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公开(公告)号：US20110151200A1
公开(公告)日：2011-06-23
申请号：US12642501
申请日：2009-12-18
CPC分类号： H05B33/04
摘要： The present techniques provide systems and methods for protecting electronic devices, such as organic light emitting devices (OLEDs) from adverse environmental effects. The edges of the devices may also be protected by a edge protection coating to reduce the adverse affects of a lateral ingress of adverse environmental conditions. In some embodiments, inorganic materials, or a combination of inorganic and organic materials, are deposited over the device to form a edge protection coating which extends approximately 3 millimeter or less beyond the edges of the device. In other embodiments, the device may be encapsulated with an organic region, and with an inorganic region, or the device may be encapsulated with inorganic materials, which may form the edge protection coating and may be combined with ultra high barrier technology. The coatings formed over the device may extend beyond the edges of the device to ensure lateral protection.
摘要翻译： 本技术提供了用于保护诸如有机发光器件（OLED）的电子器件免受不利环境影响的系统和方法。 设备的边缘也可以被边缘保护涂层保护，以减少不利环境条件的侧向侵入的不利影响。 在一些实施例中，将无机材料或无机材料和有机材料的组合沉积在器件上以形成延伸约3毫米或更少超过器件边缘的边缘保护涂层。 在其它实施方案中，该装置可以用有机区域和无机区域包封，或者该装置可以用无机材料包封，其可以形成边缘保护涂层并且可以与超高阻隔技术组合。 在装置上形成的涂层可以延伸超过装置的边缘以确保侧向保护。
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公开(公告)号：US09472783B2
公开(公告)日：2016-10-18
申请号：US12577629
申请日：2009-10-12
CPC分类号： H01L51/5256 , B05D1/60 , H01L2251/5346 , H01L2251/558
摘要： The present techniques provide systems and methods for protecting electronic devices such as organic light emitting devices (OLEDs) from adverse environmental effects using a thin film encapsulation with reduced process time. In some embodiments, the process time of forming a graded barrier over the OLED structure may take less than 5 minutes, and may result in substantially similar barrier properties as those of metal and epoxy sealants and/or typical thin film encapsulations. The process time of forming the barrier may be reduced by increasing deposition rates for organic and/or inorganic materials, reducing the thicknesses of organic and/or inorganic layers, and/or varying the number of zones in the barrier.
摘要翻译： 本技术提供了用减少处理时间的薄膜封装来保护诸如有机发光器件（OLED）的电子器件免受不利环境影响的系统和方法。 在一些实施方案中，在OLED结构上形成梯度屏障的处理时间可能需要少于5分钟，并且可能导致与金属和环氧树脂密封剂和/或典型的薄膜封装相似的阻挡性能。 通过增加有机和/或无机材料的沉积速率，降低有机和/或无机层的厚度和/或改变阻挡层中的区域数量，可以减少形成阻挡层的工艺时间。
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3.发明授权公开(公告)号：US08033885B2
公开(公告)日：2011-10-11
申请号：US12242399
申请日：2008-09-30
申请人： Ahmet Gun Erlat , George Theodore Dalakos , Min Yan , Shelia Neumann Tandon , Brian Joseph Scherer
发明人： Ahmet Gun Erlat , George Theodore Dalakos , Min Yan , Shelia Neumann Tandon , Brian Joseph Scherer
IPC分类号： H05B33/04
CPC分类号： C23C16/0245 , B05D1/62 , C23C16/029 , H01L51/5253 , H01L2251/5346 , Y10T428/24612
摘要： In a method for depositing a barrier coating, a device is provided comprising a first portion and a second portion where a surface of the second portion is in a shadow zone. The device is pretreated wherein the pretreating alters a deposition rate of the barrier coating on a surface exposed to the pretreating. The shadow zone is substantially unexposed to the pretreating. A barrier coating is deposited wherein the barrier coating substantially conforms to a profile of the device. The coating may be a graded-composition barrier coating wherein a composition of the coating varies substantially continuously across a thickness thereof. The first portion may include a flexible, substantially transparent substrate. The second portion may include an electronic device. The barrier coating and first portion may encapsulate the second portion. The method is a single, commercially advantageous, barrier deposition process, enabling increased product throughput and low process tact time.
