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59 条记录 (耗时 0.031 秒)

    Method and system for connecting clients with server
    2.
    发明授权
    Method and system for connecting clients with server 有权
    将客户端与服务器连接的方法和系统

    公开(公告)号：US08996704B2

    公开(公告)日：2015-03-31

    申请号：US13609988

    申请日：2012-09-11

    申请人： Zhihong Wang

    发明人： Zhihong Wang

    IPC分类号： H04L29/06 ,  H04L29/08

    CPC分类号： H04L65/1069 ,  H04L67/14

    摘要： The present invention discloses a method for connecting clients with a server. The method includes: the client obtains random number seed information; the client calculates out a random delay time according to the random number seed information and a random function after the client is disconnected from the server, wherein the random delay time is a delay time for reconnection between the client and the server; and the client sends a connection request to the server upon expiry of the random delay time. Therefore, when the server is restarted or breaks down, each client delays the connection according to the random delay time calculated by them respectively, thereby preventing plenty of clients from requesting to connect to the server simultaneously and avoiding service interruption of the server.

    摘要翻译： 本发明公开了一种用于将客户端与服务器连接的方法。 该方法包括：客户端获取随机数种子信息; 客户端根据随机数种子信息计算出随机延迟时间，以及客户端与服务器断开连接后的随机功能，其中随机延迟时间是客户端与服务器之间重新连接的延迟时间; 并且客户端在随机延迟时间到期时向服务器发送连接请求。 因此，当服务器重新启动或分解时，每个客户端分别根据它们计算的随机延迟时间来延迟连接，从而防止大量客户端同时请求连接到服务器，并避免服务器的服务中断。

    Automatic selection of reference spectra library
    3.
    发明授权
    Automatic selection of reference spectra library 有权
    自动选择参考光谱库

    公开(公告)号：US08755928B2

    公开(公告)日：2014-06-17

    申请号：US13095802

    申请日：2011-04-27

    申请人： Jimin Zhang ,  Harry Q. Lee ,  Zhihong Wang ,  Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu

    发明人： Jimin Zhang ,  Harry Q. Lee ,  Zhihong Wang ,  Jeffrey Drue David ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu

    IPC分类号： G06F19/24

    CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/05 ,  B24B49/12 ,  G01J3/28

    摘要： A computer-implemented method of generating reference spectra includes polishing a plurality of set-up substrates, the plurality of set-up substrates comprising at least three set-up substrates, measuring a sequence of spectra from each of the plurality of set-up substrates during polishing with an in-situ optical monitoring system to provide a plurality of sequences of spectra, generating a plurality of sequences of potential reference spectra from the plurality of sequences of spectra, determining which sequence of potential reference spectra of the plurality of sequences provides a best match to remaining sequences of the plurality of sequences, and storing the sequence of potential reference spectra determined to provide the best match as reference spectra, and selecting and storing the sequence of potential reference spectra.

    摘要翻译： 计算机实现的产生参考光谱的方法包括抛光多个设置基板，所述多个设置基板包括至少三个设置基板，测量来自多个设置基板中的每一个的光谱序列 在用原位光学监测系统进行抛光时提供多个光谱序列，从多个光谱序列产生多个潜在参考光谱序列，确定多个序列中的哪个潜在参考光谱序列提供一个 最佳匹配多个序列的剩余序列，并存储确定为提​​供最佳匹配的参考光谱序列作为参考光谱，以及选择和存储潜在参考光谱序列。

    Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing
    4.
    发明申请
    Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing 审中-公开
    在化学机械抛光相同的台板上多台基板的抛光控制

    公开(公告)号：US20140024293A1

    公开(公告)日：2014-01-23

    申请号：US13553209

    申请日：2012-07-19

    申请人： Jimin Zhang ,  Zhihong Wang ,  David H. Mai ,  Ingemar Carlsson ,  Stephen Jew ,  Boguslaw A. Swedek

    发明人： Jimin Zhang ,  Zhihong Wang ,  David H. Mai ,  Ingemar Carlsson ,  Stephen Jew ,  Boguslaw A. Swedek

    IPC分类号： B24B49/00 ,  B24B49/12 ,  B24B49/10

    CPC分类号： B24B37/013 ,  B24B49/10 ,  B24B49/12

    摘要： A polishing method includes simultaneously polishing a first substrate and a second substrate on the same polishing pad, storing a default overpolishing time, determining first and second polishing endpoint times of the first and substrates with the in-situ monitoring system, determining a difference between the first and second polishing endpoint times, and determining whether the difference exceeds a threshold. If the difference is less than the threshold, then an overpolishing stop time is calculated and polishing of the first substrate and the second substrates is halted simultaneously at the overpolishing stop time. If the difference is greater than the threshold, then first and second overpolishing stop times that equal the first and second endpoint times plus the default overpolishing time are calculated, and polishing of the first and second substrates is halted at the first and second overpolishing stop times, respectively.

