公开(公告)号：US20240321702A1

公开(公告)日：2024-09-26

申请号：US18474166

申请日：2023-09-25

申请人： Advanced Micro Devices, Inc. ,  Xilinx, Inc.

发明人： Yan Wang ,  Kevin Gillespie ,  Samuel Naffziger ,  Richard Schultz ,  Raja Swaminathan ,  Omar Zia ,  John Wuu

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/367 ,  H01L25/065

CPC分类号： H01L23/49822 ,  H01L23/3675 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/32 ,  H01L25/0652 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/32146 ,  H01L2224/32165 ,  H01L2924/1431 ,  H01L2924/1437 ,  H01L2924/351

摘要： A method for providing backside power can include providing a first circuit die having a first metal stack. The method can also include connecting a second metal stack of a second circuit die to the first metal stack of the first circuit die, wherein a backside power delivery network is located in a passivation layer of at least one of the first circuit die or the second circuit die. Various other methods, systems, and computer-readable media are also disclosed.

公开(公告)号：US20240321827A1

公开(公告)日：2024-09-26

申请号：US18474158

申请日：2023-09-25

申请人： Advanced Micro Devices, Inc. ,  Xilinx, Inc.

发明人： Omar Zia ,  Thomas D Burd ,  Kevin Gillespie ,  Samuel Naffziger ,  Richard Schultz ,  Raja Swaminathan ,  Srividhya Venkataraman ,  Yan Wang ,  John Wuu

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/36 ,  H01L23/48 ,  H10B80/00

CPC分类号： H01L25/0657 ,  H01L23/36 ,  H01L23/481 ,  H01L24/08 ,  H01L24/16 ,  H01L24/80 ,  H10B80/00 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/80895 ,  H01L2224/80896

摘要： A method for circuit die stacking can include providing a first circuit die having a first metal stack, wherein the first circuit die corresponds to a primary thermal source of an integrated circuit including the first circuit die. The method can additionally include providing a second circuit die of the integrated circuit, wherein the second circuit die has a second metal stack and is configured for connection to at least one of a package substrate or an additional die. The method can also include connecting the first metal stack to the second metal stack. Various other methods, systems, and computer-readable media are also disclosed.

公开(公告)号：US20240321706A1

公开(公告)日：2024-09-26

申请号：US18474151

申请日：2023-09-25

申请人： Advanced Micro Devices, Inc.

发明人： William George En ,  Samuel Naffziger ,  Regina T. Schmidt ,  Omar Zia ,  John Wuu

IPC分类号： H01L23/498 ,  H01L23/48 ,  H01L25/065

CPC分类号： H01L23/49827 ,  H01L23/481 ,  H01L23/49816 ,  H01L25/0657 ,  H01L2225/06541

摘要： A method for implementing shared metal connectivity between 3D stacked circuit dies can include providing a first circuit die having a first metal stack. The method can additionally include providing a second circuit die having a second metal stack, wherein at least one metal layer of the second metal stack is utilized by both the first circuit die and the second circuit die. The method can also include connecting the second metal stack to the first metal stack of the first circuit die. Various other methods, systems, and computer-readable media are also disclosed.

公开(公告)号：US20240324248A1

公开(公告)日：2024-09-26

申请号：US18474179

申请日：2023-09-25

申请人： Advanced Micro Devices, Inc. ,  ATI Technologies ULC

发明人： John Wuu ,  Kevin Gillespie ,  Samuel Naffziger ,  Spence Oliver ,  Rajit Seahra ,  Regina T. Schmidt ,  Raja Swaminathan ,  Omar Zia

IPC分类号： H10B80/00 ,  H01L23/544 ,  H01L25/00 ,  H01L25/18

CPC分类号： H10B80/00 ,  H01L23/544 ,  H01L25/18 ,  H01L25/50 ,  H01L23/481 ,  H01L23/5286 ,  H01L24/06 ,  H01L24/08 ,  H01L2223/54433 ,  H01L2224/06181 ,  H01L2224/08145

摘要： A method for die pair partitioning can include providing a circuit die. The method can additionally include providing one or more additional circuit die having one or more fuses positioned therein, wherein the one or more fuses identify the circuit die. The method can also include connecting the one or more additional circuit die to the circuit die. Various other methods, systems, and computer-readable media are also disclosed.