摘要翻译： 在用于沉积阻挡涂层的方法中，提供了包括第一部分和第二部分的装置，其中第二部分的表面处于阴影区域。 该装置被预处理，其中预处理改变了暴露于预处理的表面上的阻挡涂层的沉积速率。 阴影区域基本上未被暴露于预处理。 沉积阻挡涂层，其中阻挡涂层基本上符合设备的轮廓。 涂层可以是梯度组合物阻挡涂层，其中涂层的组合物在其厚度上基本连续地变化。 第一部分可以包括柔性的，基本上透明的基底。 第二部分可以包括电子设备。 阻挡涂层和第一部分可以封装第二部分。 该方法是单一的，商业上有利的阻隔沉积工艺，能够提高产品生产量和低工艺节拍时间。
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公开(公告)号：US08753711B2
公开(公告)日：2014-06-17
申请号：US12642501
申请日：2009-12-18
IPC分类号： B05D5/12
CPC分类号： H05B33/04
摘要： The present techniques provide systems and methods for protecting electronic devices, such as organic light emitting devices (OLEDs) from adverse environmental effects. The edges of the devices may also be protected by a edge protection coating to reduce the adverse affects of a lateral ingress of adverse environmental conditions. In some embodiments, inorganic materials, or a combination of inorganic and organic materials, are deposited over the device to form a edge protection coating which extends approximately 3 millimeter or less beyond the edges of the device. In other embodiments, the device may be encapsulated with an organic region, and with an inorganic region, or the device may be encapsulated with inorganic materials, which may form the edge protection coating and may be combined with ultra high barrier technology. The coatings formed over the device may extend beyond the edges of the device to ensure lateral protection.
摘要翻译： 本技术提供了用于保护诸如有机发光器件（OLED）的电子器件免受不利环境影响的系统和方法。 设备的边缘也可以被边缘保护涂层保护，以减少不利环境条件的侧向侵入的不利影响。 在一些实施例中，将无机材料或无机材料和有机材料的组合沉积在器件上以形成延伸约3毫米或更少超过器件边缘的边缘保护涂层。 在其它实施方案中，该装置可以用有机区域和无机区域包封，或者该装置可以用无机材料包封，其可以形成边缘保护涂层并且可以与超高阻隔技术组合。 在装置上形成的涂层可以延伸超过装置的边缘以确保侧向保护。
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公开(公告)号：US20110086183A1
公开(公告)日：2011-04-14
申请号：US12577629
申请日：2009-10-12
CPC分类号： H01L51/5256 , B05D1/60 , H01L2251/5346 , H01L2251/558
摘要： The present techniques provide systems and methods for protecting electronic devices such as organic light emitting devices (OLEDs) from adverse environmental effects using a thin film encapsulation with reduced process time. In some embodiments, the process time of forming a graded barrier over the OLED structure may take less than 5 minutes, and may result in substantially similar barrier properties as those of metal and epoxy sealants and/or typical thin film encapsulations. The process time of forming the barrier may be reduced by increasing deposition rates for organic and/or inorganic materials, reducing the thicknesses of organic and/or inorganic layers, and/or varying the number of zones in the barrier.
摘要翻译： 本技术提供了用减少处理时间的薄膜封装来保护诸如有机发光器件（OLED）的电子器件免受不利环境影响的系统和方法。 在一些实施方案中，在OLED结构上形成梯度屏障的处理时间可能需要少于5分钟，并且可能导致与金属和环氧树脂密封剂和/或典型的薄膜封装相似的阻挡性能。 通过增加有机和/或无机材料的沉积速率，降低有机和/或无机层的厚度和/或改变阻挡层中的区域数量，可以减少形成阻挡层的工艺时间。
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公开(公告)号：US20110008525A1
公开(公告)日：2011-01-13
申请号：US12501308
申请日：2009-07-10
CPC分类号： B05D1/62 , B05D3/0254 , B05D3/067
摘要： Present embodiments are directed to a system and method for condensing and curing organic materials within a deposition chamber. Present embodiments may include condensing an organic component from a gas phase into a liquid phase on a target surface within the deposition chamber, wherein the gas phase of the organic component might be mixed with an inert gas. Further, present embodiments may include solidifying the liquid phase of the organic component into a solid phase within the deposition chamber using an inert plasma formed from the inert gas.
