公开(公告)号：US08609995B2

公开(公告)日：2013-12-17

申请号：US13184661

申请日：2011-07-18

申请人： Shinnosuke Maeda ,  Satoshi Hirano ,  Yuuki Shiiba

发明人： Shinnosuke Maeda ,  Satoshi Hirano ,  Yuuki Shiiba

IPC分类号： H05K1/00

CPC分类号： H05K3/0035 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0373 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/09827 ,  Y10T29/49165 ,  H01L2924/00

摘要： Disclosed is a manufacturing method of a multilayer wiring board. The multilayer wiring board includes an outer resin insulation layer made of an insulating resin material, containing a filler of inorganic oxide and having an outer surface defining a chip mounting area to which an electronic chip is mounted with an underfill material filled in between the outer resin insulation layer and the electronic chip and holes through which conductor parts are exposed. The manufacturing method includes a hole forming step of forming the holes in the outer resin insulation layer by laser processing, a desmear treatment step of, after the hole forming step, removing smears from inside the holes of the outer resin insulation layer, and a filler reducing step of, after the desmear treatment step, reducing the amount of the filler exposed at the outer surface of the outer resin insulation layer.

摘要翻译： 公开了一种多层布线板的制造方法。 多层布线基板包括由绝缘树脂材料制成的外部树脂绝缘层，其包含无机氧化物的填料，并且具有限定芯片安装区域的外表面，电子芯片安装有填充在外部树脂之间的底部填充材料 绝缘层以及导体部件露出的电子芯片和孔。 该制造方法包括：通过激光加工在外树脂绝缘层中形成孔的孔形成步骤，在孔形成步骤之后的去污处理步骤，从外树脂绝缘层的孔内部除去污迹，以及填料 在去污处理步骤之后，减少在外树脂绝缘层的外表面暴露的填料的量。

公开(公告)号：US20120018194A1

公开(公告)日：2012-01-26

申请号：US13184661

申请日：2011-07-18

申请人： Shinnosuke MAEDA ,  Satoshi HIRANO ,  Yuuki SHIIBA

发明人： Shinnosuke MAEDA ,  Satoshi HIRANO ,  Yuuki SHIIBA

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K3/0035 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0373 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/09827 ,  Y10T29/49165 ,  H01L2924/00

摘要： Disclosed is a manufacturing method of a multilayer wiring board. The multilayer wiring board includes an outer resin insulation layer made of an insulating resin material, containing a filler of inorganic filler and having an outer surface defining a chip mounting area to which an electronic chip is mounted with an underfill material filled in between the outer resin insulation layer and the electronic chip and holes through which conductor parts are exposed. The manufacturing method includes a hole forming step of forming the holes in the outer resin insulation layer by laser processing, a desmear treatment step of, after the hole forming step, removing smears from inside the holes of the outer resin insulation layer, and a filler reducing step of, after the desmear treatment step, reducing the amount of the filler exposed at the outer surface of the outer resin insulation layer.

摘要翻译： 公开了一种多层布线板的制造方法。 多层布线基板包括由绝缘树脂材料制成的外部树脂绝缘层，其包含无机填料的填料并且具有限定芯片安装区域的外表面，电子芯片安装在该芯片安装区域，底部填充材料填充在外部树脂 绝缘层以及导体部件露出的电子芯片和孔。 该制造方法包括：通过激光加工在外树脂绝缘层中形成孔的孔形成步骤，在孔形成步骤之后的去污处理步骤，从外树脂绝缘层的孔内部除去污迹，以及填料 在去污处理步骤之后，减少在外树脂绝缘层的外表面暴露的填料的量。