公开(公告)号：US10461808B2

公开(公告)日：2019-10-29

申请号：US16132604

申请日：2018-09-17

Applicant: ASUSTeK COMPUTER INC.

Inventor： Hank Lin ,  Bin-Chyi Tseng ,  Tsung-Chieh Yen

IPC: H04B3/54 ,  H04B3/06

Abstract: A signal transmission assembly includes a substrate, a first transmission line, and a second transmission line. The first transmission line and the second transmission line are disposed on the substrate and extending along a first direction. The first transmission line comprises at least one first transmission section and at least one second transmission section. The first transmission section is apart from the second transmission line by a first distance. The second transmission section is apart from the second transmission line by a second distance. The first distance is greater than or equal to the second distance. A first edge of the first transmission section and a second edge of the second transmission section are proximal to the second transmission line and parallel to the first direction, and the second transmission line does not contact an edge extension line extending from the second edge along the first direction.

公开(公告)号：US10057975B2

公开(公告)日：2018-08-21

申请号：US15703041

申请日：2017-09-13

Applicant: ASUSTeK COMPUTER INC.

Inventor： Hank Lin ,  Bin-Chyi Tseng ,  Chung-Han Tsai ,  Shih-Keng Chuang

IPC: H05K1/00 ,  H05K1/02 ,  H01R12/57 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/0213 ,  H01R12/57 ,  H01R12/724 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K3/10 ,  H05K3/306 ,  H05K3/40 ,  H05K2201/10022

Abstract: An electronic assembly and a method for manufacturing the electronic assembly are provided. The method includes: configuring a chip and a connector at a first wiring layer of a PCB, and determining a first trace between a first pin of the chip and a first pin of the connector, and a second trace between a second pin of the chip and a second pin of the connector according to a first internal resistance of the chip, a second internal resistance of the chip, a first internal resistance of the connector, and a second internal resistance of the connector.

公开(公告)号：US09755320B2

公开(公告)日：2017-09-05

申请号：US14622925

申请日：2015-02-16

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bin-Chyi Tseng ,  Tsung-Chieh Yen ,  Chih-Chung Lin

IPC: H01Q1/50 ,  H01Q19/02 ,  H01P1/20 ,  H05K1/00 ,  H01Q1/24 ,  H01Q15/00

CPC classification number: H01Q19/021 ,  H01P1/2005 ,  H01Q1/243 ,  H01Q15/006 ,  H05K1/00 ,  H05K1/0236 ,  H05K1/165

Abstract: An electromagnetic bandgap structure and an electronic device having the same are provided. The electromagnetic bandgap structure includes a first conductive element, a second conductive element and a planar inductive element. The planar inductive element is disposed between the first conductive element and the second conductive element. Furthermore, the planar inductive element is electrically connected to the first conductive element via a first conductive pillar, and it is electrically connected to the second conductive element via a second conductive pillar.

公开(公告)号：US20160062417A1

公开(公告)日：2016-03-03

申请号：US14689044

申请日：2015-04-16

Applicant: ASUSTeK COMPUTER INC.

Inventor： Fang-Hsien Chu ,  Chih-Chung Lin ,  Yi-Ting Hsieh ,  Chia-Min Chuang ,  Saou-Wen Su ,  Bin-Chyi Tseng ,  Jian-Sheng Hsieh ,  Tsung-Chieh Yen

IPC: G06F1/16 ,  A61B5/0408 ,  A61B5/00

CPC classification number: A61B5/0408 ,  A61B5/0002 ,  A61B5/04085 ,  A61B5/681 ,  G06F1/163 ,  G06F1/1698

Abstract: A wearable electronic device includes a device body and a wearing element. The wearing element is connected to the device body. The device body includes a conductive upper cover, a conductive lower cover, an insulating frame and a circuit system. The insulating frame is disposed between the conductive upper cover and the conductive lower cover and forms an accommodating space therewith. The circuit system is disposed in the accommodating space. The conductive upper cover has a first feeding point. The conductive lower cover has a second feeding point. The circuit system is coupled to the first feeding point and the second feeding point respectively.

Abstract translation: 佩戴式电子装置包括装置本体和磨损元件。 磨损元件连接到设备主体。 装置主体包括导电上盖，导电下盖，绝缘框架和电路系统。 绝缘框架设置在导电上盖和导电下盖之间并与之形成容纳空间。 电路系统设置在容纳空间中。 导电上盖具有第一馈电点。 导电下盖具有第二馈电点。 电路系统分别耦合到第一馈电点和第二馈电点。

公开(公告)号：US10476165B2

公开(公告)日：2019-11-12

申请号：US15169720

申请日：2016-05-31

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bin-Chyi Tseng ,  Tsung-Chieh Yen ,  Sheng-Chao Hong ,  Chin-Chia Chang ,  Hsien-Hsun Li

IPC: H01Q15/00 ,  H01Q1/38

Abstract: An artificial magnetic conductor comprising a base board, a first conducting element, a second conducting element and a first lumped element is provided. The first conducting element is disposed at a first side of the base board. The first conducting element includes an opening. The second conducting element is disposed at a second side of the base board. The first lumped element is disposed on the corresponding first conducting element. An electronic device including the artificial magnetic conductor is also provided.

公开(公告)号：US09833159B2

公开(公告)日：2017-12-05

申请号：US14689044

申请日：2015-04-16

Applicant: ASUSTeK COMPUTER INC.

