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公开(公告)号:US20090121159A1
公开(公告)日:2009-05-14
申请号:US12259280
申请日:2008-10-27
申请人: ARCHI HWANG , YI XIANG WANG , JACK JAU , CHUNG-SHIH PAN , ZHONGWEI CHEN
发明人: ARCHI HWANG , YI XIANG WANG , JACK JAU , CHUNG-SHIH PAN , ZHONGWEI CHEN
IPC分类号: A61N5/00
CPC分类号: G03F7/7045
摘要: A hybrid lithography system is disclosed to achieve high throughput and high resolution of sub 32 nm lithography. The hybrid system contains an optical lithographer for expose pattern area where features above 32 nm, and a cluster e-beam lithography system for expose pattern area where features is sub 32 nm.
摘要翻译: 公开了一种混合光刻系统,以实现32nm光刻的高通量和高分辨率。 混合系统包含用于32nm以上特征的曝光图案区域的光学平版印刷机,以及用于曝光图案区域的簇电子束光刻系统,其特征在32nm以下。
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公开(公告)号:US20100140498A1
公开(公告)日:2010-06-10
申请号:US12331336
申请日:2008-12-09
申请人: JACK JAU , HONG XIAO , JOE WANG , ZHONGWEI CHEN , YI XIANG WANG , EDWARD TSENG
发明人: JACK JAU , HONG XIAO , JOE WANG , ZHONGWEI CHEN , YI XIANG WANG , EDWARD TSENG
IPC分类号: G21K5/10
CPC分类号: H01J37/28 , H01J37/20 , H01J2237/202 , H01J2237/2817 , H01L21/67288 , H01L21/6831
摘要: The present invention relates to an operation stage of a charged particle beam apparatus which is employed in a scanning electron microscope for substrate (wafer) edge and backside defect inspection or defect review. However, it would be recognized that the invention has a much broader range of applicability. A system and method in accordance with the present invention provides an operation stage for substrate edge inspection or review. The inspection region includes top near edge, to bevel, apex, and bottom bevel. The operation stage includes a supporting stand, a z-stage, an X-Y stage, an electrostatic chuck, a pendulum stage and a rotation track. The pendulum stage mount with the electrostatic chuck has the ability to swing from 0° to 180° while performing substrate top bevel, apex and bottom bevel inspection or review. In order to keep the substrate in focus and avoid a large position shift during altering the substrate observation angle by rotation the pendulum stage, one embodiment of the present invention discloses a method such that the rotation axis of the pendulum stage consist of the tangent of upper edge of the substrate to be inspected. The electrostatic chuck of the present invention has a diameter smaller than which of the substrate to be inspected. During the inspection process the substrate on the electrostatic chuck may be rotated about the central axis on the electrostatic chuck to a desired position, this design insures all position on the bevel and apex are able to be inspected.
摘要翻译: 本发明涉及用于基板(晶片)边缘和背面缺陷检查或缺陷检查的扫描电子显微镜中的带电粒子束装置的操作阶段。 然而,应当认识到,本发明具有更广泛的应用范围。 根据本发明的系统和方法提供了用于衬底边缘检查或审查的操作阶段。 检查区域包括顶部近边缘,斜面,顶点和底部斜面。 操作台包括支撑台,z台,X-Y台,静电卡盘,摆台和旋转轨道。 具有静电卡盘的摆台安装具有从0°摆动到180°的能力,同时执行基板顶部斜面,顶部和底部斜面检查或检查。 为了将基板保持在对焦状态,并且通过旋转摆锤台来改变基板观察角度而避免大的位置偏移,本发明的一个实施例公开了一种方法,使得摆台的旋转轴线由上部的切线 要检查的基板的边缘。 本发明的静电卡盘的直径小于要检查的基板的直径。 在检查过程中,静电卡盘上的基板可以围绕静电卡盘上的中心轴线旋转到期望的位置,该设计确保能够检查斜面上的所有位置和顶点。
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公开(公告)号:US20100103583A1
公开(公告)日:2010-04-29
申请号:US12259216
申请日:2008-10-27
申请人: YI XIANG WANG , JUYING DOU , JUN JIANT , ZHENG FAN , QINGYU MENG
发明人: YI XIANG WANG , JUYING DOU , JUN JIANT , ZHENG FAN , QINGYU MENG
IPC分类号: H01L21/683
CPC分类号: H01L21/6833 , B82Y10/00 , B82Y40/00 , H01J37/20 , H01J37/28 , H01J37/3174 , H01J2237/0044 , H01J2237/2007 , H01J2237/2008 , H01J2237/24564
摘要: An apparatus for increasing electric conductivity to a wafer substrate, when exposed to electron beam irradiation, is disclosed. More specifically, a methodology to breakdown the insulating layer on wafer backside is provided to significantly reduce the damage on the wafer backside while proceeding with the grounding process.
摘要翻译: 公开了当暴露于电子束照射时增加对晶片衬底的导电性的装置。 更具体地,提供了在晶片背面上击穿绝缘层的方法,以在继续进行接地工艺的同时显着减少晶片背面的损坏。
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