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    LEAD-FREE SOLDER COMPOSITION
    1.
    发明申请
    LEAD-FREE SOLDER COMPOSITION 有权
    无铅焊接组合物

    公开(公告)号：US20140271343A1

    公开(公告)日：2014-09-18

    申请号：US14288962

    申请日：2014-05-28

    Applicant: Antaya Technologies Corp.

    Inventor： Jennie S. Hwang ,  John Pereira ,  Alexandra Mary Mackin ,  Joseph C. Gonsalves

    IPC: B23K35/26

    CPC classification number: B23K35/26 ,  B23K35/24 ,  B60R16/02 ,  B60Y2410/115 ,  C03C27/046 ,  C22C1/02 ,  C22C28/00 ,  H05K1/0306 ,  H05K3/3457

    Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

    Abstract translation: 焊料组合物包括约4重量％至约25重量％的锡，约0.1重量％至约8重量％的锑，约0.03重量％至约4重量％的铜，约0.03重量％至约4重量％的镍，约66 至约90重量％的铟和约0.5重量％至约9重量％的银。 该组合物还可以包含约0.2重量％至约6重量％的锌，并且独立地包含约0.01重量％至约0.3重量％的锗。 组合物可以用于将电连接器焊接到玻璃部件上的电接触表面。

    ELECTRICAL COMPONENT HAVING PRESOLDERED SURFACE WITH FLUX RESERVOIRS
    4.
    发明申请
    ELECTRICAL COMPONENT HAVING PRESOLDERED SURFACE WITH FLUX RESERVOIRS 有权
    具有储存空间的预置表面的电气元件

    公开(公告)号：US20150034704A1

    公开(公告)日：2015-02-05

    申请号：US14339628

    申请日：2014-07-24

    Applicant: ANTAYA TECHNOLOGIES CORP.

    Inventor： Alexandra Mary Mackin ,  John Pereira ,  Matthew J. Scherer

    IPC: B23K1/20 ,  H01B5/00 ,  H05K13/04

    CPC classification number: B23K1/203 ,  B23K35/22 ,  H01B5/002 ,  H05K3/3489 ,  H05K13/0465 ,  H05K2201/09745

    Abstract: A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling.

    Abstract translation: 一种预铸的预先焊接的电气部件或连接器，其可以在运输和处理期间保护焊剂免受焊料表面的磨损。 电气部件可以包括终端焊盘。 一层焊料可以在端子垫上。 焊料层可以具有在焊料的表面中形成的一系列通常等间隔开的焊剂阱的表面，用于在其中保护性地存储和保持焊剂。 焊剂孔​​可具有至少0.05mm的横向尺寸和至少0.023mm的深度，其深度足以在运输和/或处理期间在焊料层的表面上的焊剂磨损时保持一定量的焊剂 。

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