摘要翻译： 本实施例涉及用于在沉积室内冷凝和固化有机材料的系统和方法。 本实施方案可以包括将有机组分从气相中冷凝到沉积室内的目标表面上的液相，其中有机组分的气相可能与惰性气体混合。 此外，本实施例可以包括使用由惰性气体形成的惰性等离子体将有机组分的液相固化成沉积室内的固相。
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公开(公告)号：US08318265B2
公开(公告)日：2012-11-27
申请号：US12137816
申请日：2008-06-12
申请人： Brian Joseph Scherer , Ahmet Gun Erlat , Min Yan
发明人： Brian Joseph Scherer , Ahmet Gun Erlat , Min Yan
IPC分类号： H05H1/24
CPC分类号： C23C16/4404 , C23C16/5096
摘要： Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.
摘要翻译： 用于改善等离子体介导工艺中的非导电衬底的涂层或蚀刻均匀性的方法通常包括在等离子体处理之前将导电涂层施加到非导电衬底。 导电涂层设置成与等离子体反应器的金属电极电连通。 通过在非导电性基板上设置导电层，可以在等离子体处理时产生均匀的电位，而不导电等价于在等离子体处理期间设置的金属电极。
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公开(公告)号：US20090311444A1
公开(公告)日：2009-12-17
申请号：US12137816
申请日：2008-06-12
申请人： Brian Joseph Scherer , Ahmet Gun Erlat , Min Yan
发明人： Brian Joseph Scherer , Ahmet Gun Erlat , Min Yan
CPC分类号： C23C16/4404 , C23C16/5096
摘要： Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.
摘要翻译： 用于改善等离子体介导工艺中的非导电衬底的涂层或蚀刻均匀性的方法通常包括在等离子体处理之前将导电涂层施加到非导电衬底。 导电涂层设置成与等离子体反应器的金属电极电连通。 通过在非导电性基板上设置导电层，可以在等离子体处理时产生均匀的电位，而不导电等价于在等离子体处理期间设置的金属电极。
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公开(公告)号：US08034419B2
公开(公告)日：2011-10-11
申请号：US12325827
申请日：2008-12-01
申请人： Ahmet Gun Erlat , Anil Duggal , Min Yan , Sheila Tandon , Brian Joseph Scherer
发明人： Ahmet Gun Erlat , Anil Duggal , Min Yan , Sheila Tandon , Brian Joseph Scherer
IPC分类号： H05H1/24
CPC分类号： H01L21/76832 , C23C16/30 , C23C16/45523 , C23C16/50 , H01L51/5253 , H01L51/5256 , H01L2251/5346 , H01L2251/558
摘要： Disclosed is a method relating to graded-composition barrier coatings comprising first and second materials in first and second zones. The compositions of one or both zones vary substantially continuously across a thickness of the zone in order to achieve improved properties such as barrier, flexibility, adhesion, optics, thickness, and tact time. The graded-composition barrier coatings find utility in preventing exposure of devices such as organic electro-luminescent devices (OLEDs) to reactive species found in the environment.
摘要翻译： 公开了一种涉及在第一和第二区域中包含第一和第二材料的梯度组成阻挡涂层的方法。 一个或两个区域的组合物在区域的厚度上基本上连续地变化，以便实现改进的性能，例如屏障，柔性，粘合性，光学，厚度和节拍时间。 分级组合物阻隔涂层可用于防止诸如有机电致发光器件（OLED）等器件暴露于在环境中发现的反应性物质。
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公开(公告)号：US20090297813A1
公开(公告)日：2009-12-03
申请号：US12325827
申请日：2008-12-01
申请人： Ahmet Gun Erlat , Anil Duggal , Min Yan , Sheila Tandon , Brian Joseph Scherer
发明人： Ahmet Gun Erlat , Anil Duggal , Min Yan , Sheila Tandon , Brian Joseph Scherer
CPC分类号： H01L21/76832 , C23C16/30 , C23C16/45523 , C23C16/50 , H01L51/5253 , H01L51/5256 , H01L2251/5346 , H01L2251/558
摘要： Methods and apparatus are disclosed relating to graded-composition barrier coatings comprising first and second materials in first and second zones. The compositions of one or both zones vary substantially continuously across a thickness of the zone in order to achieve improved properties such as barrier, flexibility, adhesion, optics, thickness and tact time. The graded-composition barrier coatings find utility in preventing exposure of devices such as organic electro-luminescent devices (OLEDs) to reactive species found in the environment.
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