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公开(公告)号：US20230222079A1
公开(公告)日：2023-07-13
申请号：US18185252
申请日：2023-03-16
Applicant: Advanced Micro Devices, Inc.
Inventor： Robert E. Radke , Christopher M. Jaggers
CPC classification number: G06F13/4027 , H04B10/801
Abstract: A system and method for efficient data transfer in a computing system are described. A computing system includes multiple nodes that receive tasks to process. A bridge interconnect transfers data between two processing nodes without the aid of a system bus on the motherboard. One of the multiple bridge interconnects of the computing system is an optical bridge interconnect that transmits optical information across the optical bridge interconnect between two nodes. The receiving node uses photonic integrated circuits to translate the optical information into electrical information for processing by electrical integrated circuits. One or more nodes switch between using an optical bridge interconnect and a non-optical bridge interconnect based on one or more factors such as measured power consumption and measured data transmission error rates.
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公开(公告)号：US11880248B2
公开(公告)日：2024-01-23
申请号：US17486430
申请日：2021-09-27
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： Christopher M. Jaggers , Christopher M. Helberg
CPC classification number: G06F1/203 , G06F1/1632 , G06F2200/201 , H05K7/20254
Abstract: A docking station for secondary external cooling for mobile computing devices, including: one or more ports for docking a mobile computing device; a docking platform for supporting the mobile computing device; a cooling element; and a thermal interface housed in the docking platform for transferring heat between the mobile computing device and the cooling element.
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公开(公告)号：US11817436B2
公开(公告)日：2023-11-14
申请号：US17360862
申请日：2021-06-28
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： Christopher M. Jaggers
IPC: H01L25/10 , H01L25/18 , H01L23/367 , H01L23/427 , H01L23/467 , H01L23/473
CPC classification number: H01L25/105 , H01L25/18 , H01L23/367 , H01L23/427 , H01L23/467 , H01L23/473
Abstract: An apparatus for a common cooling solution for multiple packages of a common height, including: a first die package; a second die package having a same height as the first die package; and a cooling element thermally coupled to the first die package and the second die package by a planar surface of the cooling element.
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公开(公告)号：US20170347498A1
公开(公告)日：2017-11-30
申请号：US15166563
申请日：2016-05-27
Applicant: Advanced Micro Devices, Inc.
Inventor： Christopher Janak , Steve Capezza , Christopher M. Jaggers , David A. McAfee , Ali Akbar Merrikh , Matthew Grossman , Nicholas Poteracki , Jefferson West , Paul Hughes
CPC classification number: H05K7/20781 , G06F1/20 , G06F2200/201 , H05K7/1488 , H05K7/20736
Abstract: Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.
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Patent Agency Ranking
公开(公告)号：US11864344B2
公开(公告)日：2024-01-02
申请号：US17485966
申请日：2021-09-27
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： Christopher M. Jaggers
CPC classification number: H05K7/20263 , G06F1/182 , H05K7/20254 , G06F1/203
Abstract: A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.
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公开(公告)号：US20220318174A1
公开(公告)日：2022-10-06
申请号：US17218793
申请日：2021-03-31
Applicant: Advanced Micro Devices, Inc.
Inventor： Robert E. Radke , Christopher M. Jaggers
Abstract: A system and method for efficient data transfer in a computing system are described. A computing system includes multiple nodes that receive tasks to process. A bridge interconnect transfers data between two processing nodes without the aid of a system bus on the motherboard. One of the multiple bridge interconnects of the computing system is an optical bridge interconnect that transmits optical information across the optical bridge interconnect between two nodes. The receiving node uses photonic integrated circuits to translate the optical information into electrical information for processing by electrical integrated circuits. One or more nodes switch between using an optical bridge interconnect and a non-optical bridge interconnect based on one or more factors such as measured power consumption and measured data transmission error rates.
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公开(公告)号：US11620248B2
公开(公告)日：2023-04-04
申请号：US17218793
申请日：2021-03-31
Applicant: Advanced Micro Devices, Inc.
Inventor： Robert E. Radke , Christopher M. Jaggers
Abstract: A system and method for efficient data transfer in a computing system are described. A computing system includes multiple nodes that receive tasks to process. A bridge interconnect transfers data between two processing nodes without the aid of a system bus on the motherboard. One of the multiple bridge interconnects of the computing system is an optical bridge interconnect that transmits optical information across the optical bridge interconnect between two nodes. The receiving node uses photonic integrated circuits to translate the optical information into electrical information for processing by electrical integrated circuits. One or more nodes switch between using an optical bridge interconnect and a non-optical bridge interconnect based on one or more factors such as measured power consumption and measured data transmission error rates.
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公开(公告)号：US11201104B2
公开(公告)日：2021-12-14
申请号：US16729924
申请日：2019-12-30
Applicant: Advanced Micro Devices, Inc.
Inventor： Andrew J. McNamara , Swagata P. Kalve , Christopher M. Jaggers
IPC: H01L23/433 , H01L23/367
Abstract: A thermal management system includes an integrated circuit having an active side including a control circuit and a backside including a first set of electrodes distributed across the backside. The thermal management system includes a heat exchanger having a surface including a second set of electrodes. The thermal management system includes a thermal interface material including thermally conductive particles suspended in a fluid. The thermal interface material is disposed between the backside of the integrated circuit and the surface of the heat exchanger. The control circuit is configured to apply an electric field to the thermal interface material using a first electrode of the first set of electrodes and a second electrode of the second set of electrodes to excite at least some of the thermally conductive particles between the first electrode and the second electrode.
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公开(公告)号：US20210202351A1
公开(公告)日：2021-07-01
申请号：US16729924
申请日：2019-12-30
Applicant: Advanced Micro Devices, Inc.
Inventor： Andrew J. McNamara , Swagata P. Kalve , Christopher M. Jaggers
IPC: H01L23/433 , H01L23/367
Abstract: A thermal management system includes an integrated circuit having an active side including a control circuit and a backside including a first set of electrodes distributed across the backside. The thermal management system includes a heat exchanger having a surface including a second set of electrodes. The thermal management system includes a thermal interface material including thermally conductive particles suspended in a fluid. The thermal interface material is disposed between the backside of the integrated circuit and the surface of the heat exchanger. The control circuit is configured to apply an electric field to the thermal interface material using a first electrode of the first set of electrodes and a second electrode of the second set of electrodes to excite at least some of the thermally conductive particles between the first electrode and the second electrode.
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