摘要:
This invention provides a phase detector with more than two detector units on a printed circuit layer. A detector set includes a pair of detector units or one detector unit, and a detector row includes a plurality of detector sets in one line. The phase detector includes a plurality of detector rows and each row has a detector set in one period, wherein all detector units are interleaved to have the same interval between any two adjacent detector units, which is defined as a pitch and the pitch is equal to one period dividing the detector pair number, which is the half sum of the number of one detector set for all rows.
摘要:
This invention provides a phase detector with more than two detector units on a printed circuit layer. A detector set includes a pair of detector units or one detector unit, and a detector row includes a plurality of detector sets in one line. The phase detector includes a plurality of detector rows and each row has a detector set in one period, wherein all detector units are interleaved to have the same interval between any two adjacent detector units, which is defined as a pitch and the pitch is equal to one period dividing the detector pair number, which is the half sum of the number of one detector set for all rows.
摘要:
The present invention relates to a charged particle system for reticle or semiconductor wafer defects inspection and review, and more particularly, relates to an E-beam inspection tool for reticle or semiconductor wafer defects inspection and review without gravitational AMC settling. The charged particle system is an upside down electron beam inspection system with an electron beam aimed upward. The face down design may prevent AMC from gravitational settling on the inspected face of the specimen during inspection, thereafter having a cleaner result compared with conventional face-up inspection system.
摘要:
An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside.
摘要:
There are disclosed polyhedral superparamagnetic nanoparticles and methods for making and using the nanoparticles. There are also disclosed coated and functionalized forms of the nanoparticles, methods of using nanoparticles and methods of treatment using nanoparticles.
摘要:
Method and apparatus for removing and neutralizing charges. The method includes loading a structure into a chamber. The structure includes a first surface and a plurality of charges away from the first surface. Additionally, the method includes supplying a first ionized gas to the first surface of the structure, and radiating the structure with a first ultraviolate light. The supplying a first ionized gas and the radiating the structure with a first ultraviolate light are performed simultaneously for a first period of time.
摘要:
This invention provides a design to process a large range of detection beam current at low noise with a single detector. With such a design, the detection system can generate up to 1010 gain and maximum signal output at more than mini Ampere (mA) level. A condenser lens is configured to increase bandwidth of the detector that scan speed can be enhanced.
摘要:
The present invention generally relates to dynamic focus adjustment for an image system. With the assistance of a height detection sub-system, present invention provides an apparatus and methods for micro adjusting an image focusing according the specimen surface height variation by altering the field strength of an electrostatic lens between objective lens and sample stage/or a bias voltage applied to the sample surface. Merely by way of example, the invention has been applied to a scanning electron inspection system. But it would be recognized that the invention could apply to other system using charged particle beam as observation tool with a height detection apparatus.
摘要:
The present invention relates to a defect review system, and/or particularly, to an apparatus and method of defect review sampling, review method and classification on a semiconductor wafer or a pattern lithography reticle during integrated circuit fabrication. These objects are achieved in comparing a reviewed image with a reference image pick-up through a smart sampling filter. A clustering computer system base on high speed network will provide data cache and save operation time and memory. A smart review sampling filter automatically relocate abnormal pattern or defects and classify the device location extracted from design database and/or from golden die image on the same substrate. The column of the present defect review system is comprised of the modified SORIL type objective lens. This column provides solution of improving throughput during sample review, material identification better image quality, and topography image of defect. One embodiment of the present invent adopts an optical auto focusing system to compromise micro height variation due wafer surface topography. And another embodiment adopts surface charge control system to regulate the charge accumulation due to electron irradiation during the review process.
摘要:
A method and system for inspecting a semiconductor wafer. The method includes providing an illumination flux through a pattern plate and a lens to a surface of a specimen to project a pattern onto the surface of the specimen. The pattern is associated with the pattern plate. Additionally, the method includes detecting the illumination flux reflected from the surface of the specimen with a detector, processing information associated with the detected illumination flux, and generating a first image based on at least information associated with the detected illumination flux. The first image includes a first image part for the pattern and a second image part for the specimen. Moreover, the method includes adjusting the lens to a state in order to achieve a first predetermined quality for the first image part, and moving the specimen to a first position.