公开(公告)号：US06469086B1

公开(公告)日：2002-10-22

申请号：US09596423

申请日：2000-06-19

申请人： Achim Neu ,  Alexandra Atzesdorfer ,  Thies Janczek

发明人： Achim Neu ,  Alexandra Atzesdorfer ,  Thies Janczek

IPC分类号： C08K338

CPC分类号： H01L23/295 ,  C08J5/124 ,  C08K3/01 ,  H01L23/49513 ,  H01L2924/0002 ,  Y10S977/779 ,  Y10S977/893 ,  Y10T428/31678 ,  H01L2924/00

摘要： An integrated circuit has a lead frame, on which a chip of a semiconductor material is attached by a layer of adhesive. The layer of adhesive has at least one filler and a plastic material. The filler is formed of spherical nanoscale particles produced by a condensation process, which may be conductive or insulating. It is also possible to provide the chip with a sheathing which has such fillers.

摘要翻译： 集成电路具有引线框架，半导体材料的芯片通过一层粘合剂附着在该引线框架上。 粘合剂层具有至少一种填料和塑料材料。 填料由通过冷凝工艺生产的球形纳米尺寸颗粒形成，其可以是导电的或绝缘的。 还可以为芯片提供具有这种填充物的护套。

公开(公告)号：US6036173A

公开(公告)日：2000-03-14

申请号：US200070

申请日：1998-11-25

申请人： Achim Neu ,  Thies Janczek ,  Gunter Tutsch

发明人： Achim Neu ,  Thies Janczek ,  Gunter Tutsch

IPC分类号： H01L23/495

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/3025

摘要： A semiconductor component has a semiconductor chip, connection elements, and a housing made of a molding compound. The semiconductor chip has contact pads on a top side. The contact pads are electrically connected to the connection elements via bonding wires. The connection elements overlap the semiconductor chip and they are affixed to the semiconductor chip with an adhesive tape. The adhesive tape has a carrier sheet of aluminum oxide and an adhesive layer applied on both sides of the carrier sheet.

摘要翻译： 半导体部件具有半导体芯片，连接元件和由模塑料制成的壳体。 半导体芯片在顶侧具有接触焊盘。 接触焊盘通过接合线电连接到连接元件。 连接元件与半导体芯片重叠，并且用粘合带固定到半导体芯片。 胶带具有氧化铝载体片和涂布在载体片两侧的粘合剂层。

公开(公告)号：US06313514B1

公开(公告)日：2001-11-06

申请号：US09093336

申请日：1998-06-08

申请人： Jürgen Winterer ,  Eric Bootz ,  Bernd Stadler ,  Achim Neu ,  Thies Janczek

发明人： Jürgen Winterer ,  Eric Bootz ,  Bernd Stadler ,  Achim Neu ,  Thies Janczek

IPC分类号： H01L2982

CPC分类号： B81B7/007 ,  G01L19/0084 ,  G01L19/0645 ,  G01L19/141 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012

摘要： The pressure sensor component has a chip carrier carrying a semiconductor chip with an integrated pressure sensor having a pressure-detecting surface exposed to the pressure to be measured. A device encapsulation made from an electrically insulating material surrounds the entire assembly except for protruding electrode terminals. Bond wires connect the electrode terminals with the pressure sensor and/or the electronic circuit of the semiconductor chip. The device encapsulation consists entirely of a homogeneous pressure-transmitting medium comprising an enveloping compound, which transmits the pressure to be measured as free from delay and attenuation as possible but is mechanically resistant and dimensionally stable. The pressure to be measured is transmitted directly by the enveloping compound onto the pressure-detecting surface of the semiconductor chip, and the pressure sensor and/or the pressure sensor component is covered tightly on all sides against mechanical and/or chemical influences.

摘要翻译： 压力传感器部件具有承载具有集成压力传感器的半导体芯片的芯片载体，其具有暴露于待测量的压力的压力检测表面。 由电绝缘材料制成的器件封装围绕整个组件，除了突出的电极端子。 接合线将电极端子与半导体芯片的压力传感器和/或电子电路连接。 装置封装完全由均匀的压力传递介质组成，包括一个包封化合物，其将要测量的压力尽可能地不受延迟和衰减的影响，但具有机械抵抗和尺寸稳定性。 被测量的压力直接由包络化合物传递到半导体芯片的压力检测表面上，并且压力传感器和/或压力传感器部件在所有方面被紧密地覆盖以抵抗机械和/或化学影响。

