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公开(公告)号:US09033004B2
公开(公告)日:2015-05-19
申请号:US13477616
申请日:2012-05-22
申请人: Katsuro Mishima , Yutaka Itou , Hiraku Murayama , Hideo Satou
发明人: Katsuro Mishima , Yutaka Itou , Hiraku Murayama , Hideo Satou
CPC分类号: A61M25/09 , A61M2025/09091 , A61M2025/09133 , A61M2025/0915
摘要: A guide wire includes a wire body having a first wire disposed at a distal end and a second wire joined to a proximal end of the first wire at a joint by welding. The joint is curved. In the joint, at least one component (e.g., Ti) of the material of the first wire decreases toward the proximal end and at least one component (e.g., Fe) of the material of the second wire decreases toward the distal end. When a tensile test is conducted on a region of the wire body including the joint, the region of the wire body has, in a tensile load and elongation diagram, an elastic section extending substantially straight upwardly to the right, a yield section extending substantially horizontally or upwardly to the right from the elastic section, and a substantially straight section extending upwardly to the right from the yield section.
摘要翻译: 引导线包括具有设置在远端的第一线的线主体和通过焊接在接头处连接到第一线的近端的第二线。 关节弯曲。 在接头中,第一线材料的至少一个部件(例如Ti)朝向近端减小,并且第二线材料的至少一个部件(例如,Fe)朝向远端减小。 当在包括接头的线体的区域上进行拉伸试验时,线体的区域在拉伸载荷和延伸率图中具有基本向上向右延伸的弹性部分,基本上水平地延伸的屈服部分 或从弹性部分向上或向右的右侧,以及从屈服部分向右向上延伸的基本上直的部分。
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公开(公告)号:US08348860B2
公开(公告)日:2013-01-08
申请号:US13247414
申请日:2011-09-28
申请人: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
发明人: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
IPC分类号: A61B5/00
CPC分类号: A61M25/09 , A61M2025/09083 , A61M2025/09108
摘要: A method of making a guide wire involves butting a connection end face at a proximal end of a first wire against a connection end face at a distal end of a second wire while applying voltage and a pressing force to weld together the first and second wires at a welded portion. The welded portion forms a projection that projects outwardly in an outer peripheral direction relative to portions of the first and second wire adjacent the projection. The outer dimension of the projection at the welded portion is adjusted so that upon completing adjusting the outer dimension of the projection the projection still projects outwardly in the outer peripheral direction relative to the portions of the first and second wire adjacent the projection.
摘要翻译: 制造导丝的方法包括将第一线的近端处的连接端面与第二线的远端处的连接端面对接,同时施加电压和压力以将第一和第二线焊接在一起 焊接部分。 焊接部形成相对于邻近突起的第一和第二线的部分在外周方向向外突出的突起。 调整焊接部分处的突起的外部尺寸,使得在完成调整突起的外部尺寸后,突出部相对于邻近突起的第一和第二线的部分在外周方向上仍向外突出。
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公开(公告)号:US08313445B2
公开(公告)日:2012-11-20
申请号:US12842458
申请日:2010-07-23
申请人: Katsuro Mishima , Yutaka Itou , Hiraku Murayama , Hideo Satou
发明人: Katsuro Mishima , Yutaka Itou , Hiraku Murayama , Hideo Satou
IPC分类号: A61M25/00
CPC分类号: A61M25/09 , A61M2025/09091 , A61M2025/09133 , A61M2025/0915
摘要: A guide wire includes a wire body having a first wire disposed at a distal end and a second wire joined to a proximal end of the first wire at a joint by welding. The joint is curved. In the joint, at least one component (e.g., Ti) of the material of the first wire decreases toward the proximal end and at least one component (e.g., Fe) of the material of the second wire decreases toward the distal end. When a tensile test is conducted on a region of the wire body including the joint, the region of the wire body has, in a tensile load and elongation diagram, an elastic section extending substantially straight upwardly to the right, a yield section extending substantially horizontally or upwardly to the right from the elastic section, and a substantially straight section extending upwardly to the right from the yield section.
