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    System and method for applying a conformal barrier coating with pretreating
    1.
    发明授权
    System and method for applying a conformal barrier coating with pretreating 有权
    用预应力施加保形屏障涂层的系统和方法

    公开(公告)号：US08033885B2

    公开(公告)日：2011-10-11

    申请号：US12242399

    申请日：2008-09-30

    申请人： Ahmet Gun Erlat ,  George Theodore Dalakos ,  Min Yan ,  Shelia Neumann Tandon ,  Brian Joseph Scherer

    发明人： Ahmet Gun Erlat ,  George Theodore Dalakos ,  Min Yan ,  Shelia Neumann Tandon ,  Brian Joseph Scherer

    IPC分类号： H05B33/04

    CPC分类号： C23C16/0245 ,  B05D1/62 ,  C23C16/029 ,  H01L51/5253 ,  H01L2251/5346 ,  Y10T428/24612

    摘要： In a method for depositing a barrier coating, a device is provided comprising a first portion and a second portion where a surface of the second portion is in a shadow zone. The device is pretreated wherein the pretreating alters a deposition rate of the barrier coating on a surface exposed to the pretreating. The shadow zone is substantially unexposed to the pretreating. A barrier coating is deposited wherein the barrier coating substantially conforms to a profile of the device. The coating may be a graded-composition barrier coating wherein a composition of the coating varies substantially continuously across a thickness thereof. The first portion may include a flexible, substantially transparent substrate. The second portion may include an electronic device. The barrier coating and first portion may encapsulate the second portion. The method is a single, commercially advantageous, barrier deposition process, enabling increased product throughput and low process tact time.

    摘要翻译： 在用于沉积阻挡涂层的方法中，提供了包括第一部分和第二部分的装置，其中第二部分的表面处于阴影区域。 该装置被预处理，其中预处理改变了暴露于预处理的表面上的阻挡涂层的沉积速率。 阴影区域基本上未被暴露于预处理。 沉积阻挡涂层，其中阻挡涂层基本上符合设备的轮廓。 涂层可以是梯度组合物阻挡涂层，其中涂层的组合物在其厚度上基本连续地变化。 第一部分可以包括柔性的，基本上透明的基底。 第二部分可以包括电子设备。 阻挡涂层和第一部分可以封装第二部分。 该方法是单一的，商业上有利的阻隔沉积工艺，能够提高产品生产量和低工艺节拍时间。

    SYSTEM AND METHOD FOR APPLYING A CONFORMAL BARRIER COATING
    2.
    发明申请
    SYSTEM AND METHOD FOR APPLYING A CONFORMAL BARRIER COATING 审中-公开
    用于施加一致性障碍物涂层的系统和方法

    公开(公告)号：US20100080929A1

    公开(公告)日：2010-04-01

    申请号：US12242443

    申请日：2008-09-30

    申请人： Ahmet Gun ERLAT ,  George Theodore Dalakos ,  Min Yan ,  Sheila Neumann Tandon ,  Brian Joseph Scherer

    发明人： Ahmet Gun ERLAT ,  George Theodore Dalakos ,  Min Yan ,  Sheila Neumann Tandon ,  Brian Joseph Scherer

    IPC分类号： C23C14/34 ,  C23C16/04 ,  C23C16/513

    CPC分类号： C23C16/029 ,  C23C16/50

    摘要： An improvement of a baseline method for depositing a coating on a device having a surface where the surface includes a first portion and a second portion, where the second portion is in a shadow zone, and where the coating is deposited using a first predetermined set of process parameters having a first ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion. In the improved method, the coating is deposited using a second predetermined set of process parameters such that the coating substantially conforms to a profile of the device and a second ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion is greater than the first ratio. The method is a single, commercially advantageous deposition process, enabling increased product throughput and low process tact time.

    摘要翻译： 一种用于在具有表面的装置上沉积涂层的基线方法的改进，其中所述表面包括第一部分和第二部分，其中第二部分处于阴影区域，并且其中涂层使用第一预定组 工艺参数具有第二部分上的涂层的厚度与第一部分上的涂层的厚度的第一比率。 在改进的方法中，使用第二预定的一组工艺参数沉积涂层，使得涂层基本上符合装置的轮廓，并且第二部分上的涂层的厚度与涂层的厚度的第二比率 第一部分大于第一比例。 该方法是单一的，商业上有利的沉积工艺，能够提高产品产量和低的工艺节拍时间。

    Plasma mediated processing of non-conductive substrates
    3.
    发明授权
    Plasma mediated processing of non-conductive substrates 有权
    非导电基板的等离子介导处理

    公开(公告)号：US08318265B2

    公开(公告)日：2012-11-27

    申请号：US12137816

    申请日：2008-06-12

    申请人： Brian Joseph Scherer ,  Ahmet Gun Erlat ,  Min Yan

    发明人： Brian Joseph Scherer ,  Ahmet Gun Erlat ,  Min Yan

    IPC分类号： H05H1/24

    CPC分类号： C23C16/4404 ,  C23C16/5096

    摘要： Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.

