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    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR MANUFACTURING ELECTRONIC DEVICES
    2.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR MANUFACTURING ELECTRONIC DEVICES 有权

    公开(公告)号：US20210130661A1

    公开(公告)日：2021-05-06

    申请号：US16471595

    申请日：2017-12-20

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： John W. McAllister ,  Jingjing Ma ,  Zhong Chen ,  Pierre R. Bieber ,  Petra M. Stegmaier ,  Eike H. Klünker

    IPC: C09J11/08 ,  C09J7/28 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56

    Abstract: The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR ELECTRONIC BONDING APPLICATIONS
    3.
    发明申请
    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR ELECTRONIC BONDING APPLICATIONS 有权

    公开(公告)号：US20210102094A1

    公开(公告)日：2021-04-08

    申请号：US15733468

    申请日：2019-02-08

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Pierre R. Bieber ,  John W. McAllister ,  Benjamin J. Bending ,  Zhong Chen ,  Vasav Sahni

    IPC: C09J7/38 ,  C09J7/35 ,  C08L93/04 ,  C08L47/00 ,  C08L45/02 ,  C08K5/32 ,  C09J123/22

    Abstract: The present disclosure relates to a curable pressure sensitive adhesive composition comprising: a) a butyl rubber component in an amount greater than 40 wt %; b) a tackifier in an amount greater than 1 wt %; c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and d) optionally, a hydrocarbon plasticizer; wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition. In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.

    Pressure-sensitive adhesive compositions for manufacturing electronic devices
    4.
    发明授权
    Pressure-sensitive adhesive compositions for manufacturing electronic devices 有权

    公开(公告)号：US11286407B2

    公开(公告)日：2022-03-29

    申请号：US16471595

    申请日：2017-12-20

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： John W. McAllister ,  Jingjing Ma ,  Zhong Chen ,  Pierre R. Bieber ,  Petra M. Stegmaier ,  Eike H. Klünker

    IPC: H01L29/08 ,  C09J11/08 ,  C09J7/28 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56

    Abstract: The present disclosure relates to an electronic device comprising at least one organic light-emitting diode and a pressure sensitive adhesive composition comprising a synthetic rubber block (co)polymer, and wherein the pressure sensitive adhesive composition has: a) a relative permittivity no greater than 2.50, when measured at an alternating current frequency of 100 kHz according to the test method described in the experimental section; b) a water uptake no greater than 0.60 wt %, when measured after exposure to 60° C. and 95% relative humidity for 120 hours, according to the test method described in the experimental section; and c) optionally, a peel adhesion value above 0.20 N/mm, when measured at 85° C. according to the test method described in the experimental section. In another aspect, the present disclosure is directed to a method of manufacturing an electronic device comprising at least one organic light-emitting diode, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for protecting organic light-emitting devices or organic light-emitting diodes from moisture and air permeation.

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