摘要翻译: 引导线包括具有设置在远端的第一线的线主体和通过焊接在接头处连接到第一线的近端的第二线。 关节弯曲。 在接头中,第一线材料的至少一个部件(例如Ti)朝向近端减小,并且第二线材料的至少一个部件(例如,Fe)朝向远端减小。 当在包括接头的线体的区域上进行拉伸试验时,线体的区域在拉伸载荷和延伸率图中具有基本向上向右延伸的弹性部分,基本上水平地延伸的屈服部分 或从弹性部分向上或向右的右侧,以及从屈服部分向右向上延伸的基本上直的部分。
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公开(公告)号:US08172774B2
公开(公告)日:2012-05-08
申请号:US12051950
申请日:2008-03-20
申请人: Yutaka Itou
发明人: Yutaka Itou
IPC分类号: A61M25/00
CPC分类号: A61M25/09 , A61M2025/09133 , A61M2025/0915 , A61M2025/09175
摘要: A guide wire includes a wire body having a plate-shaped reshapeable section at a distal part thereof, wherein the reshapeable section is provided along the longitudinal direction thereof with a plurality of bent parts bent in opposite directions. At least one of the bent parts is more susceptible to plastic deformation than other parts of the reshapeable section.
摘要翻译: 引导线包括在其远端具有板状可再形成部分的线主体,其中可再形成部分沿着其纵向设置有多个相反方向弯曲的弯曲部分。 弯曲部分中的至少一个比可再形成部分的其它部分更容易受到塑性变形的影响。
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公开(公告)号:US08124905B2
公开(公告)日:2012-02-28
申请号:US11797073
申请日:2007-04-30
申请人: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
发明人: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
IPC分类号: B21F15/08
CPC分类号: A61M25/09 , A61M2025/09083 , A61M2025/09108
摘要: A method of making a guide wire involves butting a connection end face at a proximal end of a first wire against a connection end face at a distal end of a second wire while applying voltage and a pressing force to weld together the first and second wires at a welded portion. The welded portion forms a projection that projects outwardly in an outer peripheral direction relative to portions of the first and second wire adjacent the projection. The outer dimension of the projection at the welded portion is adjusted so that upon completing adjusting the outer dimension of the projection the projection still projects outwardly in the outer peripheral direction relative to the portions of the first and second wire adjacent the projection.
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公开(公告)号:US08109887B2
公开(公告)日:2012-02-07
申请号:US11878141
申请日:2007-07-20
申请人: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
发明人: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
IPC分类号: A61B5/00
CPC分类号: A61M25/09 , A61M2025/09083 , A61M2025/09108
摘要: A method of making a guide wire involves butting a connection end face at a proximal end of a first wire against a connection end face at a distal end of a second wire while applying voltage and a pressing force to weld together the first and second wires at a welded portion. The welded portion forms a projection that projects outwardly in an outer peripheral direction relative to portions of the first and second wire adjacent the projection. The outer dimension of the projection at the welded portion is adjusted so that upon completing adjusting the outer dimension of the projection the projection still projects outwardly in the outer peripheral direction relative to the portions of the first and second wire adjacent the projection.
摘要翻译: 制造导丝的方法包括将第一线的近端处的连接端面与第二线的远端处的连接端面对接,同时施加电压和压力以将第一和第二线焊接在一起 焊接部分。 焊接部形成相对于邻近突起的第一和第二线的部分在外周方向向外突出的突起。 调整焊接部分处的突起的外部尺寸,使得在完成调整突起的外部尺寸后,突出部相对于邻近突起的第一和第二线的部分在外周方向上仍向外突出。
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公开(公告)号:US20110175232A1
公开(公告)日:2011-07-21
申请号:US12976618
申请日:2010-12-22
申请人: Yukitoshi OTA , Hiroshige Hirano , Yutaka Itou
发明人: Yukitoshi OTA , Hiroshige Hirano , Yutaka Itou
IPC分类号: H01L23/48
CPC分类号: H01L24/05 , H01L23/522 , H01L2224/04042 , H01L2224/05093 , H01L2224/05554 , H01L2224/05556 , H01L2224/05558 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01082
摘要: A semiconductor device includes an electrode pad formed above a semiconductor substrate, and being a connecting portion for an external electrical connection; a multilayer body including a plurality of first interconnect layers formed in a plurality of insulating films stacked between the semiconductor substrate and the connecting portion and including an upper interconnect connected to the connecting portion, and a via configured to connect the first interconnect layers; a ring body formed in the plurality of insulating films to surround the multilayer body without interposing space, and including a plurality of second interconnect layers and at least one line via linearly connecting the second interconnect layers; and a lead line electrically connecting the connecting portion to an internal circuit. The multilayer body is connected to the ring body by at least one of the plurality of first interconnect layers. The lead line is connected to the ring body.
