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    Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
    1.
    发明授权
    Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination 有权

    公开(公告)号：US11626313B2

    公开(公告)日：2023-04-11

    申请号：US17126812

    申请日：2020-12-18

    Applicant: ASM IP HOLDING B.V.

    Inventor： Carl Louis White ,  Kyle Fondurulia ,  John Kevin Shugrue

    IPC: H01L21/687 ,  C23C16/455 ,  C23C16/44 ,  C23C16/458 ,  H01L21/67

    Abstract: The present disclosure relates to a semiconductor processing apparatus having a reaction chamber which can include a baseplate having an opening; a moveable substrate support configured to support a substrate; a movement element configured to move a substrate held on the substrate support towards the opening of the baseplate; a plurality of gas inlets positioned above and configured to direct gas downwardly towards the substrate support; and a sealing element configured to form a seal between the baseplate and the substrate support, the seal positioned at a greater radial distance from a center of the substrate support than an outer edge of the substrate support. In some embodiments, the sealing element can also include a plurality of apertures extend through the sealing element, the apertures configured to provide a flow path between a position below the sealing element to a position above the sealing element.

    MULTIPLE TEMPERATURE RANGE SUSCEPTOR, ASSEMBLY, REACTOR AND SYSTEM INCLUDING THE SUSCEPTOR, AND METHODS OF USING THE SAME
    2.
    发明申请
    MULTIPLE TEMPERATURE RANGE SUSCEPTOR, ASSEMBLY, REACTOR AND SYSTEM INCLUDING THE SUSCEPTOR, AND METHODS OF USING THE SAME 审中-公开
    多个温度范围的阻塞器，组件，包括SUSCEPTOR的反应器和系统及其使用方法

    公开(公告)号：US20160097123A1

    公开(公告)日：2016-04-07

    申请号：US14508489

    申请日：2014-10-07

    Applicant: ASM IP Holding B.V.

    Inventor： John Kevin Shugrue

    IPC: C23C16/455 ,  C23C16/46 ,  C23C16/458

    CPC classification number: C23C16/46 ,  C23C16/4586

    Abstract: Susceptor assemblies, reactors and systems including the assemblies, and methods of using the assemblies, reactors, and systems are disclosed. Exemplary susceptor assemblies include two or more sections that can be moved relative to each other to allow rapid changes in a substrate temperature. The movement of the two or more sections can additionally or alternatively be used to manipulate conductance of gas flow though a reactor.

    Abstract translation: 公开了包括组件的受体组件，反应器和系统以及使用组件，反应器和系统的方法。 示例性的感受器组件包括两个或更多个可相对于彼此移动以允许衬底温度快速变化的部分。 两个或更多个部分的移动可以附加地或替代地用于操纵通过反应器的气流的电导。

    SEMICONDUCTOR PROCESSING APPARATUS AND METHODS FOR MONITORING AND CONTROLLING A SEMICONDUCTOR PROCESSING APPARATUS
    4.
    发明申请
    SEMICONDUCTOR PROCESSING APPARATUS AND METHODS FOR MONITORING AND CONTROLLING A SEMICONDUCTOR PROCESSING APPARATUS 审中-公开

    公开(公告)号：US20190276934A1

    公开(公告)日：2019-09-12

    申请号：US15917224

    申请日：2018-03-09

    Applicant: ASM IP Holding B.V.

    Inventor： Mohith Verghese ,  Todd Dunn ,  John Kevin Shugrue

    IPC: C23C16/455 ,  C23C16/46 ,  C23C16/52

    Abstract: A semiconductor processing apparatus is disclosed. The apparatus may include a multiple chamber module comprising at least a first reaction chamber and a second reaction chamber, and a first substrate support structure disposed within the first reaction chamber and a second substrate support structure disposed within the second reaction chamber. The apparatus may also include a wafer handling chamber comprising a transfer robot configured for transferring two or more substrates along a first transfer path between the wafer handling chamber and the first substrate support structure and a second transfer path between the wafer handling chamber and the second substrate support structure. The apparatus may also include at least a first pyrometer and a second pyrometer, wherein a first optical path of the first pyrometer intersects the first transfer path and a second optical path of the second pyrometer intersect the second transfer path. Methods of monitoring and controlling a semiconductor processing apparatus are also disclosed.