Inventor： Fang-Hsien Chu ,  Chih-Chung Lin ,  Yi-Ting Hsieh ,  Chia-Min Chuang ,  Saou-Wen Su ,  Bin-Chyi Tseng ,  Jian-Sheng Hsieh ,  Tsung-Chieh Yen

IPC: A61B5/0408 ,  G06F1/16 ,  A61B5/00

CPC classification number: A61B5/0408 ,  A61B5/0002 ,  A61B5/04085 ,  A61B5/681 ,  G06F1/163 ,  G06F1/1698

Abstract: A wearable electronic device includes a device body and a wearing element. The wearing element is connected to the device body. The device body includes a conductive upper cover, a conductive lower cover, an insulating frame and a circuit system. The insulating frame is disposed between the conductive upper cover and the conductive lower cover and forms an accommodating space therewith. The circuit system is disposed in the accommodating space. The conductive upper cover has a first feeding point. The conductive lower cover has a second feeding point. The circuit system is coupled to the first feeding point and the second feeding point respectively.

公开(公告)号：US20160351999A1

公开(公告)日：2016-12-01

申请号：US15169720

申请日：2016-05-31

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bin-Chyi Tseng ,  Tsung-Chieh Yen ,  Sheng-Chao Hong ,  Chin-Chia Chang ,  Hsien-Hsun Li

IPC: H01Q1/24 ,  H01Q1/50

CPC classification number: H01Q15/0086 ,  H01Q1/38

Abstract: An artificial magnetic conductor comprising a base board, a first conducting element, a second conducting element and a first lumped element is provided. The first conducting element is disposed at a first side of the base board. The first conducting element includes an opening The second conducting element is disposed at a second side of the base board. The first lumped element is disposed on the corresponding first conducting element. An electronic device including the artificial magnetic conductor is also provided.

Abstract translation: 提供一种包括基板，第一导电元件，第二导电元件和第一集总元件的人造磁性导体。 第一导电元件设置在基板的第一侧。 第一导电元件包括​​开口。第二导电元件设置在基板的第二侧。 第一集总元件设置在相应的第一导电元件上。 还提供了包括人造磁导体的电子设备。

公开(公告)号：US10595395B2

公开(公告)日：2020-03-17

申请号：US15889694

申请日：2018-02-06

Applicant: ASUSTEK COMPUTER INC.

Inventor： Hank Lin ,  Bin-Chyi Tseng ,  Tsung-Chieh Yen

IPC: H05K1/02

Abstract: A circuit layout structure is provided. In the circuit layout structure, a transmission line group is disposed on a substrate. In its first differential signal transmission line pair, a first negative polarity transmission line is parallel to a first positive polarity transmission line and is configured to transmit a first negative polarity transmission signal of a first differential signal. In a second differential signal transmission line pair, a second positive polarity transmission line is parallel to a single-ended signal transmission line and is configured to transmit a second positive polarity transmission signal of a second differential signal. The second negative polarity transmission line is parallel to the second positive polarity transmission line. The single-ended signal transmission line is disposed between the first differential signal transmission line pair and the second differential signal transmission line pair.

公开(公告)号：US20180098415A1

公开(公告)日：2018-04-05

申请号：US15703041

申请日：2017-09-13

Applicant: ASUSTeK COMPUTER INC.

Inventor： Hank Lin ,  Bin-Chyi Tseng ,  Chung-Han Tsai ,  Shih-Keng Chuang

IPC: H05K1/02 ,  H01R12/57 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  H05K3/10

CPC classification number: H05K1/0213 ,  H01R12/57 ,  H01R12/724 ,  H05K1/115 ,  H05K1/181 ,  H05K3/10 ,  H05K3/306 ,  H05K3/40 ,  H05K2201/10022

Abstract: An electronic assembly and a method for manufacturing the electronic assembly are provided. The method includes: configuring a chip and a connector at a first wiring layer of a PCB, and determining a first trace between a first pin of the chip and a first pin of the connector, and a second trace between a second pin of the chip and a second pin of the connector according to a first internal resistance of the chip, a second internal resistance of the chip, a first internal resistance of the connector, and a second internal resistance of the connector.

公开(公告)号：US20160006093A1

公开(公告)日：2016-01-07

申请号：US14622925

申请日：2015-02-16

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bin-Chyi Tseng ,  Tsung-Chieh Yen ,  Chih-Chung Lin

IPC: H01P1/20 ,  H01Q19/02 ,  H01P3/08

CPC classification number: H01Q19/021 ,  H01P1/2005 ,  H01Q1/243 ,  H01Q15/006 ,  H05K1/00 ,  H05K1/0236 ,  H05K1/165

Abstract: An electromagnetic bandgap structure and an electronic device having the same are provided. The electromagnetic bandgap structure includes a first conductive element, a second conductive element and a planar inductive element. The planar inductive element is disposed between the first conductive element and the second conductive element. Furthermore, the planar inductive element is electrically connected to the first conductive element via a first conductive pillar, and it is electrically connected to the second conductive element via a second conductive pillar.

Abstract translation: 提供电磁带隙结构和具有该电磁带隙结构的电子装置。 电磁带隙结构包括第一导电元件，第二导电元件和平面电感元件。 平面感应元件设置在第一导电元件和第二导电元件之间。 此外，平面感应元件经由第一导电柱电连接到第一导电元件，并且其经由第二导电柱电连接到第二导电元件。