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1.发明申请公开(公告)号：US20100081284A1
公开(公告)日：2010-04-01
申请号：US12240090
申请日：2008-09-29
IPC分类号： H01L21/3065 , C23F1/08 , C23C16/00
CPC分类号： H01J37/32449 , C23C16/45591 , C23C16/4585 , H01J37/321 , H01J37/3244
摘要： Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing a substrate includes a flow equalizer configured to control the flow of gases between a process volume and an exhaust port of a process chamber. The flow equalizer includes at least one restrictor plate configured to be disposed in a plane proximate a surface of a substrate to be processed and defines an azimuthally non-uniform gap between an edge of the at least one restrictor plate and one of either a chamber wall or a substrate support when installed in the process chamber.
摘要翻译： 本文提供了处理衬底的方法和装置。 在一些实施例中，用于处理衬底的装置包括流量均衡器，其被配置为控制处理室的处理容积和排气口之间的气体流。 流量均衡器包括至少一个限制器板，其被配置为设置在接近要处理的基板的表面的平面中，并且限定了至少一个限制器板的边缘与腔室壁中的一个之间的方位不均匀的间隙 或安装在处理室中时的基板支撑件。
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公开(公告)号：US10090181B2
公开(公告)日：2018-10-02
申请号：US13985843
申请日：2012-02-29
IPC分类号： H01L21/67 , H01L21/683 , H01L21/677 , C23C16/455 , C23C16/458 , H01L21/687 , H01L21/306
摘要： Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.
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公开(公告)号：US10453694B2
公开(公告)日：2019-10-22
申请号：US14002087
申请日：2012-02-29
IPC分类号： H01L21/67 , H01L21/3065 , H01J37/32 , H01L21/02 , H01L21/3213 , H01L21/687
摘要： Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.
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公开(公告)号：US20130337655A1
公开(公告)日：2013-12-19
申请号：US14002087
申请日：2012-02-29
IPC分类号： H01L21/3065 , H01L21/67
CPC分类号： H01L21/3065 , H01J37/32844 , H01L21/02071 , H01L21/32137 , H01L21/67069 , H01L21/67201 , H01L21/68785 , Y02C20/30 , Y02P70/605
摘要： Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.
摘要翻译： 本发明的实施例提供一种能够处理基板的双载荷锁定室。 在一个实施例中，双负载锁定室包括限定第一室容积的室主体和彼此隔离的第二室容积。 下部和第二腔室容积中的每一个通过构造成用于衬底转移的两个开口选择性地连接到两个处理环境。 双负载锁定室还包括设置在第二室容积中的加热的衬底支撑组件。 被加热的衬底支撑组件构造成在其上支撑和加热衬底。 双负载锁定室还包括连接到第二室容积的远程等离子体源，用于将等离子体供应到第二室容积。
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公开(公告)号：US20130334199A1
公开(公告)日：2013-12-19
申请号：US13985497
申请日：2012-02-09
IPC分类号： H01L21/263 , H05B3/00
CPC分类号： H01L21/67103 , H01L21/263 , H01L21/324 , H01L21/67109 , H01L21/67248 , H01L21/6838 , H01L21/68792 , H05B3/00
摘要： Embodiments of the present invention provide an apparatus heating and supporting a substrate in a processing chamber. One embodiment of the present invention provides a substrate support assembly. The substrate support assembly includes a heated plate having a substrate supporting surface on a front side and a cantilever arm extending from a backside of the heated plate. The heated plate is configured to support and heat a substrate on the substrate supporting surface. The cantilever arm has a first end attached to the heated plate near a central axis of the heated plate, and a second end extending radially outwards from the central axis.
