公开(公告)号：US20190170671A1

公开(公告)日：2019-06-06

申请号：US16147277

申请日：2018-09-28

Applicant: Hermes Microvision, Inc.

Inventor： Guochong WENG ,  Youjin WANG ,  Chiyan KUAN ,  Chung-Shih PAN

IPC: G01N23/2251 ,  H05F3/02 ,  H01J37/28 ,  H01J37/02 ,  H01J37/20

CPC classification number: G01N23/2251 ,  H01J37/026 ,  H01J37/20 ,  H01J37/28 ,  H01J2237/004 ,  H01J2237/0041 ,  H01J2237/0044 ,  H01J2237/2007 ,  H01J2237/2008 ,  H01J2237/202 ,  H01J2237/2448 ,  H01J2237/2602 ,  H01J2237/2811 ,  H01J2237/2813 ,  H05F3/02

Abstract: A structure for grounding an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for grounding an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and back side. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUV mask is grounded. The reflective surface of the EUV mask on a continuously moving stage is scanned by using the electron beam simultaneously. The moving direction of the stage is perpendicular to the scanning direction of the electron beam.

公开(公告)号：US09991147B2

公开(公告)日：2018-06-05

申请号：US14531263

申请日：2014-11-03

Applicant: Hermes Microvision Inc.

Inventor： Yi-Xiang Wang ,  Juying Dou ,  Kenichi Kanai

IPC: H01L21/683 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/20 ,  H01J37/28 ,  H01J37/317

CPC classification number: H01L21/6831 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/20 ,  H01J37/28 ,  H01J37/3174 ,  H01J2237/0044 ,  H01J2237/2008

Abstract: A wafer grounding apparatus and method adaptable to a charged particle beam apparatus is disclosed. A wafer substrate is supported by a wafer mount. A pulse current pin is arranged to be in contact with a backside film formed on a backside of the wafer substrate. A grounding pulse generator provides at least one pulse to drive the pulse current pin such that dielectric breakdown occurring at the backside film leads to establishment of a current path through the backside films. Accordingly, a current flows in the wafer substrate through this current path and then flows out of the wafer substrate via at least one current return path formed from capacitive coupling between the wafer substrate and the wafer mount.

公开(公告)号：US20160169782A1

公开(公告)日：2016-06-16

申请号：US14958354

申请日：2015-12-03

Applicant: Nikhilesh Chawla ,  James E. Mertens

Inventor： Nikhilesh Chawla ,  James E. Mertens

IPC: G01N1/44 ,  G01R31/12 ,  H01J37/20 ,  G01N23/04 ,  H01J37/28

CPC classification number: G01R31/1218 ,  G01R31/2858 ,  H01J37/20 ,  H01J37/28 ,  H01J2237/2007 ,  H01J2237/2008

Abstract: Systems and fixtures for mounting, under mechanical constraint, wire-like or fiber-like samples of a high aspect ratio and down to 100 micrometers in diameter are disclosed. A region of interest along the length of the sample resides between and beyond a mechanical constraint on either side, allowing access to the region of interest for a wide number of characterization probes. The fixture may provide electrical isolation between two retaining blocks by means of a dielectric support member. The design may achieve minimal thermal expansion along the length of the sample by the material selection for the dielectric support member. Electrical contact may be introduced to the sample through conductive constraints in the retaining blocks. The fixture may have a minimal size perpendicular to the length axis of the sample to facilitate high probe fluxes when a diverging probe is used. The fixture may provide high x-ray transparency between the retaining blocks. The systems and fixtures as described therefore may provide a means for performing electrical and thermal testing on samples, including but not limited to solder butt-joints, across multimodal in situ characterization and imaging techniques to analyze dynamic electromigration.

Abstract translation: 公开了用于在机械约束下安装高纵横比且直径低至100微米的线状或纤维状样品的系统和固定装置。 沿着样品长度的感兴趣区域位于两侧的机械约束之间，并且超过了任何一侧的机械约束，允许进入大量表征探针的感兴趣区域。 固定装置可以通过介电支撑构件在两个保持块之间提供电隔离。 该设计可以通过电介质支撑构件的材料选择来实现沿样品长度的最小热膨胀。 可以通过导电限制在保持块中将电接触引入样品。 夹具可以具有垂直于样品的长度轴线的最小尺寸，以便当使用发散探针时促进高探针通量。 夹具可以在保持块之间提供高X射线透明度。 因此，所描述的系统和夹具可以提供用于对穿过多模式原位表征和成像技术的样品进行电和热测试的装置，包括但不限于焊接对接点，以分析动态电迁移。

公开(公告)号：US09312097B2

公开(公告)日：2016-04-12

申请号：US14513969

申请日：2014-10-14

Applicant: PROTOCHIPS, INC.

