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    Method and system for determining a defect during charged particle beam inspection of a sample
    2.
    发明授权
    Method and system for determining a defect during charged particle beam inspection of a sample 有权
    用于确定样品的带电粒子束检查期间的缺陷的方法和系统

    公开(公告)号：US08068662B2

    公开(公告)日：2011-11-29

    申请号：US12414130

    申请日：2009-03-30

    申请人： Zhao-Li Zhang ,  Wei Fang ,  Jack Jau

    发明人： Zhao-Li Zhang ,  Wei Fang ,  Jack Jau

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G06T2207/30148

    摘要： A method for determining a defect during charged particle beam inspection of a sample locates at least one examination region within a charged particle microscopic image of the sample by making reference to a database graphic of the sample corresponding to the charged particle microscopic image. Each located examination region concerns at least one element of the sample, and each element has at least one characteristic in common. At least one point response value is then generated for each point in the located examination regions. The presence of a defect at the location of the concerned point is then determined by applying at least one decision tree operator to the generated point response values of the concerned point. Applications of the proposed method as a computing agent and a charged particle beam inspection system are also disclosed.

    摘要翻译： 用于在样品的带电粒子束检查期间确定缺陷的方法通过参考对应于带电粒子显微镜图像的样品的数据库图形来定位样品的带电粒子微观图像内的至少一个检查区域。 每个位置的检查区域涉及样品的至少一个元件，并且每个元件具有至少一个共同的特征。 然后为定位的检查区域中的每个点生成至少一个点响应值。 然后通过将至少一个决策树运算符应用于相关点的生成点响应值来确定在相关点的位置处的缺陷的存在。 还公开了所提出的方法作为计算代理和带电粒子束检查系统的应用。

    CHARGED PARTICLE BEAM INSPECTION METHOD
    4.
    发明申请
    CHARGED PARTICLE BEAM INSPECTION METHOD 有权
    充电颗粒光束检测方法

    公开(公告)号：US20110036981A1

    公开(公告)日：2011-02-17

    申请号：US12540357

    申请日：2009-08-12

    申请人： YAN ZHAO ,  JACK JAU

    发明人： YAN ZHAO ,  JACK JAU

    IPC分类号： G01N23/00

    CPC分类号： G01N23/2206 ,  G01N23/2251 ,  G01N2223/611

    摘要： An imaging method and apparatus for forming images of substantially the same area on a sample for defect inspection within the area are disclosed. The disclosed method includes line-scanning the charged particle beam over the area to form a plurality of n*Y scan lines by repeatedly forming a group of n scan lines for Y times. During the formation of each group of n scan lines, an optical beam is, from one line scan to another, selectively illuminated on the area prior to or simultaneously with scanning of the charged particle beam. In addition, during the formation of each group of n scan lines, a condition of illumination of the optical beam selectively changes from one line scan to another. The conditions at which individual n scan lines are formed are repeated for the formation of all Y groups.

    摘要翻译： 公开了一种用于在该区域内形成用于缺陷检查的样品上基本相同区域的图像的成像方法和装置。 所公开的方法包括通过重复地形成一组n条扫描线Y次，对该区域上的带电粒子束进行线扫描以形成多个n×Y扫描线。 在每组n条扫描线的形成过程中，在扫描带电粒子束之前或同时，光束从一行扫描到另一条扫描线被选择性地照射在该区域上。 此外，在每组n条扫描线的形成期间，光束的照明条件选择性地从一条扫描线变化到另一条扫描线。 重复形成单个n条扫描线的条件以形成所有Y组。

    METHOD AND SYSTEM FOR DETERMINING A DEFECT DURING SAMPLE INSPECTION INVOLVING CHARGED PARTICLE BEAM IMAGING
    5.
    发明申请
    METHOD AND SYSTEM FOR DETERMINING A DEFECT DURING SAMPLE INSPECTION INVOLVING CHARGED PARTICLE BEAM IMAGING 有权
    用于确定涉及带电粒子束成像的样品检验期间的缺陷的方法和系统

    公开(公告)号：US20100158317A1

    公开(公告)日：2010-06-24

    申请号：US12342821

    申请日：2008-12-23

    申请人： Wei Fang ,  Jack Jau

    发明人： Wei Fang ,  Jack Jau

    IPC分类号： G06K9/00

    CPC分类号： G06K9/627 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J2237/221 ,  H01J2237/2817

    摘要： A method for determining a defect during sample inspection involving charged particle beam imaging transforms a target charged particle microscopic image and its corresponding reference charged particle microscopic images each into a plurality of feature images, and then compares the feature images against each other. Each feature image captures and stresses a specific feature which is common to both the target and reference images. The feature images produced by the same operator are corresponding to each other. A distance between corresponding feature images is evaluated. Comparison between the target and reference images is made based on the evaluated distances to determine the presence of a defect within the target charged particle microscopic image.