公开(公告)号：US06400006B2

公开(公告)日：2002-06-04

申请号：US09771675

申请日：2001-01-29

申请人： Achim Neu ,  Thies Janczek

发明人： Achim Neu ,  Thies Janczek

IPC分类号： H01L2302

CPC分类号： H01L24/02 ,  H01L23/49805 ,  H01L23/49861 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/0919 ,  Y02P70/613 ,  H01L2924/00

摘要： The integrated component has a plurality of contact elements disposed at an edge region of a main surface of the integrated component which contains the functional element. The contact elements project into the edge region of the main surface and have at least one contact surface that is inclined relative to the main surface. The component is configured to be fastened to conductor tracks of a fastening device, such that the conductor tracks are disposed to face the component body and extend parallel to the main surface of the component body.

摘要翻译： 集成部件具有设置在包含功能元件的集成部件的主表面的边缘区域处的多个接触元件。 接触元件突出到主表面的边缘区域中并且具有相对于主表面倾斜的至少一个接触表面。 该部件被配置为紧固到紧固装置的导体轨道，使得导体轨道设置成面向组件主体并且平行于部件主体的主表面延伸。

公开(公告)号：US06201467B1

公开(公告)日：2001-03-13

申请号：US09382530

申请日：1999-08-25

申请人： Jürgen Winterer ,  Eric Bootz ,  Bernd Stadler ,  Achim Neu ,  Thies Janczek

发明人： Jürgen Winterer ,  Eric Bootz ,  Bernd Stadler ,  Achim Neu ,  Thies Janczek

IPC分类号： H01C1010

CPC分类号： G01L19/141 ,  G01L19/0038 ,  G01L19/0084

摘要： The pressure sensor component has a chip carrier with an approximately planar chip carrier surface. A semiconductor chip with an integrated pressure sensor is placed on the chip carrier surface. A pressure-detecting surface area of the pressure sensor is exposed to a pressure to be measured. The component is encapsulated with electrically insulating material that encloses the semiconductor chip and/or the chip carrier at least in regions. A chimney-shaped connection piece that projects up relative to the pressure-detecting area of the pressure sensor penetrates through the encapsulation and is connected to the pressure sensor. The connection piece, which is a separate structural element is incorporated in the component encapsulation and it encloses at least the pressure-detecting surface area in a pressure-tight manner with its end bearing on the semiconductor chip. The connection piece is open toward the outside at its opposite end so as to expose the pressure sensor to the pressure to be measured. The invention furthermore relates to a method for producing such a pressure sensor component.

摘要翻译： 压力传感器部件具有具有近似平面的芯片载体表面的芯片载体。 具有集成压力传感器的半导体芯片放置在芯片载体表面上。 压力传感器的压力检测表面积暴露于要测量的压力。 该部件用至少在区域中封装半导体芯片和/或芯片载体的电绝缘材料封装。 相对于压力传感器的压力检测区域向上突出的烟囱形连接件穿透封装并连接到压力传感器。 作为单独的结构元件的连接件被结合在部件封装中，并且其端部承载在半导体芯片上的至少压力检测表面区域以压力密封的方式封闭。 连接件在其相对端向外打开，以将压力传感器暴露于要测量的压力。 本发明还涉及一种用于制造这种压力传感器部件的方法。

公开(公告)号：US06186008B1

公开(公告)日：2001-02-13

申请号：US09349551

申请日：1999-07-08

申请人： Thies Janczek ,  Bernd Stadler ,  Detlef Houdeau

发明人： Thies Janczek ,  Bernd Stadler ,  Detlef Houdeau

IPC分类号： G01L900

CPC分类号： B81B7/0058 ,  B81B3/007 ,  B81B7/0061 ,  B81C2203/0163 ,  G01L19/0038 ,  G01L19/0645 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A housing for a semiconductor sensor configuration, in which a sensor and an evaluation logic are integrated in a semiconductor body is disclosed. The housing has a base body upon which the semiconductor body is applied and a cover that encloses the semiconductor body in the base body. The cover is directly set on the base body of the housing and contains a membrane and/or labyrinth.

