ADHESIVE AND DAMPING FILM
    1.
    发明申请

    公开(公告)号:US20190106603A1

    公开(公告)日:2019-04-11

    申请号:US16094036

    申请日:2017-04-24

    Abstract: Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between −40° C. and −10° C., and the adhesive has a heat activation temperature between 20° C. and 100° C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent.

    Adhesive and damping film
    2.
    发明授权

    公开(公告)号:US10982116B2

    公开(公告)日:2021-04-20

    申请号:US16094036

    申请日:2017-04-24

    Abstract: Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between −40° C. and −10° C., and the adhesive has a heat activation temperature between 20° C. and 100° C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent.

    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR ELECTRONIC BONDING APPLICATIONS

    公开(公告)号:US20210102094A1

    公开(公告)日:2021-04-08

    申请号:US15733468

    申请日:2019-02-08

    Abstract: The present disclosure relates to a curable pressure sensitive adhesive composition comprising: a) a butyl rubber component in an amount greater than 40 wt %; b) a tackifier in an amount greater than 1 wt %; c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and d) optionally, a hydrocarbon plasticizer; wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition. In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.

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