摘要翻译: 半导体器件包括形成在半导体衬底上的电极焊盘,并且是用于外部电连接的连接部分; 多层体,包括形成在所述半导体衬底和所述连接部之间的多个绝缘膜中的多个第一互连层,并且包括连接到所述连接部的上互连件,以及通孔,被配置为连接所述第一互连层; 形成在所述多个绝缘膜中的环体,以在不插入空间的情况下包围所述多层体,并且包括多个第二互连层和至少一条经由线连接所述第二互连层的线; 以及将连接部电连接到内部电路的引线。 多层体通过多个第一互连层中的至少一个连接到环体。 引线与环体连接。
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公开(公告)号:US07770779B2
公开(公告)日:2010-08-10
申请号:US12492423
申请日:2009-06-26
申请人: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
发明人: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
IPC分类号: B23K31/02
CPC分类号: A61M25/09 , A61M2025/09091 , A61M2025/0915 , B23K31/02 , Y10T29/49888
摘要: A guide wire includes a wire member having a first wire disposed on the distal side of the guide wire, and a second wire disposed on the proximal side from the first wire. The second wire is made from a material having an elastic modulus larger than that of the first wire. For example, the first wire is made from a superelastic alloy, and the second wire is made from a stainless steel. The first wire is joined to the second wire at a welded portion by welding. A coil is disposed on the distal side from the first wire. A cover layer is formed on the outer peripheral surface of the wire member in such a manner as to cover at least the welded portion. The cover layer is made from a material capable of reducing the friction of the cover layer, for example, a fluorocarbon resin or a hydrophilic material, to thereby improve the sliding performance of the guide wire. Such a guide wire is excellent in operationality and kink resistance.
摘要翻译: 导线包括具有布置在导丝的远侧上的第一线的线构件和设置在距离第一线的近侧的第二线。 第二线由具有大于第一线的弹性模量的材料制成。 例如,第一线由超弹性合金制成,第二线由不锈钢制成。 第一线通过焊接在焊接部分与第二线接合。 线圈设置在距离第一线的远端侧。 覆盖层以至少覆盖焊接部的方式形成在线构件的外周面上。 覆盖层由能够降低覆盖层的摩擦的材料,例如氟碳树脂或亲水材料制成,从而提高导丝的滑动性能。 这种导丝的操作性和扭结阻力优异。
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公开(公告)号:US20100090344A1
公开(公告)日:2010-04-15
申请号:US12540043
申请日:2009-08-12
申请人: Yukitoshi Ota , Hiroshige Hirano , Yutaka Itou , Koji Koike
发明人: Yukitoshi Ota , Hiroshige Hirano , Yutaka Itou , Koji Koike
CPC分类号: H01L24/05 , H01L22/32 , H01L23/53223 , H01L23/53238 , H01L2224/02166 , H01L2224/05073 , H01L2224/05093 , H01L2224/05096 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05624 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/04941 , H01L2924/00014
摘要: A semiconductor device includes an insulating film formed on a semiconductor substrate, a contact wiring formed in the insulating film, a protective film formed on the contact wiring and the insulating film, an opening portion formed in the protective film, the contact wiring being exposed through the opening portion, and an electrode pad formed in the opening portion, the electrode pad being electrically connected to the contact wiring. A region where the contact wiring is not provided is present below the opening portion.
摘要翻译: 半导体器件包括形成在半导体衬底上的绝缘膜,形成在绝缘膜中的接触布线,形成在接触布线和绝缘膜上的保护膜,形成在保护膜中的开口部分,接触布线通过 开口部分和形成在开口部分中的电极焊盘,电极焊盘电连接到接触布线。 未设置接触配线的区域存在于开口部的下方。
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公开(公告)号:US07637875B2
公开(公告)日:2009-12-29
申请号:US11902862
申请日:2007-09-26
申请人: Yutaka Itou
发明人: Yutaka Itou
CPC分类号: A61M25/09 , A61M2025/09083 , A61M2025/09133
摘要: A guide wire includes a wire body having a tapered portion disposed on a distal end portion thereof and having an outside diameter progressively reduced toward a distal end thereof. The guide wire also includes a coil having a first coil portion covering an outer circumferential surface of the tapered portion and a second coil portion disposed adjacent to a proximal end of the first coil portion and covering an outer circumferential surface of a constant-outside-diameter portion of the wire body. Initial tensile forces of the first coil portion are greater than initial tensile forces of the second coil portion.
摘要翻译: 导线包括线体,该线体具有设置在其远端部分上的锥形部分,并且具有朝向其远端逐渐减小的外径。 导线还包括具有覆盖锥形部的外周面的第一线圈部的线圈和与第一线圈部的基端相邻配置的第二线圈部,并且覆盖恒定外径的外周面 线体的一部分。 第一线圈部分的初始拉伸力大于第二线圈部分的初始拉伸力。
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