公开(公告)号：US20040257748A1

公开(公告)日：2004-12-23

申请号：US10818951

申请日：2004-04-06

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Robert Heistand II ,  John L. Galvagni ,  Sriram Dattaguru ,  Jeffrey A. Horn ,  Richard A. Ladew

IPC分类号： H01G004/228

CPC分类号： H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H01L2924/01029 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435

摘要： A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device. Selected of the conductive elements may be formed by a finite volume percentage of ceramic material for enhanced durability, and external lands may be thicker than internal conductive elements and/or may also be embedded in top and/or bottom component surfaces. A variety of potential internal electrode configurations are possible including ones configured for orientation-insensitive component mounting and for high density peripheral termination interdigitated capacitors.

摘要翻译： 多层电子部件包括与多个内部电极元件和多个内部固定突片交错的多个电介质层。 内部电极元件和锚定片的部分沿着电子元件的外围在一个或多个对齐的列中露出。 每个暴露部分在与给定列中的其它暴露部分预定距离内，使得桥接端接可以通过在选定的分别对准的柱上沉积一个或多个电镀终止材料而形成。 可以提供内部锚定突片并以与其它暴露的导电部分的预定关系暴露，以帮助沿着装置的周边使金属化电镀材料成核。 可以提供外部锚定片或平台以形成延伸到装置的顶部和/或底部表面的终端。 选择的导电元件可以由有限体积百分比的陶瓷材料形成，以增强耐久性，并且外部焊盘可以比内部导电元件厚，和/或也可以嵌入在顶部和/或底部部件表面中。 各种潜在的内部电极配置是可能的，包括被配置用于定向不敏感元件安装和用于高密度外围端接叉指电容器的构造。

公开(公告)号：US20040090732A1

公开(公告)日：2004-05-13

申请号：US10632514

申请日：2003-08-01

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Robert Heistand II ,  John L. Galvagni ,  Sriram Dattaguru

IPC分类号： H01G004/228

CPC分类号： H01C1/14 ,  C23C18/1605 ,  C23C18/1639 ,  C23C18/1886 ,  H01C7/008 ,  H01C7/10 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  Y02P70/611 ,  Y10T29/43 ,  Y10T29/435

摘要： Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

公开(公告)号：US20030231457A1

公开(公告)日：2003-12-18

申请号：US10409023

申请日：2003-04-08

申请人： AVX Corporation

发明人： Andrew P. Ritter ,  Robert Heistand II ,  John L. Galvagni ,  Sriram Dattaguru

IPC分类号： H01G004/228

CPC分类号： H01G4/30 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/32 ,  C23C18/38 ,  C23C18/48 ,  C23C28/021 ,  C23C28/023 ,  C25D3/56 ,  C25D5/02 ,  C25D5/34 ,  C25D7/00 ,  H01C1/14 ,  H01C7/008 ,  H01C7/10 ,  H01C17/28 ,  H01F41/04 ,  H01G4/005 ,  H01G4/008 ,  H01G4/012 ,  H01G4/06 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H05K3/02 ,  H05K3/403 ,  H05K2201/09709 ,  Y10T29/417 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49099 ,  Y10T29/49101

摘要： Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

摘要翻译： 公开了改进的多层电子部件的端接特征。 单片组件设置有电镀端接，从而消除或大大简化了对典型厚膜端接条的需要。 这种终端技术消除了许多典型的终端问题，并且能够以更细的间距实现更高数量的终端，这对于较小的电子部件可能是特别有益的。 受电镀的端子通过暴露的内部电极接线片和附加的锚固片部分被引导和锚固，该锚固片部分可任选地延伸到多层部件的覆盖层。 这种锚定片可以相对于芯片结构位于内部或外部，以使附加的金属化电镀材料成核。 位于整体式结构的顶部和底部的外部锚固片可有助于形成环绕电镀终端。 所公开的技术可以与多个单片多层组件一起使用，包括交错电容器，多层电容器阵列和集成无源组件。 可以采用各种不同的电镀技术和终止材料来形成受试者自确定的电镀终端。