    摘要翻译： 用于确定涉及带电粒子束成像的样品检查期间的缺陷的方法将目标带电粒子显微镜图像及其对应的参考带电粒子显微镜图像分别转换成多个特征图像，然后将特征图像彼此进行比较。 每个特征图像捕获并强调对目标图像和参考图像共同的特定特征。 由相同操作者产生的特征图像彼此对应。 评估相应特征图像之间的距离。 基于所评估的距离来进行目标和参考图像之间的比较，以确定目标带电粒子显微镜图像内是否存在缺陷。

    E-BEAM DEFECT REVIEW SYSTEM
    6.
    发明申请
    E-BEAM DEFECT REVIEW SYSTEM 有权
    电子束缺陷评估系统

    公开(公告)号：US20100150429A1

    公开(公告)日：2010-06-17

    申请号：US12335458

    申请日：2008-12-15

    申请人： Jack JAU ,  Zhongwei CHEN ,  Yi Xiang WANG ,  Chung-Shih PAN ,  Joe WANG ,  Xuedong LIU ,  Weiming REN ,  Wei FANG

    发明人： Jack JAU ,  Zhongwei CHEN ,  Yi Xiang WANG ,  Chung-Shih PAN ,  Joe WANG ,  Xuedong LIU ,  Weiming REN ,  Wei FANG

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N23/04 ,  G01N2223/102 ,  G01N2223/426 ,  G01N2223/611 ,  G06T2207/10061 ,  G06T2207/30148

    摘要： The present invention relates to a defect review system, and/or particularly, to an apparatus and method of defect review sampling, review method and classification on a semiconductor wafer or a pattern lithography reticle during integrated circuit fabrication. These objects are achieved in comparing a reviewed image with a reference image pick-up through a smart sampling filter. A clustering computer system base on high speed network will provide data cache and save operation time and memory. A smart review sampling filter automatically relocate abnormal pattern or defects and classify the device location extracted from design database and/or from golden die image on the same substrate. The column of the present defect review system is comprised of the modified SORIL type objective lens. This column provides solution of improving throughput during sample review, material identification better image quality, and topography image of defect. One embodiment of the present invent adopts an optical auto focusing system to compromise micro height variation due wafer surface topography. And another embodiment adopts surface charge control system to regulate the charge accumulation due to electron irradiation during the review process.

    摘要翻译： 本发明涉及一种缺陷评估系统，和/或特别涉及在集成电路制造期间对半导体晶片或图案光刻掩模版进行缺陷评估抽样，评估方法和分类的装置和方法。 通过智能采样滤波器将经检查的图像与参考图像拾取进行比较，实现了这些目的。 基于高速网络的集群计算机系统将提供数据缓存，节省操作时间和内存。 智能检查采样过滤器自动重新定位异常模式或缺陷，并将从设计数据库中提取的设备位置和/或从相同基板上的金色模具图像分类。 本缺陷检查系统的列由改进的SORIL型物镜组成。 该栏提供了在样本审查期间提高吞吐量，材料识别更好的图像质量和缺陷的地形图像的解决方案。 本发明的一个实施例采用光学自动聚焦系统来破坏由晶片表面形貌引起的微高度变化。 另一个实施例采用表面电荷控制系统来调节在检查过程中由电子辐射引起的电荷累积。

    Method for examining a sample by using a charged particle beam
    7.
    发明授权
    Method for examining a sample by using a charged particle beam 有权
    通过使用带电粒子束来检查样品的方法

