公开(公告)号：US20150027754A1

公开(公告)日：2015-01-29

申请号：US14373218

申请日：2013-01-18

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Koichiro Shimoda ,  Yasuhito Iizuka ,  Masaki Yamamoto ,  Yoro Sasaki ,  Hiroaki Adachi ,  Shuji Kashiwagi

IPC: C08G73/10 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00

CPC classification number: C08G73/1075 ,  B32B27/281 ,  C08G18/58 ,  C08G18/61 ,  C08G18/73 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1071 ,  C08K5/353 ,  C08L79/08 ,  H05K1/0201 ,  H05K1/0298 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/427 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/051 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 μm/sec to 0.02 μm/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG). When a multilayer flexible wiring board is manufactured using the resin composition, it is possible to obtain the resin layer excellent in alkali processability, embeddability in press, heat resistance, bendability, insulation reliability, and adhesion to the conductive layer.

Abstract translation: 一种含有（A）具有酸性官能团的聚酰亚胺和（B）具有与酸性官能团反应的官能团的化合物的树脂组合物，其中（a）在3质量％氢氧化钠水溶液中在45℃下的溶解速率为 在90℃的热历程为0.95以上，热历史假定为1之前的溶解速度为10分钟，（b）在3质量％氢氧化钠水溶液中在45℃下的溶解速度为0.001μm /秒至0.02μm/秒，在180℃的热历程60分钟后，（c）在40℃下储存2周后的渗出量为50mg / m 2以下， 180℃，60分钟，（d）通过热重分析（TG）在40℃的温度升高条件下，在260℃下的热重量比降低为2.0％以下。 。 当使用树脂组合物制造多层柔性布线板时，可以获得在碱加工性，压制嵌入性，耐热性，弯曲性，绝缘可靠性以及与导电层的粘附性优异的树脂层中。

公开(公告)号：US09896546B2

公开(公告)日：2018-02-20

申请号：US14373218

申请日：2013-01-18

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Koichiro Shimoda ,  Yasuhito Iizuka ,  Masaki Yamamoto ,  Yoro Sasaki ,  Hiroaki Adachi ,  Shuji Kashiwagi

IPC: C08G73/10 ,  C08K5/353 ,  C08L79/08 ,  B32B27/28 ,  C08G18/58 ,  C08G18/61 ,  C08G18/73 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: C08G73/1075 ,  B32B27/281 ,  C08G18/58 ,  C08G18/61 ,  C08G18/73 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1071 ,  C08K5/353 ,  C08L79/08 ,  H05K1/0201 ,  H05K1/0298 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/427 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/051 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 μm/sec to 0.02 μm/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG). When a multilayer flexible wiring board is manufactured using the resin composition, it is possible to obtain the resin layer excellent in alkali processability, embeddability in press, heat resistance, bendability, insulation reliability, and adhesion to the conductive layer.