CALIBRATION OF AN ELECTRONICS PROCESSING SYSTEM

    公开(公告)号:US20210291374A1

    公开(公告)日:2021-09-23

    申请号:US16860992

    申请日:2020-04-28

    Abstract: A calibration object is placed at a target orientation in a station of an electronics processing device by a first robot arm, and then retrieved from the station by the first robot arm. The calibration object is transferred to an aligner station using the first robot arm, a second robot arm and/or a load lock, wherein the calibration object has a first orientation at the aligner station. The first orientation at the aligner station is determined. A characteristic error value is determined based on the first orientation. The aligner station is to use the characteristic error value for alignment of objects to be placed in the first station.

    SUBSTRATE TRANSFER DEVICES, SYSTEMS AND METHODS OF USE THEREOF

    公开(公告)号:US20210276179A1

    公开(公告)日:2021-09-09

    申请号:US16813191

    申请日:2020-03-09

    Abstract: The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a robot can include a first mover configured to be driven by a platform of a linear motor, a support structure disposed on the first mover, a first robot arm attached to the first end of the support structure at a shoulder axis, and a first arm drive assembly. The first drive assembly can include a first pulley attached to a first end of the support structure and to the first robot arm at the shoulder axis, a second pulley attached to a second end of the support structure, a first band connecting the first pulley to the second pulley, and a second mover configured to be driven by the platform of the linear motor, where the second mover is connected to the first band, and where motion of the second mover relative to the first mover causes the first band to a) rotate the first pulley and the second pulley and b) rotate the first robot arm around the shoulder axis. Also disclosed are systems and methods incorporating the robot.

    Substrate transfer devices, systems and methods of use thereof

    公开(公告)号:US11565402B2

    公开(公告)日:2023-01-31

    申请号:US16813191

    申请日:2020-03-09

    Abstract: The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a robot can include a first mover configured to be driven by a platform of a linear motor, a support structure disposed on the first mover, a first robot arm attached to the first end of the support structure at a shoulder axis, and a first arm drive assembly. The first drive assembly can include a first pulley attached to a first end of the support structure and to the first robot arm at the shoulder axis, a second pulley attached to a second end of the support structure, a first band connecting the first pulley to the second pulley, and a second mover configured to be driven by the platform of the linear motor, where the second mover is connected to the first band, and where motion of the second mover relative to the first mover causes the first band to a) rotate the first pulley and the second pulley and b) rotate the first robot arm around the shoulder axis. Also disclosed are systems and methods incorporating the robot.

    Substrate transfer devices, systems and methods of use thereof

    公开(公告)号:US12251830B2

    公开(公告)日:2025-03-18

    申请号:US18100522

    申请日:2023-01-23

    Abstract: The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a method includes causing a robot arm to pick up a substrate. The robot arm is caused to pick up the substrate by causing a first mover to rotate or to change a first distance to a second mover. Rotation of the first mover or the change in the first distance causes the first robot arm to rotate about a shoulder axis. The robot arm is further caused to pick up the substrate by causing one of a) a second mover to rotate or b) a third mover to change a second distance to the second mover. Rotation of the second mover or the change in the second distance causes the robot arm to raise or lower.

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