    摘要翻译： 用于改善等离子体介导工艺中的非导电衬底的涂层或蚀刻均匀性的方法通常包括在等离子体处理之前将导电涂层施加到非导电衬底。 导电涂层设置成与等离子体反应器的金属电极电连通。 通过在非导电性基板上设置导电层，可以在等离子体处理时产生均匀的电位，而不导电等价于在等离子体处理期间设置的金属电极。

    PLASMA MEDIATED PROCESSING OF NON-CONDUCTIVE SUBSTRATES
    4.
    发明申请
    PLASMA MEDIATED PROCESSING OF NON-CONDUCTIVE SUBSTRATES 有权
    非导电基板的等离子体介质处理

    公开(公告)号：US20090311444A1

    公开(公告)日：2009-12-17

    申请号：US12137816

    申请日：2008-06-12

    申请人： Brian Joseph Scherer ,  Ahmet Gun Erlat ,  Min Yan

    发明人： Brian Joseph Scherer ,  Ahmet Gun Erlat ,  Min Yan

    IPC分类号： C23C16/06 ,  C23C16/26 ,  H01B13/00

    CPC分类号： C23C16/4404 ,  C23C16/5096

    摘要： Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.

    摘要翻译： 用于改善等离子体介导工艺中的非导电衬底的涂层或蚀刻均匀性的方法通常包括在等离子体处理之前将导电涂层施加到非导电衬底。 导电涂层设置成与等离子体反应器的金属电极电连通。 通过在非导电性基板上设置导电层，可以在等离子体处理时产生均匀的电位，而不导电等价于在等离子体处理期间设置的金属电极。

    Method for making a graded barrier coating
    6.
    发明授权
    Method for making a graded barrier coating 有权
    制造分级屏障涂层的方法

    公开(公告)号：US08034419B2

    公开(公告)日：2011-10-11

    申请号：US12325827

    申请日：2008-12-01

    申请人： Ahmet Gun Erlat ,  Anil Duggal ,  Min Yan ,  Sheila Tandon ,  Brian Joseph Scherer

    发明人： Ahmet Gun Erlat ,  Anil Duggal ,  Min Yan ,  Sheila Tandon ,  Brian Joseph Scherer

    IPC分类号： H05H1/24

    CPC分类号： H01L21/76832 ,  C23C16/30 ,  C23C16/45523 ,  C23C16/50 ,  H01L51/5253 ,  H01L51/5256 ,  H01L2251/5346 ,  H01L2251/558

    摘要： Disclosed is a method relating to graded-composition barrier coatings comprising first and second materials in first and second zones. The compositions of one or both zones vary substantially continuously across a thickness of the zone in order to achieve improved properties such as barrier, flexibility, adhesion, optics, thickness, and tact time. The graded-composition barrier coatings find utility in preventing exposure of devices such as organic electro-luminescent devices (OLEDs) to reactive species found in the environment.

    摘要翻译： 公开了一种涉及在第一和第二区域中包含第一和第二材料的梯度组成阻挡涂层的方法。 一个或两个区域的组合物在区域的厚度上基本上连续地变化，以便实现改进的性能，例如屏障，柔性，粘合性，光学，厚度和节拍时间。 分级组合物阻隔涂层可用于防止诸如有机电致发光器件（OLED）等器件暴露于在环境中发现的反应性物质。

    High throughput processes and systems for barrier film deposition and/or encapsulation of optoelectronic devices
    10.
    发明授权
    High throughput processes and systems for barrier film deposition and/or encapsulation of optoelectronic devices 有权
    用于光电子器件阻挡膜沉积和/或封装的高通量过程和系统

    公开(公告)号：US07976908B2

    公开(公告)日：2011-07-12

    申请号：US12122326

    申请日：2008-05-16

    申请人： Ahmet Gun Erlat ,  Anil Raj Duggal ,  Min Yan

    发明人： Ahmet Gun Erlat ,  Anil Raj Duggal ,  Min Yan

    IPC分类号： C23C16/513 ,  B05D5/12

    CPC分类号： C23C16/5096 ,  B05D1/62 ,  B05D2258/00 ,  H05H1/2406 ,  H05H2001/2412 ,  H05H2001/2437

    摘要： Processes for simultaneously encapsulating multiple optoelectronic devices and/or depositing a barrier film onto multiple substrates suitable for fabrication of optoelectronic devices thereon include the use of a plasma deposition apparatus having multiple pairs of opposing electrodes for deposition of reactants onto the substrate that is used to form the device or the complete device itself. The processes significantly reduce tact time relative to one at a time batch processing that is currently used for manufacturing optoelectronic devices.

    摘要翻译： 用于同时封装多个光电子器件和/或将阻挡膜沉积在适于制造其上的光电子器件的多个衬底上的工艺包括使用具有多对相对电极的等离子体沉积设备，用于将反应物沉积到衬底上用于形成 设备或整个设备本身。 这些过程相对于当前用于制造光电子器件的批次处理中的一个显着减少了生产时间。