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    ACOUSTICALLY-MONITORED SEMICONDUCTOR SUBSTRATE PROCESSING SYSTEMS AND METHODS
    3.
    发明申请
    ACOUSTICALLY-MONITORED SEMICONDUCTOR SUBSTRATE PROCESSING SYSTEMS AND METHODS 有权
    声学监测半导体基板处理系统和方法

    公开(公告)号：US20140260624A1

    公开(公告)日：2014-09-18

    申请号：US14180012

    申请日：2014-02-13

    Applicant: Applied Materials, Inc.

    Inventor： Kommisetti Subrahmanyam ,  Todd J. Egan ,  Joseph Yudovsky ,  Michael Johnson

    IPC: F16K37/00

    CPC classification number: F16K37/0083 ,  H01L21/67253 ,  Y10T137/8158

    Abstract: A semiconductor substrate processing system having acoustic monitoring is disclosed. The system includes a process chamber adapted to perform a process on a substrate, a process fluid source, a fluid conduit coupling the fluid source to the process chamber, and a flow control valve located along the fluid conduit and adapted to be operable to control a flow of a process fluid between the process fluid source and the process chamber. The system includes one or more acoustic sensors operable to sense acoustic noise coupled to at least one of the process fluid source, the fluid conduit, and the flow control valve, and an acoustic processor adapted to receive at least one signal from the one or more acoustic sensors. Acoustic monitoring methods are provided, as are other aspects.

    Abstract translation: 公开了一种具有声学监测的半导体衬底处理系统。 该系统包括适于在基板上执行处理的处理室，工艺流体源，将流体源连接到处理室的流体导管以及沿着流体导管定位的流量控制阀，并且适于可操作以控制 处理流体源和处理室之间的工艺流体的流动。 该系统包括一个或多个声学传感器，其可操作以感测耦合到过程流体源，流体导管和流量控制阀中的至少一个的声学噪声，以及适于从一个或多个 声传感器。 提供声学监测方法，以及其他方面。

    Acoustically-monitored semiconductor substrate processing systems and methods
    7.
    发明授权
    Acoustically-monitored semiconductor substrate processing systems and methods 有权
    声控半导体衬底处理系统和方法

    公开(公告)号：US09429247B2

    公开(公告)日：2016-08-30

    申请号：US14180012

    申请日：2014-02-13

    Applicant: Applied Materials, Inc.

    Inventor： Kommisetti Subrahmanyam ,  Todd J. Egan ,  Joseph Yudovsky ,  Michael Johnson

    IPC: F16K37/00 ,  G01N29/00 ,  H01L21/67

    CPC classification number: F16K37/0083 ,  H01L21/67253 ,  Y10T137/8158

    Abstract: A semiconductor substrate processing system having acoustic monitoring is disclosed. The system includes a process chamber adapted to perform a process on a substrate, a process fluid source, a fluid conduit coupling the fluid source to the process chamber, and a flow control valve located along the fluid conduit and adapted to be operable to control a flow of a process fluid between the process fluid source and the process chamber. The system includes one or more acoustic sensors operable to sense acoustic noise coupled to at least one of the process fluid source, the fluid conduit, and the flow control valve, and an acoustic processor adapted to receive at least one signal from the one or more acoustic sensors. Acoustic monitoring methods are provided, as are other aspects.

    Abstract translation: 公开了一种具有声学监测的半导体衬底处理系统。 该系统包括适于在基板上执行处理的处理室，工艺流体源，将流体源连接到处理室的流体导管以及沿着流体导管定位的流量控制阀，并且适于可操作以控制 处理流体源和处理室之间的工艺流体的流动。 该系统包括一个或多个声学传感器，其可操作以感测耦合到过程流体源，流体导管和流量控制阀中的至少一个的声学噪声，以及适于从一个或多个 声传感器。 提供声学监测方法，以及其他方面。

    APPARATUS AND METHODS FOR ACOUSTICAL MONITORING AND CONTROL OF THROUGH-SILICON-VIA REVEAL PROCESSING
    8.
    发明申请
    APPARATUS AND METHODS FOR ACOUSTICAL MONITORING AND CONTROL OF THROUGH-SILICON-VIA REVEAL PROCESSING 审中-公开
    通过硅橡胶渗透加工进行声学监测和控制的装置和方法

    公开(公告)号：US20140329439A1

    公开(公告)日：2014-11-06

    申请号：US13874495

    申请日：2013-05-01

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Xiong Yeu Chew ,  Kommisetti Subrahmanyam ,  Uday Mahajan ,  Bogdan Swedek ,  Rajeev Bajaj ,  Jianshe Tang

    IPC: B24B37/005

    CPC classification number: B24B37/0053

    Abstract: A TSV (through silicon via) reveal process using CMP (chemical mechanical polishing) may be acoustically monitored and controlled to detect TSV breakage and automatically respond thereto. Acoustic emissions received by one or more acoustic sensors positioned proximate a substrate holder and/or a polishing pad of a CMP system may be analyzed to detect TSV breakage during a CMP process. In response to detecting TSV breakage, one or more remedial actions may automatically occur. In some embodiments, a polishing pad platen may have one or more acoustic sensors integrated therein that extend into a polishing pad mounted on the polishing pad platen. Methods of monitoring and controlling a TSV reveal process are also provided, as are other aspects.

    Abstract translation: TSV（通过硅通孔）显示使用CMP（化学机械抛光）的方法可以被声学监测和控制，以检测TSV断裂并自动响应于此。 可以分析由位于CMP系统的衬底保持器和/或抛光垫附近的一个或多个声学传感器接收的声发射，以在CMP处理期间检测TSV断裂。 响应于检测到TSV断裂，可能会自动发生一个或多个补救措施。 在一些实施例中，抛光垫压板可以具有集成在其中的一个或多个声学传感器，其延伸到安装在抛光垫压板上的抛光垫中。 还提供了监测和控制TSV显示过程的方法，以及其他方面。

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