    摘要翻译： 抛光方法包括同时在同一抛光垫上抛光第一基底和第二基底，存储默认的过度抛光时间，用原位监测系统确定第一和第二基底的第一和第二抛光终点时间，确定 第一和第二抛光终点时间，以及确定差异是否超过阈值。 如果差小于阈值，则计算过度抛光停止时间，并且在过度抛光停止时间同时停止第一基板和第二基板的抛光。 如果该差值大于阈值，则计算等于第一和第二终点时间加上默认过度抛光时间的第一和第二过度抛光停止时间，并且在第一和第二过度抛光停止时间停止第一和第二基板的抛光 ， 分别。

    METHOD AND SYSTEM FOR CONNECTING CLIENTS WITH SERVER
    6.
    发明申请
    METHOD AND SYSTEM FOR CONNECTING CLIENTS WITH SERVER 有权
    将客户端与服务器连接的方法和系统

    公开(公告)号：US20130246634A1

    公开(公告)日：2013-09-19

    申请号：US13609988

    申请日：2012-09-11

    申请人： Zhihong WANG

    发明人： Zhihong WANG

    IPC分类号： H04L29/06

    CPC分类号： H04L65/1069 ,  H04L67/14

    摘要： The present invention discloses a method for connecting clients with a server. The method includes: the client obtains random number seed information; the client calculates out a random delay time according to the random number seed information and a random function after the client is disconnected from the server, wherein the random delay time is a delay time for reconnection between the client and the server; and the client sends a connection request to the server upon expiry of the random delay time. Therefore, when the server is restarted or breaks down, each client delays the connection according to the random delay time calculated by them respectively, thereby preventing plenty of clients from requesting to connect to the server simultaneously and avoiding service interruption of the server.

    摘要翻译： 本发明公开了一种用于将客户端与服务器连接的方法。 该方法包括：客户端获取随机数种子信息; 客户端根据随机数种子信息计算出随机延迟时间，以及客户端与服务器断开连接后的随机功能，其中随机延迟时间是客户端与服务器之间重新连接的延迟时间; 并且客户端在随机延迟时间到期时向服务器发送连接请求。 因此，当服务器重新启动或分解时，每个客户端分别根据它们计算的随机延迟时间来延迟连接，从而防止大量客户端同时请求连接到服务器，并避免服务器的服务中断。

    Method and apparatus for evaluating polishing pad conditioning
    7.
    发明授权
    Method and apparatus for evaluating polishing pad conditioning 失效
    评估抛光垫调理的方法和装置

    公开(公告)号：US07699972B2

    公开(公告)日：2010-04-20

    申请号：US11370474

    申请日：2006-03-08

    申请人： Zhihong Wang ,  Yongqi Hu ,  Stan D. Tsai

    发明人： Zhihong Wang ,  Yongqi Hu ,  Stan D. Tsai

    IPC分类号： C25F3/02 ,  B23H5/06

    CPC分类号： B23H5/08 ,  B24B53/017 ,  C25F3/02 ,  C25F7/00

    摘要： A method and apparatus for evaluating a conditioned electrochemical mechanical polishing pad are provided. A polishing pad is conditioned using a first set of process conditions. A sheet wafer and a residue wafer are polished on the polishing pad. The removal rates of one or more materials from the sheet wafer and the residue wafer are measured. A normalized removal rate is calculated. The polishing pad is further conditioned if the normalized removal rate is not within a minimum value and a maximum value. In one embodiment, the normalized removal rate comprises a ratio of the removal rate of the residue wafer to the removal rate of the sheet wafer.

    摘要翻译： 提供了一种评价调理电化学机械抛光垫的方法和装置。 使用第一组工艺条件对抛光垫进行调理。 在抛光垫上抛光片状晶片和残留晶片。 测量来自片状晶片和残留晶片的一种或多种材料的去除速率。 计算归一化的去除率。 如果归一化的去除速率不在最小值和最大值内，抛光垫被进一步调节。 在一个实施例中，归一化去除速率包括残余晶片的去除速率与片晶片的去除速率的比率。

    Process for high copper removal rate with good planarization and surface finish
    8.
    发明申请
    Process for high copper removal rate with good planarization and surface finish 审中-公开
    具有良好的平坦化和表面光洁度的高铜去除率的工艺

    公开(公告)号：US20070235344A1

    公开(公告)日：2007-10-11

    申请号：US11399560

    申请日：2006-04-06

    申请人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    发明人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    IPC分类号： B23H5/08

    CPC分类号： B23H5/08 ,  C25F3/02 ,  H01L21/32125

    摘要： A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 Å/min and greater can be achieved.

    摘要翻译： 公开了一种用于电化学机械抛光（ECMP）的方法。 通过控制压板和头部的表面速度，控制施加到垫的电流以及预选在全导电抛光垫上的穿孔密度来提高晶片上层的抛光速率和表面光洁度。 ECMP在较低的下压力下产生高得多的去除率，良好的表面光洁度和良好的平面化效率。 通常，增加压板和头部的表面速度将增加表面平滑度。 此外，增加晶片上的电流密度将增加表面平滑度。 在晶片的中心，中间和边缘之间的晶片表面的平滑度几乎没有差别。 对于铜，可以实现10,000 / min以上的去除率。

    Process and composition for electrochemical mechanical polishing
    9.
    发明申请
    Process and composition for electrochemical mechanical polishing 审中-公开
    电化学机械抛光的工艺和组成

    公开(公告)号：US20060249394A1

    公开(公告)日：2006-11-09

    申请号：US11251630

    申请日：2005-10-14

    申请人： Renhe Jia ,  You Wang ,  Zhihong Wang ,  Jie Diao ,  Daxin Mao ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    发明人： Renhe Jia ,  You Wang ,  Zhihong Wang ,  Jie Diao ,  Daxin Mao ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    IPC分类号： C09K13/00 ,  B23H9/00 ,  C25F3/00 ,  C09K13/06

    CPC分类号： C25F3/02 ,  B23H5/08 ,  C09K3/1463

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。