摘要翻译： 本发明的实施例提供一种在处理室中加热和支撑衬底的装置。 本发明的一个实施例提供一种基板支撑组件。 基板支撑组件包括加热板，其具有在前侧上的基板支撑表面和从加热板的后侧延伸的悬臂。 加热板被配置为支撑和加热基板支撑表面上的基板。 悬臂具有附接到加热板附近加热板的中心轴线的第一端和从中心轴径向向外延伸的第二端。
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6.发明申请公开(公告)号：US20140087561A1
公开(公告)日：2014-03-27
申请号：US13985843
申请日：2012-02-29
IPC分类号： H01L21/677 , H01L21/306
CPC分类号： H01L21/67742 , C23C16/45517 , C23C16/4586 , H01L21/306 , H01L21/67751 , H01L21/68742
摘要： Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.
摘要翻译： 本发明的实施例提供了一种用于传送基板并将处理环境限制在室中的装置。 本发明的一个实施例提供一种用于使用处理室的环形组件。 环箍组件包括在其中限定限制区域的限制环和连接到箍的三个或更多个提升手指。 三个或更多个提升指状物构造成在限制环的内部容积之外支撑衬底。
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7.发明授权Apparatus for radial delivery of gas to a chamber and methods of use thereof 失效用于将气体径向输送到室的装置及其使用方法公开(公告)号：US08562742B2
公开(公告)日：2013-10-22
申请号：US12907947
申请日：2010-10-19
申请人： Jared Ahmad Lee , Martin Jeff Salinas , Ankur Agarwal , Ezra Robert Gold , James P. Cruse , Aniruddha Pal , Andrew Nguyen
发明人： Jared Ahmad Lee , Martin Jeff Salinas , Ankur Agarwal , Ezra Robert Gold , James P. Cruse , Aniruddha Pal , Andrew Nguyen
IPC分类号： C23C16/00 , C23C16/455 , H01L21/3065
CPC分类号： H01L21/67017 , H01L21/67115 , H01L21/6719 , H01L21/67201 , H01L21/68785 , Y10T137/6416 , Y10T137/8593
摘要： Apparatus for the delivery of a gas to a chamber and methods of use thereof are provided herein. In some embodiments, a gas distribution system for a process chamber may include a body having a first surface configured to couple the body to an interior surface of a process chamber, the body having a opening disposed through the body; a flange disposed proximate a first end of the opening opposite the first surface of the body, the flange extending inwardly into the opening and configured to support a window thereon; and a plurality of gas distribution channels disposed within the body and fluidly coupling a channel disposed within the body and around the opening to a plurality of holes disposed in the flange, wherein the plurality of holes are disposed radially about the flange.
摘要翻译： 本文提供了将气体输送到室的装置及其使用方法。 在一些实施例中，用于处理室的气体分配系统可以包括主体，其具有构造成将主体连接到处理室的内表面的第一表面，主体具有穿过主体设置的开口; 靠近所述开口的与所述主体的第一表面相对的第一端附近的凸缘，所述凸缘向内延伸到所述开口中并且构造成在其上支撑窗户; 以及多个气体分配通道，其设置在所述主体内并且将设置在所述主体内并且围绕所述开口的通道流体连接到设置在所述凸缘中的多个孔，其中所述多个孔围绕所述凸缘径向设置。
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公开(公告)号：US20120222813A1
公开(公告)日：2012-09-06
申请号：US13408810
申请日：2012-02-29
IPC分类号： C23C16/455 , B05C11/00 , C23C16/50 , B05C5/02 , B05B1/18
CPC分类号： C23C16/4412
摘要： Embodiments of the present disclosure generally relate to vacuum processing chambers having different pumping requirements and connected to a shared pumping system through a single foreline. In one embodiment, the vacuum processing chambers include a high conductance pumping conduit and a low conductance pumping conduit coupled to a single high conductance foreline. In another embodiment, a plurality of unbalanced chamber groups may be connected to a common pumping system by a final foreline.
摘要翻译： 本公开的实施例一般涉及具有不同泵送要求的真空处理室，并且通过单个前级管线连接到共享泵送系统。 在一个实施例中，真空处理室包括高电导泵送管道和耦合到单个高电导前级管线的低电导泵送导管。 在另一个实施例中，多个不平衡室组可以通过最终的前级管线连接到共同的泵送系统。
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