    APPARATUS AND METHODS FOR ISOLATING A REACTION CHAMBER FROM A LOADING CHAMBER RESULTING IN REDUCED CONTAMINATION
    5.
    发明申请
    APPARATUS AND METHODS FOR ISOLATING A REACTION CHAMBER FROM A LOADING CHAMBER RESULTING IN REDUCED CONTAMINATION 有权

    公开(公告)号：US20210104427A1

    公开(公告)日：2021-04-08

    申请号：US17126750

    申请日：2020-12-18

    Applicant: ASM IP HOLDING B.V.

    Inventor： Carl Louis White ,  Kyle Fondurulia ,  John Kevin Shugrue ,  David Marquardt

    IPC: H01L21/687 ,  C23C16/458 ,  C23C16/455 ,  C23C16/44 ,  H01L21/67

    Abstract: The present disclosure relates to a semiconductor processing apparatus having a reaction chamber which can include a baseplate having an opening; a moveable substrate support configured to support a substrate; a movement element configured to move a substrate held on the substrate support towards the opening of the baseplate; a plurality of gas inlets positioned above and configured to direct gas downwardly towards the substrate support; and a sealing element configured to form a seal between the baseplate and the substrate support, the seal positioned at a greater radial distance from a center of the substrate support than an outer edge of the substrate support. In some embodiments, the sealing element can also include a plurality of apertures extend through the sealing element, the apertures configured to provide a flow path between a position below the sealing element to a position above the sealing element. Some embodiments include two or more stacked sealing elements.

    APPARATUS AND METHODS FOR ISOLATING A REACTION CHAMBER FROM A LOADING CHAMBER RESULTING IN REDUCED CONTAMINATION
    7.
    发明申请
    APPARATUS AND METHODS FOR ISOLATING A REACTION CHAMBER FROM A LOADING CHAMBER RESULTING IN REDUCED CONTAMINATION 审中-公开

    公开(公告)号：US20190139808A1

    公开(公告)日：2019-05-09

    申请号：US16031613

    申请日：2018-07-10

    Applicant: ASM IP HOLDING B.V.

    Inventor： Carl Louis White ,  Kyle Fondurulia ,  John Kevin Shugrue ,  David Marquardt

    IPC: H01L21/687 ,  C23C16/458 ,  C23C16/455 ,  C23C16/44

    Abstract: The present disclosure relates to a semiconductor processing apparatus having a reaction chamber which can include a baseplate having an opening; a moveable substrate support configured to support a substrate; a movement element configured to move a substrate held on the substrate support towards the opening of the baseplate; a plurality of gas inlets positioned above and configured to direct gas downwardly towards the substrate support; and a sealing element configured to form a seal between the baseplate and the substrate support, the seal positioned at a greater radial distance from a center of the substrate support than an outer edge of the substrate support. In some embodiments, the sealing element can also include a plurality of apertures extend through the sealing element, the apertures configured to provide a flow path between a position below the sealing element to a position above the sealing element. Some embodiments include two or more stacked sealing elements.

    SHOWERHEAD ASSEMBLY FOR DISTRIBUTING A GAS WITHIN A REACTION CHAMBER AND A METHOD FOR CONTROLLING THE TEMPERATURE UNIFORMITY OF A SHOWERHEAD ASSEMBLY
    8.
    发明申请
    SHOWERHEAD ASSEMBLY FOR DISTRIBUTING A GAS WITHIN A REACTION CHAMBER AND A METHOD FOR CONTROLLING THE TEMPERATURE UNIFORMITY OF A SHOWERHEAD ASSEMBLY 审中-公开

    公开(公告)号：US20190040529A1

    公开(公告)日：2019-02-07

    申请号：US16042791

    申请日：2018-07-23

    Applicant: ASM IP Holding B.V.

    Inventor： Melvin Verbaas ,  Jereld Lee Winkler ,  John Kevin Shugrue ,  Carl Louis White

    IPC: C23C16/455

    Abstract: A showerhead assembly for distributing a gas within a reaction chamber is disclosed. The showerhead assembly may comprise: a chamber formed within the showerhead assembly and a gas distribution assembly adjacent to the chamber, wherein the gas distribution assembly comprises: a first gas distribution plate comprising a top surface and a bottom surface; and a second gas distribution plate comprising a top surface and a bottom surface, the second gas distribution plate being disposed over the top surface of the first gas distribution plate. The gas distribution assembly may further comprise: one or more heating structures disposed between the first gas distribution plate and the second gas distribution plate; and a plurality of apertures extending from the bottom surface of the first distribution plate to the top surface of the second gas distribution plate. Methods for controlling the temperature uniformity of a showerhead assembly utilized for distribution gas with a reaction chamber are also disclosed.

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