公开(公告)号：US09975207B2

公开(公告)日：2018-05-22

申请号：US14288962

申请日：2014-05-28

Applicant: Antaya Technologies Corp.

Inventor： Jennie S. Hwang ,  John Pereira ,  Alexandra Mary Mackin ,  Joseph C. Gonsalves

IPC: B23K35/00 ,  B23K1/00 ,  B23K35/26 ,  B23K35/24 ,  C03C27/04 ,  C22C28/00 ,  C22C1/02 ,  B60R16/02 ,  H05K1/03 ,  H05K3/34

CPC classification number: B23K35/26 ,  B23K35/24 ,  B60R16/02 ,  B60Y2410/115 ,  C03C27/046 ,  C22C1/02 ,  C22C28/00 ,  H05K1/0306 ,  H05K3/3457

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

公开(公告)号：US09925611B2

公开(公告)日：2018-03-27

申请号：US14339628

申请日：2014-07-24

Applicant: ANTAYA TECHNOLOGIES CORP.

Inventor： Alexandra Mary Mackin ,  John Pereira ,  Matthew J. Scherer

IPC: B23K1/20 ,  H05K3/34 ,  B23K35/00 ,  H01B5/00 ,  H05K13/04 ,  B23K35/22

CPC classification number: B23K1/203 ,  B23K35/22 ,  H01B5/002 ,  H05K3/3489 ,  H05K13/0465 ,  H05K2201/09745

Abstract: A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling.

公开(公告)号：US20140271343A1

公开(公告)日：2014-09-18

申请号：US14288962

申请日：2014-05-28

Applicant: Antaya Technologies Corp.

Inventor： Jennie S. Hwang ,  John Pereira ,  Alexandra Mary Mackin ,  Joseph C. Gonsalves

IPC: B23K35/26

CPC classification number: B23K35/26 ,  B23K35/24 ,  B60R16/02 ,  B60Y2410/115 ,  C03C27/046 ,  C22C1/02 ,  C22C28/00 ,  H05K1/0306 ,  H05K3/3457

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract translation: 焊料组合物包括约4重量％至约25重量％的锡，约0.1重量％至约8重量％的锑，约0.03重量％至约4重量％的铜，约0.03重量％至约4重量％的镍，约66 至约90重量％的铟和约0.5重量％至约9重量％的银。 该组合物还可以包含约0.2重量％至约6重量％的锌，并且独立地包含约0.01重量％至约0.3重量％的锗。 组合物可以用于将电连接器焊接到玻璃部件上的电接触表面。

公开(公告)号：US20150068363A1

公开(公告)日：2015-03-12

申请号：US14023714

申请日：2013-09-11

Applicant: Antaya Technologies Corp.

Inventor： Fernando Almeida

IPC: B23K1/018

CPC classification number: B23K1/018 ,  C22B1/005 ,  C22B7/003 ,  Y02P10/212 ,  Y02W30/54

Abstract: An apparatus for recovering solder from solder coated scrap pieces includes a first centrifuge comprising a centrifuge receptacle having perforation holes, rotatably mounted about a first centrifuge axis for containing and rotating a quantity of solder coated scrap pieces. A solder collection container can surround the centrifuge receptacle. A heater can surround the solder collection container for heating the solder coated scrap pieces and melting the solder thereon. A drive system can be configured for rotating the centrifuge receptacle while the first centrifuge axis is in about a horizontal position at a low speed that tumbles the scrap pieces along a longitudinal length of the centrifuge receptacle, and later rotating the centrifuge receptacle at a high speed for centrifugally extracting molten solder from the centrifuge receptacle, radially outwardly through the perforation holes into the solder collection container.

Abstract translation: 用于从焊料涂覆的废料片回收焊料的装置包括第一离心机，其包括具有穿孔的离心机容器，该离心机容器围绕第一离心机轴线可旋转地安装，用于容纳和旋转大量焊料涂覆的废料片。 焊料收集容器可围绕离心机容器。 加热器可围绕焊料收集容器，用于加热焊料涂覆的废料并在其上熔化焊料。 驱动系统可以被配置用于旋转离心机容器，同时第一离心机轴线处于水平位置的低速下，沿着离心机容器的纵向长度翻转废料片，然后以高速旋转离心机容器 用于从离心机容器离心提取熔融焊料，径向向外穿过穿孔进入焊料收集容器。

公开(公告)号：US09228247B2

公开(公告)日：2016-01-05

申请号：US14023714

申请日：2013-09-11

Applicant: Antaya Technologies Corp.

Inventor： Fernando Almeida

IPC: B23K1/018 ,  C22B7/00

CPC classification number: B23K1/018 ,  C22B1/005 ,  C22B7/003 ,  Y02P10/212 ,  Y02W30/54

Abstract: An apparatus for recovering solder from solder coated scrap pieces includes a first centrifuge comprising a centrifuge receptacle having perforation holes, rotatably mounted about a first centrifuge axis for containing and rotating a quantity of solder coated scrap pieces. A solder collection container can surround the centrifuge receptacle. A heater can surround the solder collection container for heating the solder coated scrap pieces and melting the solder thereon. A drive system can be configured for rotating the centrifuge receptacle while the first centrifuge axis is in about a horizontal position at a low speed that tumbles the scrap pieces along a longitudinal length of the centrifuge receptacle, and later rotating the centrifuge receptacle at a high speed for centrifugally extracting molten solder from the centrifuge receptacle, radially outwardly through the perforation holes into the solder collection container.

Abstract translation: 用于从焊料涂覆的废料片回收焊料的装置包括第一离心机，其包括具有穿孔的离心机容器，该离心机容器围绕第一离心机轴线可旋转地安装，用于容纳和旋转大量焊料涂覆的废料片。 焊料收集容器可围绕离心机容器。 加热器可围绕焊料收集容器，用于加热焊料涂覆的废料并在其上熔化焊料。 驱动系统可以被配置用于旋转离心机容器，同时第一离心机轴线处于水平位置的低速下，沿着离心机容器的纵向长度翻转废料片，然后以高速旋转离心机容器 用于从离心机容器离心提取熔融焊料，径向向外穿过穿孔进入焊料收集容器。

公开(公告)号：US20150034704A1

公开(公告)日：2015-02-05

申请号：US14339628

申请日：2014-07-24

Applicant: ANTAYA TECHNOLOGIES CORP.

Inventor： Alexandra Mary Mackin ,  John Pereira ,  Matthew J. Scherer

IPC: B23K1/20 ,  H01B5/00 ,  H05K13/04

CPC classification number: B23K1/203 ,  B23K35/22 ,  H01B5/002 ,  H05K3/3489 ,  H05K13/0465 ,  H05K2201/09745

Abstract: A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling.

Abstract translation: 一种预铸的预先焊接的电气部件或连接器，其可以在运输和处理期间保护焊剂免受焊料表面的磨损。 电气部件可以包括终端焊盘。 一层焊料可以在端子垫上。 焊料层可以具有在焊料的表面中形成的一系列通常等间隔开的焊剂阱的表面，用于在其中保护性地存储和保持焊剂。 焊剂孔​​可具有至少0.05mm的横向尺寸和至少0.023mm的深度，其深度足以在运输和/或处理期间在焊料层的表面上的焊剂磨损时保持一定量的焊剂 。