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    DISCHARGING AN ELECTROSTATIC CHUCK LOCATED WITHIN A VACUUM CHAMBER
    1.
    发明公开
    DISCHARGING AN ELECTROSTATIC CHUCK LOCATED WITHIN A VACUUM CHAMBER 审中-公开

    公开(公告)号：US20240234078A1

    公开(公告)日：2024-07-11

    申请号：US18095951

    申请日：2023-01-11

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Adam Faust ,  Yosef Basson

    IPC: H01J37/02 ,  H01J37/20

    CPC classification number: H01J37/026 ,  H01J37/20 ,  H01J2237/0041 ,  H01J2237/2007

    Abstract: A device for discharging an electrostatic chuck located within a vacuum chamber, the device includes a plasma distribution unit that is configured to receive plasma from an external plasma source that is located outside the vacuum chamber, and perform a distribution of the plasma within the vacuum chamber that discharges the electrostatic chuck. The device also includes a controller for controlling the distribution of the plasma; wherein the distribution of the plasma occurs during a plasma distribution period that is shorter than a duration of a plasma based cleaning process of the electrostatic chuck.

    Detection of an electric arc hazard related to a wafer
    2.
    发明授权
    Detection of an electric arc hazard related to a wafer 有权

    公开(公告)号：US11293993B2

    公开(公告)日：2022-04-05

    申请号：US16560625

    申请日：2019-09-04

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Yosef Basson ,  Samuel Ives Nackash ,  Ittamar Levy

    IPC: G01R31/28 ,  H01J37/244 ,  H01J37/20 ,  G01R31/50 ,  H01J37/26

    Abstract: A method, a non-transitory computer readable medium and a detection system for detecting an electric arc hazard related to a wafer. The detection system may include a measurement unit, an electrode and a processing unit. The measurement unit may be configured to provide a measurement result by measuring an electrical parameter of the electrode during a test period, while the wafer may be moved in relation to the electrode, and while a certain electrical field may be formed between the electrode and the wafer; wherein the certain electrical field induces detached ends of partially detached conductive elements of the wafer to move away from the wafer. The processing unit may be configured to determine an existence of the electric arc hazard based on the measurement result.

    ENERGY DISPERSIVE X-RAY SPECTROSCOPY SENSING UNIT
    4.
    发明公开
    ENERGY DISPERSIVE X-RAY SPECTROSCOPY SENSING UNIT 审中-公开

    公开(公告)号：US20240057957A1

    公开(公告)日：2024-02-22

    申请号：US18110328

    申请日：2023-02-15

    Applicant: Applied Materials Israel Ltd.

    Inventor： Martin Chauvin ,  Eugene Brozgol ,  Marat Feldman ,  Yosef Basson ,  Itay Asulin ,  Shmuel Nakash ,  Jacob Levin

    IPC: A61B6/00

    CPC classification number: A61B6/482 ,  A61B6/40 ,  A61B6/52

    Abstract: An energy-dispersive x-ray spectroscopy (EDX) sensing unit, the EDX sensing unit include a protective unit and an x-ray sensor that includes one or more sensing regions. The protective unit is configured to (i) introduce a change in one or more properties of electrons emitted from a sample, thereby preventing the electrons emitted from the sample from reaching the one or more sensing regions, the electrons are emitted from the sample due to an illuminating of the sample by a primary electron beam, and (ii) increase a safety of operation of the EDX sensing unit. The x-ray sensor is configured to (i) receive, by the one or more sensing regions, x-ray photons emitted from the sample due to the illuminating of the sample, and (ii) generate detection signals indicative of the x-ray photons.