Inventor： David P. Nackashi ,  John Damiano, Jr. ,  Stephen E. Mick ,  Thomas G. Schmelzer ,  Michael Zapata, III

IPC: G21K5/08 ,  H01J37/20 ,  G01N1/28

CPC classification number: H01J37/20 ,  G01N1/28 ,  H01J2237/2002 ,  H01J2237/2007 ,  H01J2237/2008 ,  H01J2237/202 ,  H01J2237/26

Abstract: A novel specimen holder for specimen support devices for insertion in electron microscopes. The novel specimen holder of the invention provides mechanical support for specimen support devices and as well as electrical contacts to the specimens or specimen support devices.

Abstract translation: 用于插入电子显微镜的样品支撑装置的新型样品架。 本发明的新型样品保持器为样品支撑装置提供机械支撑，以及对试样或样品支撑装置的电接触。

公开(公告)号：US09113538B2

公开(公告)日：2015-08-18

申请号：US14039939

申请日：2013-09-27

Applicant: HERMES MICROVISION, INC.

Inventor： You-Jin Wang ,  Chiyan Kuan ,  Chung-Shih Pan

IPC: A61N5/00 ,  H05F3/02 ,  H01J37/02 ,  H01J37/20 ,  G01N23/225

CPC classification number: H05F3/02 ,  G01N23/2251 ,  H01J37/026 ,  H01J37/20 ,  H01J2237/0041 ,  H01J2237/0044 ,  H01J2237/2008 ,  H01J2237/2811

Abstract: A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded.

Abstract translation: 提供一种用于放电极紫外线掩模（EUV掩模）的结构，用于通过电子束检查工具在检查期间对EUV掩模进行放电。 用于放电EUV掩模的结构包括至少一个接触引脚以接触EUV掩模上的导电区域，其中EUV掩模可以在侧壁或/或底部上具有另外的导电层。 通过使用电子束检查系统来增强EUV掩模的检查质量，因为EUU掩模上的累积充电是接地的。

公开(公告)号：US08908348B2

公开(公告)日：2014-12-09

申请号：US12552270

申请日：2009-09-01

Applicant: Yi-Xiang Wang ,  Juying Dou ,  Kenichi Kanai

Inventor： Yi-Xiang Wang ,  Juying Dou ,  Kenichi Kanai

IPC: H01L21/683 ,  H01J37/317 ,  H01J37/20 ,  H01J37/28 ,  B82Y10/00 ,  B82Y40/00

CPC classification number: H01J37/20 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/28 ,  H01J37/3174 ,  H01J2237/0044 ,  H01J2237/2008

Abstract: A wafer grounding apparatus and method adaptable to a charged particle beam apparatus is disclosed. A wafer substrate is supported by a wafer mount. A grounding pin is arranged to be in contact with a backside film formed on a backside of the wafer substrate. A grounding pulse generator provides at least one pulse to drive the grounding pin such that dielectric breakdown occurring at the backside film leads to establishment of a current path through the backside films. Accordingly, a current flows in the wafer substrate through this current path and then flows out of the wafer substrate via at least one current return path formed from capacitive coupling between the wafer substrate and the wafer mount.

Abstract translation: 公开了适用于带电粒子束装置的晶片接地装置和方法。 晶片基板由晶片支架支撑。 接地销布置成与形成在晶片衬底的背面上的背面膜接触。 接地脉冲发生器提供至少一个脉冲来驱动接地引脚，使得在背面薄膜处发生的电介质击穿导致建立通过背面薄膜的电流路径。 因此，电流通过该电流路径流过晶片衬底，然后通过由晶片衬底和晶片座之间的电容耦合形成的至少一个电流返回路径流出晶片衬底。

公开(公告)号：US08872129B2

公开(公告)日：2014-10-28

申请号：US12599339

申请日：2008-05-09

Applicant: John Damiano, Jr. ,  Stephen E. Mick ,  David P. Nackashi

Inventor： John Damiano, Jr. ,  Stephen E. Mick ,  David P. Nackashi

IPC: H01J37/20 ,  H01J37/26

CPC classification number: H01J37/20 ,  H01J37/26 ,  H01J37/261 ,  H01J2237/188 ,  H01J2237/2001 ,  H01J2237/2002 ,  H01J2237/2003 ,  H01J2237/2007 ,  H01J2237/2008 ,  H01J2237/2602 ,  H01J2237/28 ,  H01J2237/2802

Abstract: Electron microscope support structures and methods of making and using same. The support structures are generally constructed using semiconductor materials and semiconductor manufacturing processes. The temperature of the support structure may be controlled and/or gases or liquids may be confined in the observation region for reactions and/or imaging.

