Optical fiber cable having a sheath and for setting in a conduit
    1.
    发明授权
    Optical fiber cable having a sheath and for setting in a conduit 有权
    具有护套并设置在导管中的光纤电缆

    公开(公告)号:US08837886B2

    公开(公告)日:2014-09-16

    申请号:US13054968

    申请日:2009-08-06

    IPC分类号: G02B6/44

    CPC分类号: G02B6/443 G02B6/4402

    摘要: An optical fiber cable which is suitably set in a conduit by pushing the optical fiber cable into the conduit so as to insert the optical fiber cable through the conduit and which does not reduce the ease of manufacture and the mechanical characteristics of the optical fiber cable. The optical fiber cable includes an optical fiber cable core wire and a sheath covering the optical fiber cable core wire, wherein a dynamic friction coefficient between a surface of the sheath of the optical fiber cable and a surface of a sheath of another optical fiber cable is 0.17 to 0.34, and a dynamic friction coefficient between the surface of the sheath of the optical fiber cable and a surface of a sheet composed of polyvinyl chloride is 0.30 to 0.40.

    摘要翻译: 一种光缆,其通过将光纤电缆推入导管中适当地设置在导管中,以便将光纤电缆插入导管中,并且不会降低光纤电缆的制造容易性和机械特性。 光缆包括光纤电缆芯线和覆盖光缆芯线的护套,其中光纤电缆护套的表面与另一光纤电缆护套表面之间的动摩擦系数为 0.17〜0.34,光缆的护套表面和由聚氯乙烯构成的片的表面之间的动摩擦系数为0.30〜0.40。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20110278581A1

    公开(公告)日:2011-11-17

    申请号:US13094915

    申请日:2011-04-27

    IPC分类号: H01L29/04 H01L21/84

    摘要: The reliability of a semiconductor device including a MOSFET formed over an SOI substrate is improved. A manufacturing method of the semiconductor device is simplified. A semiconductor device with n-channel MOSFETsQn formed over an SOI substrate SB includes an n+-type semiconductor region formed as a diffusion layer over an upper surface of a support substrate under a BOX film, and a contact plug CT2 electrically coupled to the n+-type semiconductor region and penetrating an element isolation region, which can control the potential of the support substrate. At a plane of the SOI substrate SB, the n-channel MOSFETsQn each extend in a first direction, and are arranged between the contact plugs CT2 formed adjacent to each other in the first direction.

    摘要翻译: 提高了在SOI衬底上形成的MOSFET的半导体器件的可靠性。 半导体器件的制造方法简化。 在SOI衬底SB上形成的具有n沟道MOSFET Qn的半导体器件包括在BOX膜下形成为在支撑衬底的上表面上的扩散层的n +型半导体区域,以及与n + 并且穿透可以控制支撑衬底的电位的元件隔离区域。 在SOI衬底SB的平面上,n沟道MOSFETsn各自沿第一方向延伸,并且布置在沿第一方向彼此相邻形成的接触插头CT2之间。

    OPTICAL FIBER CABLE
    4.
    发明申请
    OPTICAL FIBER CABLE 有权
    光纤电缆

    公开(公告)号:US20110255834A1

    公开(公告)日:2011-10-20

    申请号:US13142163

    申请日:2009-12-24

    IPC分类号: G02B6/44

    CPC分类号: G02B6/4402 G02B6/4433

    摘要: An optical fiber cable enabling further reduction of possibilities of disconnection of optical fiber due to, for instance, cicada oviposition. The optical fiber cable (10) is provided with: an optical fiber core (1); a tension member (2), which is arranged in parallel to the optical fiber core (1) on one side or on the both sides of the optical fiber core (1); and a sheath (3) which integrally covers the optical fiber core (1) and the tension member (2). At least one portion of the sheath (3) is composed of a polymeric material having a yield point stress of 12 MPa or higher.

    摘要翻译: 一种光纤电缆,能够进一步降低由于例如蝉产卵而导致的光纤断开的可能性。 光缆(10)设有:光纤芯(1); 张力构件(2),其在所述光纤芯(1)的一侧或两侧平行于所述光纤芯(1)布置; 以及一体地覆盖光纤芯(1)和张紧构件(2)的护套(3)。 护套(3)的至少一部分由屈服点应力为12MPa以上的聚合物材料构成。

    METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING CAPACITOR ELEMENT
    7.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING CAPACITOR ELEMENT 审中-公开
    制造具有电容元件的半导体集成电路器件的制造方法

    公开(公告)号:US20100001329A1

    公开(公告)日:2010-01-07

    申请号:US12559274

    申请日:2009-09-14

    IPC分类号: H01L27/11 H01L27/108

    摘要: In a complete CMOS SRAM having a memory cell composed of six MISFETs formed over a substrate, a capacitor element having a stack structure is formed of a lower electrode covering the memory cell, an upper electrode, and a capacitor insulating film (dielectric film) interposed between the lower electrode and the upper electrode. One electrode (the lower electrode) of the capacitor element is connected to one storage node of a flip-flop circuit, and the other electrode (the upper electrode) is connected to the other storage node. As a result, the storage node capacitance of the memory cell of the SRAM is increased to improve the soft error resistance.

    摘要翻译: 在具有由衬底上形成的六个MISFET构成的存储单元的完整CMOS SRAM中,具有堆叠结构的电容器元件由覆盖存储单元的下电极,上电极和插入了电容器绝缘膜(电介质膜)的电极形成 在下电极和上电极之间。 电容器元件的一个电极(下电极)连接到触发器电路的一个存储节点,另一个电极(上电极)连接到另一个存储节点。 结果,SRAM的存储单元的存储节点电容增加,以提高软错误电阻。

    Method of manufacturing semiconductor integrated circuit device having capacitor element
    10.
    发明授权
    Method of manufacturing semiconductor integrated circuit device having capacitor element 有权
    具有电容器元件的半导体集成电路器件的制造方法

    公开(公告)号:US07199433B2

    公开(公告)日:2007-04-03

    申请号:US10756305

    申请日:2004-01-14

    IPC分类号: H01L27/108

    摘要: In a complete CMOS SRAM having a memory cell composed of six MISFETs formed over a substrate, a capacitor element having a stack structure is formed of a lower electrode covering the memory cell, an upper electrode, and a capacitor insulating film (dielectric film) interposed between the lower electrode and the upper electrode. One electrode (the lower electrode) of the capacitor element is connected to one storage node of a flip-flop circuit, and the other electrode (the upper electrode) is connected to the other storage node. As a result, the storage node capacitance of the memory cell of the SRAM is increased to improve the soft error resistance.

    摘要翻译: 在具有由衬底上形成的六个MISFET构成的存储单元的完整CMOS SRAM中,具有堆叠结构的电容器元件由覆盖存储单元的下电极,上电极和插入了电容器绝缘膜(电介质膜)的电极形成 在下电极和上电极之间。 电容器元件的一个电极(下电极)连接到触发器电路的一个存储节点,另一个电极(上电极)连接到另一个存储节点。 结果,SRAM的存储单元的存储节点电容增加,以提高软错误电阻。