Charged particle beam exposure apparatus
    1.
    发明授权
    Charged particle beam exposure apparatus 有权
    带电粒子束曝光装置

    公开(公告)号:US09478396B2

    公开(公告)日:2016-10-25

    申请号:US14562095

    申请日:2014-12-05

    Abstract: Provided is a charged particle beam exposure apparatus configured as follows. An electron beam emitted from an electron gun is deformed by an asymmetric illumination optical system to have an elongated section. The electron beam is then applied to a beam shaping aperture plate provided with a plurality of apertures arranged in a line, thereby generating a plurality of electron beams. Exposure of a predetermined pattern is performed on a semiconductor substrate by moving a stage device in a direction orthogonal to line patterns on the semiconductor substrate and turning the plurality of electron beams on or off in synchronization with the movement of the stage device by use of a blanker plate and a final aperture plate.

    Abstract translation: 提供如下配置的带电粒子束曝光装置。 从电子枪发射的电子束由不对称的照明光学系统变形以具有细长的部分。 然后将电子束施加到具有布置成一行的多个孔的束形成孔板,从而产生多个电子束。 通过在半导体衬底上沿垂直于线图案的方向移动舞台装置,并且通过使用第二装置与舞台装置的移动同步地打开或关闭多个电子束来对预定图案进行曝光 挡板和最终孔板。

    CHARGED PARTICLE BEAM EXPOSURE APPARATUS
    4.
    发明申请
    CHARGED PARTICLE BEAM EXPOSURE APPARATUS 有权
    充电颗粒光束曝光装置

    公开(公告)号:US20150200074A1

    公开(公告)日:2015-07-16

    申请号:US14562095

    申请日:2014-12-05

    Abstract: Provided is a charged particle beam exposure apparatus configured as follows. An electron beam emitted from an electron gun is deformed by an asymmetric illumination optical system to have an elongated section. The electron beam is then applied to a beam shaping aperture plate provided with a plurality of apertures arranged in a line, thereby generating a plurality of electron beams. Exposure of a predetermined pattern is performed on a semiconductor substrate by moving a stage device in a direction orthogonal to line patterns on the semiconductor substrate and turning the plurality of electron beams on or off in synchronization with the movement of the stage device by use of a blanker plate and a final aperture plate.

    Abstract translation: 提供如下配置的带电粒子束曝光装置。 从电子枪发射的电子束由不对称的照明光学系统变形以具有细长的部分。 然后将电子束施加到具有布置成一行的多个孔的束形成孔板,从而产生多个电子束。 通过在半导体衬底上沿垂直于线图案的方向移动舞台装置,并且通过使用第二装置与舞台装置的移动同步地打开或关闭多个电子束来对预定图案进行曝光 挡板和最终孔板。

    Device, manufacturing method, and exposure apparatus

    公开(公告)号:US10573491B2

    公开(公告)日:2020-02-25

    申请号:US15099619

    申请日:2016-04-15

    Abstract: To realize a multi-beam formation device that can stably machine a fine pattern using complementary lithography, provided is a device that deforms and deflects a beam, including an aperture layer having a first aperture that deforms and passes a beam incident thereto from a first surface side of the device and a deflection layer that passes and deflects the beam that has been passed by the aperture layer. The deflection layer includes a first electrode section having a first electrode facing a beam passing space in the deflection layer corresponding to the first aperture and a second electrode section having an extending portion that extends toward the beam passing space and is independent from an adjacent layer in the deflection layer and a second electrode facing the first electrode in a manner to sandwich the beam passing space between the first electrode and an end portion of the second electrode.

    Exposure apparatus
    7.
    发明授权

    公开(公告)号:US09684245B2

    公开(公告)日:2017-06-20

    申请号:US14738934

    申请日:2015-06-15

    CPC classification number: G03F7/70425 G03F9/7088 H01J37/3174

    Abstract: An exposure apparatus is configured to include an electronic optical system 108 that generates an electron ray and irradiates a wafer W with the electron ray, a wafer stage WS that holds the wafer W, and an electron detector 44 and a fog preventing mechanism 70 that are placed between the electronic optical system 108 and the wafer stage WS. A substrate 71 constitutes the fog preventing mechanism 70, and opening holes 71a0 that penetrate up to the upper surface of the substrate 71 are formed in a first area of the bottom surface of the substrate 71, and opening holes 71a0 that are closed in the substrate 71 are formed in a second area of the bottom surface.

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