3/40 , H01H33/64 , H02G5/068 , Y10T29/49105
摘要: A gas insulated switchgear includes a high-voltage conductor installed inside a ground tank filled with an insulation gas and the high-voltage conductor is supported on an insulation spacer and thereby fixed to the ground tank. The gas insulator switchgear is configured in such a manner that an insulation portion of the insulation spacer in contact with the insulation gas is covered with a cover film formed by hardening powder of any of thermoplastic resin, glass, cellulose, and polymer resin made of carbon and hydrogen having a particle size of 100 μm or less with epoxy resin.
摘要翻译: 一种气体绝缘开关装置,包括安装在填充有绝缘气体的接地罐内的高压导体,高压导体支撑在绝缘垫片上,从而固定到接地罐。 气体绝缘体开关装置的结构是,与绝缘气体接触的绝缘隔板的绝缘部分被覆盖有由热塑性树脂,玻璃,纤维素和由碳制成的聚合物树脂的任一种的粉末形成的覆盖膜 和具有100μm以下的粒径的环氧树脂的氢。
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公开(公告)号:US09349501B2
公开(公告)日:2016-05-24
申请号:US14367990
申请日:2012-07-26
申请人: Takashi Miyamoto , Yuko Sawada , Yukio Ozaki , Hitoshi Sadakuni , Shohei Sasayama , Kazuki Kubo , Tatsuya Okawa
发明人: Takashi Miyamoto , Yuko Sawada , Yukio Ozaki , Hitoshi Sadakuni , Shohei Sasayama , Kazuki Kubo , Tatsuya Okawa
IPC分类号: H01H33/64 , H01B3/56 , C09D163/00 , H01B3/40 , H02G5/06
CPC分类号: H01B3/56 , C09D163/00 , H01B3/40 , H01H33/64 , H02G5/068 , Y10T29/49105
摘要: A gas insulated switchgear includes a high-voltage conductor installed inside a ground tank filled with an insulation gas and the high-voltage conductor is supported on an insulation spacer and thereby fixed to the ground tank. The gas insulator switchgear is configured in such a manner that an insulation portion of the insulation spacer in contact with the insulation gas is covered with a cover film formed by hardening powder of any of thermoplastic resin, glass, cellulose, and polymer resin made of carbon and hydrogen having a particle size of 100 μm or less with epoxy resin.
摘要翻译: 一种气体绝缘开关装置,包括安装在填充有绝缘气体的接地罐内的高压导体,高压导体支撑在绝缘垫片上,从而固定到接地罐。 气体绝缘体开关装置的结构是,与绝缘气体接触的绝缘隔板的绝缘部分被覆盖有由热塑性树脂,玻璃,纤维素和由碳制成的聚合物树脂的任一种的粉末形成的覆盖膜 和具有100μm以下的粒径的环氧树脂的氢。
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公开(公告)号:US20080036083A1
公开(公告)日:2008-02-14
申请号:US11882662
申请日:2007-08-03
申请人: Yuko Sawada , Shinji Baba , Takahiro Sugimura
发明人: Yuko Sawada , Shinji Baba , Takahiro Sugimura
CPC分类号: H01L23/3128 , H01L21/563 , H01L21/565 , H01L23/293 , H01L23/3735 , H01L23/53295 , H01L24/48 , H01L25/03 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/0558 , H01L2224/05655 , H01L2224/16 , H01L2224/48091 , H01L2224/4824 , H01L2224/73203 , H01L2224/73204 , H01L2224/73215 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/13091 , H01L2924/15311 , H05K3/305 , H05K2201/068 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: The semiconductor device which can prevent destruction of a low dielectric constant film and a bump's destruction which consists of lead free solder both is obtained.A semiconductor package which has a semiconductor chip including a low dielectric constant film and a bump which consists of lead free solder, a wiring substrate by which flip chip junction of the semiconductor package was done via the bump, and under-filling resin, with which a gap between the semiconductor package and the wiring substrate is filled up, are provided. As for under-filling resin, the glass transition temperature is equal to or more than 125° C., the coefficient of thermal expansion in 125° C. is less than 40 ppm/° C., and the elastic modulus in 25° C. is less than 9 GPa.
摘要翻译: 可以获得能够防止低介电常数膜的破坏的半导体器件和由无铅焊料构成的凸起的破坏。 一种半导体封装,其具有包括低介电常数膜和由无铅焊料构成的凸块的半导体芯片,通过凸块进行半导体封装的倒装芯片接合的布线基板和未充填树脂, 提供半导体封装和布线基板之间的间隙。 对于填充不足的树脂,玻璃化转变温度等于或大于125℃,125℃的热膨胀系数小于40ppm /℃,在25℃下的弹性模量 小于9GPa。
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