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公开(公告)号：US20160147269A1
公开(公告)日：2016-05-26
申请号：US15012661
申请日：2016-02-01
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , William F. LEGGETT , Jay S. NIGEN , Frank F. LIANG , Richard H. TAN
CPC classification number: G06F1/203 , B23P15/26 , F28D1/024 , F28D15/02 , F28D15/0233 , F28D15/0275 , F28D15/04 , H05K5/02 , H05K7/20309 , H05K7/20318 , H05K7/20336 , Y10T29/49826
Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.
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2.发明申请公开(公告)号：US20190045301A1
公开(公告)日：2019-02-07
申请号：US16033020
申请日：2018-07-11
Applicant: APPLE INC.
Inventor： Afrooz Family , Daniel R. BORGES , Daniel S. NAITO , James M. HOLLABAUGH , Jay S. NIGEN
Abstract: A method for operating a distributed wireless audio system including several loudspeaker cabinets all of which can communicate with each other as part of a computer network. The method receives temperature data that is indicative of temperature of a first loudspeaker cabinet, which has a network master responsibility of obtaining an audio signal from an audio source and wirelessly transmitting some of the audio signal to a second loudspeaker cabinet of several loudspeaker cabinets, for playback by the second loudspeaker cabinet, while playing back some of the audio signal by the first loudspeaker cabinet. The method determines whether a thermal threshold of the first loudspeaker cabinet has been reached, based on the temperature data. The method, in response to the thermal threshold being reached, gives up the network master responsibility from the first loudspeaker cabinet to the second loudspeaker cabinet, where doing so reduces temperature in the first loudspeaker cabinet.
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Patent Agency Ranking
公开(公告)号：US20140077670A1
公开(公告)日：2014-03-20
申请号：US14086353
申请日：2013-11-21
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , Christiaan A. LIGTENBERG , Ron A. HOPKINSON , Bartley K. ANDRE , Jeremy BATAILLOU , Jay S. NIGEN , Matthew S. THEOBALD , Matthew P. CASEBOLT , Charles A. SCHWALBACH , Brandon S. SMITH , William F. LEGGETT
IPC: G06F1/16
CPC classification number: G06F1/1613 , G06F1/1616 , G06F2200/1612 , Y10T29/49 , Y10T29/49002
Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.
Abstract translation: 本申请描述了关于用于提供具有薄型材的轻便且耐用的便携式计算设备的系统和方法的各种实施例。 便携式计算设备可以采用膝上型计算机的形式。 膝上型计算机可以包括其上形成有集成的支撑系统的单体顶部壳体，该集成的支撑系统提供结构支撑，其通过顶部壳体分配所施加的负载以防止翘曲和弯曲。
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公开(公告)号：US20230284372A1
公开(公告)日：2023-09-07
申请号：US17653634
申请日：2022-03-04
Applicant: Apple Inc.
Inventor： Kristopher P. LAURENT , Brett W. DEGNER , Jay S. NIGEN , Eric R. PRATHER , David H. NARAJOWSKI
CPC classification number: H05K1/0209 , G06F1/203 , G06F2200/201 , H05K2201/064 , H05K2201/066
Abstract: This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.
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公开(公告)号：US20160357231A1
公开(公告)日：2016-12-08
申请号：US15242379
申请日：2016-08-19
Applicant: Apple Inc.
Inventor： Brett W. DEGNER , William F. LEGGETT , Jay S. NIGEN , Frank F. LIANG , Richard H. TAN
CPC classification number: G06F1/203 , B23P15/26 , F28D1/024 , F28D15/02 , F28D15/0233 , F28D15/0275 , F28D15/04 , H05K5/02 , H05K7/20309 , H05K7/20318 , H05K7/20336 , Y10T29/49826
Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.
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公开(公告)号：US20230413416A1
公开(公告)日：2023-12-21
申请号：US17843884
申请日：2022-06-17
Applicant: Apple Inc.
Inventor： Trevor J. EDMONDS , Jay S. NIGEN , Richard D. KOSOGLOW , Ron A. HOPKINSON
CPC classification number: H05K1/0203 , H05K7/2039 , G06F1/203 , H05K2201/10128
Abstract: An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).
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公开(公告)号：US20160307819A1
公开(公告)日：2016-10-20
申请号：US15191404
申请日：2016-06-23
Applicant: Apple Inc.
Inventor： Jay S. NIGEN , Ron A. HOPKINSON , Derek J. YAP , Eric A. KNOPF , William F. LEGGETT , Richard H. TAN
IPC: H01L23/373 , H01L21/48 , H01L23/552
CPC classification number: H01L23/3735 , F28F21/00 , G06F1/20 , H01L21/4882 , H01L23/3737 , H01L23/552 , H01L2924/0002 , H05K1/0201 , H05K1/141 , H05K3/0061 , H05K7/20436 , H05K7/205 , H05K2201/042 , H05K2201/10159 , H01L2924/00
Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.
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