    公开(公告)号：US08937281B2

    公开(公告)日：2015-01-20

    申请号：US13541618

    申请日：2012-07-03

    申请人： Yan Zhao ,  Jack Jau ,  Wei Fang

    发明人： Yan Zhao ,  Jack Jau ,  Wei Fang

    IPC分类号： H01J37/26 ,  H01J37/28

    CPC分类号： H01J37/265 ,  H01J37/28 ,  H01J2237/2817

    摘要： A method for examining a sample with a scanning charged particle beam imaging apparatus. First, an image area and a scan area are specified on a surface of the sample. Herein, the image area is entirely overlapped within the scan area. Next, the scan area is scanned by using a charged particle beam along a direction neither parallel nor perpendicular to an orientation of the scan area. It is possible that only a portion of the scan area overlapped with the image area is exposed to the charged particle beam. It also is possible that both the shape and the size of the image area are essentially similar with that of the scan area, such that the size of the area projected by the charged particle beam is almost equal to the size of the image area.

    摘要翻译： 一种用扫描带电粒子束成像装置检查样品的方法。 首先，在样品的表面上指定图像区域和扫描区域。 这里，图像区域在扫描区域内完全重叠。 接下来，通过使用带电粒子束沿着既不平行也不垂直于扫描区域的取向的方向来扫描扫描区域。 可能的是，与图像区域重叠的扫描区域的仅一部分暴露于带电粒子束。 图像区域的形状和尺寸也可能与扫描区域的形状和尺寸基本相同，使得由带电粒子束投射的区域的尺寸几乎等于图像区域的尺寸。

    Charged particle beam imaging assembly and imaging method thereof
    8.
    发明授权
    Charged particle beam imaging assembly and imaging method thereof 有权
    带电粒子束成像组件及其成像方法

    公开(公告)号：US08884224B2

    公开(公告)日：2014-11-11

    申请号：US12420200

    申请日：2009-04-08

    申请人： Wei Fang ,  Jack Jau ,  Yan Zhao

    发明人： Wei Fang ,  Jack Jau ,  Yan Zhao

    IPC分类号： H01J37/28 ,  H01J37/30 ,  H01J37/02

    CPC分类号： H01J37/28 ,  H01J37/026 ,  H01J2237/004 ,  H01J2237/0044 ,  H01J2237/0048

    摘要： A method for enhancing the quality of a charged particle microscopic image of a sample is disclosed. The image is formed by a charged particle beam imaging system. The method comprising: scanning, using a first scanning beam, a surface of the sample in at least one first scan line; and scanning, using a second scanning beam, the sample surface in at least one second scan line, wherein said second scanning beam is scanned across said sample surface during a time interval between the end of said first scan lines and the beginning of the next said first scan lines. Application of the proposed method as a charged particle beam imaging system is also disclosed.

    摘要翻译： 公开了一种提高样品带电粒子显微镜图像质量的方法。 该图像由带电粒子束成像系统形成。 该方法包括：使用第一扫描光束在至少一个第一扫描线中扫描样品的表面; 以及使用第二扫描光束扫描至少一个第二扫描线中的样品表面，其中所述第二扫描光束在所述第一扫描线的末端与所述第一扫描线的开始之间的时间间隔期间跨越所述样品表面扫描 第一条扫描线。 还公开了所提出的方法作为带电粒子束成像系统的应用。

    Method and system of classifying defects on a wafer
    9.
    发明授权
    Method and system of classifying defects on a wafer 有权
    在晶片上分类缺陷的方法和系统

    公开(公告)号：US08805054B2

    公开(公告)日：2014-08-12

    申请号：US13269038

    申请日：2011-10-07

    申请人： Wei Fang ,  Zhao-Li Zhang ,  Jack Jau

    发明人： Wei Fang ,  Zhao-Li Zhang ,  Jack Jau

    IPC分类号： G06K9/00

    CPC分类号： G06T7/0008 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

    摘要： A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.

    摘要翻译： 提供了在具有相同芯片和相应系统的晶片上分类缺陷的方法。 在接收到通过使用带电粒子束扫描晶片形成的图像之后，检查这些图像，使得发现缺陷图像和无缺陷图像。 然后，将无缺陷图像转换为芯片的模拟布局，或者使用数据库来提供芯片的模拟布局。 最后，通过将图像与芯片的模拟布局进行比较来分类缺陷图像上的缺陷。 系统有一些模块分别对应于该方法的步骤。