摘要翻译： 公开了一种用于半导体传感器配置的壳体，其中传感器和评估逻辑集成在半导体本体中。 壳体具有基体，半导体本体被施加到基体上，并且在基体内包围半导体本体。 盖子直接设置在外壳的基体上并且包含膜和/或迷宫。

公开(公告)号：US6020627A

公开(公告)日：2000-02-01

申请号：US152829

申请日：1998-09-14

申请人： Manfred Fries ,  Thies Janczek

发明人： Manfred Fries ,  Thies Janczek

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L23/02

CPC分类号： G06K19/0775 ,  G06K19/07743 ,  G06K19/07749 ,  H01L2924/0002

摘要： A chip card for the contactless transmission of electric signals to a terminal includes a card body in which a coupling element having conductor tracks and contact connections, and a semiconductor chip having an electronic circuit associated with the coupling element, are constructed in an integrated manner. The semiconductor chip is provided on its surface with contact elements for electrical connection of the electronic circuit and the contact connections of the coupling element. A carrier made of an electrically insulating material supports at least part of the conductor tracks and the contact connections of the coupling element. The carrier is provided with an aperture in the vicinity of the contact connections of the coupling element, for receiving the semiconductor chip.

摘要翻译： 用于将电信号非接触式传输到终端的芯片卡包括卡体，其中具有导体轨道和接触连接的耦合元件以及具有与耦合元件相关联的电子电路的半导体芯片以集成的方式构造。 半导体芯片在其表面上设置有用于电子电路的电连接和耦合元件的接触连接的接触元件。 由电绝缘材料制成的载体支撑导体轨迹的至少一部分和耦合元件的接触连接。 载体在耦合元件的接触连接附近设置有用于接收半导体芯片的孔。

公开(公告)号：US07516900B2

公开(公告)日：2009-04-14

申请号：US11585102

申请日：2006-10-24

申请人： Thies Janczek

发明人： Thies Janczek

IPC分类号： G06K19/00

CPC分类号： G06K19/08

摘要： A data carrier including a flat carrier element having at least one memory segment configured to store user-specific information and at least one inscription segment configured to store visually readable information. Further, the carrier element further includes a multi-information segment having a plurality of information layers arranged one on top of another, and at least two information layers are writable and/or printable and at least one top information layer is made separable from a neighboring lower information layer.

摘要翻译： 一种数据载体，包括具有被配置为存储用户特定信息的至少一个存储器段的平坦载体元件和被配置为存储视觉可读信息的至少一个铭文段。 此外，载波元件还包括具有多个信息层的多信息段，其中多个信息层一个在另一个顶部上排列，并且至少两个信息层是可写的和/或可打印的，并且至少一个顶层信息层可以与相邻的 信息层较低。

公开(公告)号：US06364205B1

公开(公告)日：2002-04-02

申请号：US09292267

申请日：1999-04-15

申请人： Thies Janczek ,  Peter Stampka

发明人： Thies Janczek ,  Peter Stampka

IPC分类号： C06K500

CPC分类号： G06K19/07743 ,  Y10T428/31504

摘要： A chip card has a contact zone on which an electrically conductive lacquer applied. The electrically conductive lacquer is based on an intrinsically conductive plastic material. Pigments are added to the electrically conductive lacquer. In an alternative embodiment an electrically nonconductive lacquer is applied to the contact zone. Conductive particles are disposed in the electrically nonconductive lacquer. The electrically conductive lacquer forms a covering for the conductive particles. A method of lacquering a contact zone and a method of producing a chip card are also provided.

摘要翻译： 芯片卡具有接触区，在其上施加导电漆。 导电漆基于本体导电塑料材料。 将颜料加入到导电漆中。 在替代实施例中，将非导电漆施加到接触区。 导电颗粒设置在非导电漆中。 导电漆形成用于导电颗粒的覆盖物。 还提供了一种涂覆接触区域的方法和一种制造芯片卡片的方法。

公开(公告)号：US20070125865A1

公开(公告)日：2007-06-07

申请号：US11585102

申请日：2006-10-24

申请人： Thies Janczek

发明人： Thies Janczek

IPC分类号： G06K19/00 ,  G06K19/06

CPC分类号： G06K19/08

摘要： A data carrier including a flat carrier element having at least one memory segment configured to store user-specific information and at least one inscription segment configured to store visually readable information. Further, the carrier element further includes a multi-information segment having a plurality of information layers arranged one on top of another, and at least two information layers are writable and/or printable and at least one top information layer is made separable from a neighboring lower information layer.

摘要翻译： 一种数据载体，包括具有被配置为存储用户特定信息的至少一个存储器段的平坦载体元件和被配置为存储视觉可读信息的至少一个铭文段。 此外，载波元件还包括具有多个信息层的多信息段，其中多个信息层一个在另一个顶部上排列，并且至少两个信息层是可写的和/或可打印的，并且至少一个顶层信息层可以与相邻的 信息层较低。