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公开(公告)号:US12288677B2
公开(公告)日:2025-04-29
申请号:US18205690
申请日:2023-06-05
Applicant: Applied Materials, Inc.
Inventor: Tsutomu Tanaka , Jared Ahmad Lee , Rakesh Ramadas , Dmitry A. Dzilno , Gregory J. Wilson , Sriharish Srinivasan
IPC: H01J37/32
Abstract: The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.
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公开(公告)号:US20220093443A1
公开(公告)日:2022-03-24
申请号:US17029648
申请日:2020-09-23
Applicant: Applied Materials, Inc.
Inventor: Abhishek Chowdhury , Vijayabhaskara Venkatagiriyappa , Mihaela A. Balseanu , Jyoti Prakash Deo , Srinivas Ramakrishna , Keiichi Tanaka , Mandyam Sriram , Francis Kanyiri Mungai , Mario D. Silvetti , Sriharish Srinivasan
IPC: H01L21/683 , C23C16/458 , H01L21/687
Abstract: Apparatus and methods for vacuum chucking a substrate to a susceptor. The susceptor comprises one or more angularly spaced pockets are positioned around a center axis of the susceptor, the one or more angularly spaced pockets having an inner pocket and an outer pocket. The susceptor can be configured as an intermediate chuck having one or more pucks positioned within the inner pocket or as a distributed chuck having one or more pucks positioned within the outer pocket. The one or more pucks has a center hole, at least one radial channel and at least one circular channel having chuck holes for vacuum chucking a substrate.
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公开(公告)号:US12110585B2
公开(公告)日:2024-10-08
申请号:US17167469
申请日:2021-02-04
Applicant: APPLIED MATERIALS, INC.
Inventor: Naman Apurva , Lara A. Hawrylchak , Mahesh Ramakrishna , Sriharish Srinivasan , Prashant Agarwal
IPC: C23C16/44 , C23C16/455 , C23C16/458 , H01J37/32 , H01L21/67
CPC classification number: C23C16/4412 , C23C16/45517 , C23C16/45591 , C23C16/4585 , C23C16/45565 , H01J37/3244 , H01J37/32633 , H01J37/32834 , H01L21/67069
Abstract: Embodiments of exhaust liner systems are provided herein. In some embodiments, an exhaust liner system for use in a process chamber includes a lower exhaust liner having an annular body with a central opening; an upper flange, a central flange, and a lower flange extending outward from the annular body, wherein the lower flange and the central flange partially define a first plenum, and wherein the central flange and the upper flange partially define a second plenum; a plurality of exhaust holes from the central opening to the first plenum; and at least one cutout in the central flange to provide a flow path from the first plenum to the second plenum, wherein the lower exhaust liner defines a gas flow path from the central opening to the first plenum via the plurality of exhaust holes and from the first plenum to the second plenum via the least one cutout.
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公开(公告)号:US20230307213A1
公开(公告)日:2023-09-28
申请号:US18205690
申请日:2023-06-05
Applicant: Applied Materials, Inc.
Inventor: Tsutomu Tanaka , Jared Ahmad Lee , Rakesh Ramadas , Dmitry A. Dzilno , Gregory J. Wilson , Sriharish Srinivasan
IPC: H01J37/32
CPC classification number: H01J37/32733 , H01J37/32082 , H01J37/3244 , H01J37/32522 , H01J2237/20235 , H01J2237/332
Abstract: The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.
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公开(公告)号:US11581213B2
公开(公告)日:2023-02-14
申请号:US17029648
申请日:2020-09-23
Applicant: Applied Materials, Inc.
Inventor: Abhishek Chowdhury , Vijayabhaskara Venkatagiriyappa , Mihaela A. Balseanu , Jyoti Prakash Deo , Srinivas Ramakrishna , Keiichi Tanaka , Mandyam Sriram , Francis Kanyiri Mungai , Mario D. Silvetti , Sriharish Srinivasan
IPC: H01L21/683 , H01L21/687 , C23C16/458
Abstract: Apparatus and methods for vacuum chucking a substrate to a susceptor. The susceptor comprises one or more angularly spaced pockets are positioned around a center axis of the susceptor, the one or more angularly spaced pockets having an inner pocket and an outer pocket. The susceptor can be configured as an intermediate chuck having one or more pucks positioned within the inner pocket or as a distributed chuck having one or more pucks positioned within the outer pocket. The one or more pucks has a center hole, at least one radial channel and at least one circular channel having chuck holes for vacuum chucking a substrate.
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公开(公告)号:US11705312B2
公开(公告)日:2023-07-18
申请号:US17134280
申请日:2020-12-26
Applicant: Applied Materials, Inc.
Inventor: Tsutomu Tanaka , Jared Ahmad Lee , Rakesh Ramadas , Dmitry A. Dzilno , Gregory J. Wilson , Sriharish Srinivasan
IPC: H01J37/32
CPC classification number: H01J37/32733 , H01J37/3244 , H01J37/32082 , H01J37/32522 , H01J2237/20235 , H01J2237/332
Abstract: The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.
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公开(公告)号:US20220208531A1
公开(公告)日:2022-06-30
申请号:US17134280
申请日:2020-12-26
Applicant: Applied Materials, Inc.
Inventor: Tsutomu Tanaka , Jared Ahmad Lee , Rakesh Ramadas , Dmitry A. Dzilno , Gregory J. Wilson , Sriharish Srinivasan
IPC: H01J37/32
Abstract: The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.
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