Micromechanical device and method of manufacturing micromechanical device
    10.
    发明授权
    Micromechanical device and method of manufacturing micromechanical device 有权
    微机械装置及其制造方法

    公开(公告)号:US07972884B2

    公开(公告)日:2011-07-05

    申请号:US12399348

    申请日:2009-03-06

    IPC分类号: H01L21/00

    摘要: An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.

    摘要翻译: 本发明的一个实例是一种微机械装置,其特征在于,包括:设置有信号线的基板,安装在基板上的微机械,由导电材料形成为梁状,通过功能弹性变形 电场的方式使得束状部分靠近信号线或离开信号线移动,并且随着变形而改变电特性,变形抑制部分由具有比导电性更高的粘度系数的材料构成 材料,其设置在所述微机械相对于所述信号线的相反侧,用于限制所述微机械从所述微机械与所述信号线分离的方向上的变形;以及设置在所述基板主表面上的密封体, 具有位于其间的中空部分的微机械。