Abstract translation: 电子显微镜支撑结构及其制作和使用方法。 支撑结构通常使用半导体材料和半导体制造工艺构造。 可以控制支撑结构的温度和/或气体或液体被限制在观察区域中用于反应和/或成像。

公开(公告)号：US08822951B2

公开(公告)日：2014-09-02

申请号：US13639737

申请日：2010-04-07

Applicant: Yu Sun ,  Changai Ru ,  Yong Zhang

Inventor： Yu Sun ,  Changai Ru ,  Yong Zhang

IPC: H01J37/26 ,  H01J37/20 ,  H01J37/28 ,  H01J37/18

CPC classification number: H01J37/20 ,  H01J37/185 ,  H01J37/28 ,  H01J2237/2007 ,  H01J2237/2008 ,  H01J2237/204 ,  H01J2237/206 ,  H01J2237/208

Abstract: The present invention relates to a carrier device for transporting one or more manipulators into a vacuum specimen chamber of an electron microscope, characterized in that the carrier device comprises: (i) a platform having securing means for detachably securing the one or more manipulators to the platform, and (ii) electrical connectors secured to the platform for the electrical connection of the one or more manipulators. The present invention also relates to a method for transporting the carrier device into the vacuum specimen chamber of the electron microscope without altering the vacuum of the vacuum specimen chamber comprising transporting the carrier device of the invention through the specimen exchange chamber of the electron microscope and into the vacuum specimen chamber.

Abstract translation: 本发明涉及一种用于将一个或多个操纵器输送到电子显微镜的真空样品室中的载体装置，其特征在于，载体装置包括：（i）具有用于将一个或多个操纵器可拆卸地固定到 平台，以及（ii）固定到平台的用于一个或多个操纵器的电连接的电连接器。 本发明还涉及一种用于将载体装置输送到电子显微镜的真空样品室中而不改变真空试样室的真空的方法，包括将本发明的载体装置通过电子显微镜的试样更换室输送到 真空试样室。

公开(公告)号：US20130075605A1

公开(公告)日：2013-03-28

申请号：US13623804

申请日：2012-09-20

Applicant: APPLIED MATERIALS ISRAEL, LTD.

Inventor： Igor Krivts (Krayvitz) ,  Israel Avneri ,  Yoram Uziel ,  Nir Ben-David ,  Ido Holcman ,  Itzak Yair ,  Yosi Basson

IPC: F16B17/00 ,  G01N23/18

CPC classification number: H01J37/20 ,  F16B17/00 ,  G01N23/18 ,  G03F1/22 ,  G03F1/40 ,  H01J2237/0044 ,  H01J2237/20 ,  H01J2237/2008 ,  H01L21/6831 ,  Y10T279/23 ,  Y10T403/70

Abstract: A coupling module may include an upper portion that defines an aperture, mask contact elements, chuck contact elements and an intermediate element that is connected between the mask contact elements and the upper portion. A shape and a size of the aperture may correspond to a shape and size of a pattern transfer area of an extreme ultra violet (EUVL) mask. The coupling module may be shaped and sized so that once the mask contact elements contact the upper portion of the EUVL mask, the chuck contact elements contact a chuck that supports the mask. The coupling module may further provide at least one conductive path between the upper portion of the EUVL mask and the chuck when the EUVL mask is positioned on the chuck.

Abstract translation: 耦合模块可以包括限定孔的上部，掩模接触元件，卡盘接触元件和连接在掩模接触元件和上部之间的中间元件。 孔径的形状和尺寸可以对应于极紫外（EUVL）掩模的图案转移区域的形状和尺寸。 耦合模块的形状和尺寸可以使得一旦掩模接触元件接触EUVL掩模的上部，卡盘接触元件就接触支撑掩模的卡盘。 当EUVL掩模位于卡盘上时，耦合模块还可以在EUVL掩模的上部和卡盘之间提供至少一个导电路径。

公开(公告)号：US20110032611A1

公开(公告)日：2011-02-10

申请号：US12809717

申请日：2008-12-22

Applicant: Stephen E. Mick ,  John Damiano ,  David P. Nackashi

Inventor： Stephen E. Mick ,  John Damiano ,  David P. Nackashi

IPC: G02B21/30 ,  G02B21/26

CPC classification number: H01J37/20 ,  G02B21/30 ,  H01J37/28 ,  H01J2237/2007 ,  H01J2237/2008

Abstract: Devices, mounts, stages, interfaces and systems to be developed that allow for in situ manipulation, experimentation and analysis of specimens directly within an electron microscope.

Abstract translation: 要开发的器件，安装座，平台，接口和系统，可以在电子显微镜内直接进行原位操作，实验和分析样品。