    EVALUATING A CONTACT BETWEEN A WAFER AND AN ELECTROSTATIC CHUCK
    5.
    发明申请
    EVALUATING A CONTACT BETWEEN A WAFER AND AN ELECTROSTATIC CHUCK 有权

    公开(公告)号：US20220181115A1

    公开(公告)日：2022-06-09

    申请号：US17115656

    申请日：2020-12-08

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Adam Faust ,  Yosef Basson ,  Guy Eytan ,  Yonathan David

    IPC: H01J37/20 ,  H01L21/683 ,  H01L21/67 ,  G01N27/04 ,  H01J37/28

    Abstract: A method, a non-transitory computer readable medium and a device. The method may include (a) introducing a voltage difference between an absolute value of a negative pole of the electrostatic chuck and an absolute value of a positive pole of the electrostatic chuck, the introducing occurs while the wafer is supported by the electrostatic chuck and is contacted by one or more conductive contact pins of the electrostatic chuck; (b) monitoring, by an electrostatic sensor that comprises a sensing element, a charge at a point of measurement located at a front side of the wafer, at different points of time that follow a start of the introducing of the voltage difference, to provide monitoring results; and (c) determining an electrical parameter of the contact between the wafer and the electrostatic chuck, based on the monitoring results.

    Evaluating a contact between a wafer and an electrostatic chuck
    6.
    发明授权
    Evaluating a contact between a wafer and an electrostatic chuck 有权

    公开(公告)号：US11694869B2

    公开(公告)日：2023-07-04

    申请号：US17115656

    申请日：2020-12-08

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Adam Faust ,  Yosef Basson ,  Guy Eytan ,  Yonathan David

    IPC: H01J37/20 ,  H01L21/683 ,  H01L21/67 ,  G01N27/04 ,  H01J37/28

    CPC classification number: H01J37/20 ,  G01N27/041 ,  H01J37/28 ,  H01L21/67259 ,  H01L21/6831

    Abstract: A method, a non-transitory computer readable medium and a device. The method may include (a) introducing a voltage difference between an absolute value of a negative pole of the electrostatic chuck and an absolute value of a positive pole of the electrostatic chuck, the introducing occurs while the wafer is supported by the electrostatic chuck and is contacted by one or more conductive contact pins of the electrostatic chuck; (b) monitoring, by an electrostatic sensor that comprises a sensing element, a charge at a point of measurement located at a front side of the wafer, at different points of time that follow a start of the introducing of the voltage difference, to provide monitoring results; and (c) determining an electrical parameter of the contact between the wafer and the electrostatic chuck, based on the monitoring results.

    Compensating for an electromagnetic interference induced deviation of an electron beam
    7.
    发明授权
    Compensating for an electromagnetic interference induced deviation of an electron beam 有权

    公开(公告)号：US11276545B1

    公开(公告)日：2022-03-15

    申请号：US17131666

    申请日：2020-12-22

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Yosef Basson ,  Yuri Belenky ,  Mordechai Rozen ,  Lior Klein ,  Asaf Grosz

    IPC: H01J37/09 ,  H01J37/244 ,  H01J37/28

    Abstract: A method, a non-transitory computer readable medium and a system for compensating for an electromagnetic interference induced deviation of an electron beam. The method may include obtaining measurement information about a magnetic field within an electron beam tool, the measurement information is generated by at least one planar Hall Effect magnetic sensor that is located within the electron beam tool; wherein the at least one planar Hall Effect magnetic sensor comprises at least one magnetometer integrated with at least one magnetic flux concentrator; estimating the electromagnetic interference induced deviation of the electron beam, the estimating is based on the magnetic field; and setting a trajectory of the electron beam to compensate for the electromagnetic interference induced deviation of the electron beam.

    DETECTION OF AN ELECTRIC ARC HAZARD RELATED TO A WAFER
    8.
    发明申请
    DETECTION OF AN ELECTRIC ARC HAZARD RELATED TO A WAFER 有权

    公开(公告)号：US20210063461A1

    公开(公告)日：2021-03-04

    申请号：US16560625

    申请日：2019-09-04

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Yosef Basson ,  Samuel Ives Nackash ,  Ittamar Levy

    IPC: G01R31/02 ,  H01J37/244 ,  H01J37/20 ,  G01R31/28

    Abstract: A method, a non-transitory computer readable medium and a detection system for detecting an electric arc hazard related to a wafer. The detection system may include a measurement unit, an electrode and a processing unit. The measurement unit may be configured to provide a measurement result by measuring an electrical parameter of the electrode during a test period, while the wafer may be moved in relation to the electrode, and while a certain electrical field may be formed between the electrode and the wafer; wherein the certain electrical field induces detached ends of partially detached conductive elements of the wafer to move away from the wafer. The processing unit may be configured to determine an existence of the electric arc hazard based on the measurement result.

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