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公开(公告)号:US20130063957A1
公开(公告)日:2013-03-14
申请号:US13601217
申请日:2012-08-31
申请人: Makoto SAKAI , Takumi Suwa , Shinji Nakata , Daigo Suzuki , Izuru Komatsu , Michinobu Inoue , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
发明人: Makoto SAKAI , Takumi Suwa , Shinji Nakata , Daigo Suzuki , Izuru Komatsu , Michinobu Inoue , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
CPC分类号: F21V3/00 , F21K9/232 , F21K9/60 , F21V29/713 , F21V29/74 , F21Y2115/10 , Y10T29/49002
摘要: A lighting device according to an embodiment includes a main body unit, a light source which is provided at one end portion of the main body unit, and includes a light emitting element, a globe which is provided so as to cover the light source, and a heat conducting unit whose end surface on the globe side is exposed on the outside of the globe, and which thermally bonds the globe and a heat radiating surface of the main body unit on the end portion side. The heat conducting unit includes a plate-shaped unit in which a first plate-shaped body, and a second plate-shaped body which crosses the first plate-shaped body are integrally formed.
摘要翻译: 根据实施例的照明装置包括主体单元,设置在主体单元的一个端部处的光源,并且包括发光元件,设置成覆盖光源的球面,以及 导体单元,其在球面侧的端面暴露在球体的外侧,并且在端部侧热接合球体和主体单元的散热面。 导热单元包括板状单元,其中第一板状体和与第一板状体交叉的第二板状体一体形成。
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公开(公告)号:US08618723B2
公开(公告)日:2013-12-31
申请号:US13602055
申请日:2012-08-31
申请人: Makoto Sakai , Takumi Suwa , Shinji Nakata , Michinobu Inoue , Izuru Komatsu , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
发明人: Makoto Sakai , Takumi Suwa , Shinji Nakata , Michinobu Inoue , Izuru Komatsu , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
IPC分类号: H01J1/02
CPC分类号: F21V29/004 , F21K9/135 , F21K9/232 , F21K9/60 , F21V29/503 , F21V29/506 , F21Y2115/10
摘要: A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.
摘要翻译: 根据实施例的照明装置包括主体部分,设置在主体部分的一个端部处并具有发光元件的光源,设置成覆盖光源的灯罩,以及热接合到 至少球体中的任一个或主体部分的端部侧的热辐射表面。 然后,在球体侧的热转印部分的端面从球体露出。
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公开(公告)号:US20130063942A1
公开(公告)日:2013-03-14
申请号:US13602055
申请日:2012-08-31
申请人: Makoto SAKAI , Takumi Suwa , Shinji Nakata , Michinobu Inoue , Izuru Komatsu , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
发明人: Makoto SAKAI , Takumi Suwa , Shinji Nakata , Michinobu Inoue , Izuru Komatsu , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama , Yasuhide Okada
CPC分类号: F21V29/004 , F21K9/135 , F21K9/232 , F21K9/60 , F21V29/503 , F21V29/506 , F21Y2115/10
摘要: A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.
摘要翻译: 根据实施例的照明装置包括主体部分,设置在主体部分的一个端部处并具有发光元件的光源,设置成覆盖光源的灯罩,以及热接合到 至少球体中的任一个或主体部分的端部侧的热辐射表面。 然后,在球体侧的热转印部分的端面从球体露出。
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公开(公告)号:US20120212959A1
公开(公告)日:2012-08-23
申请号:US13397036
申请日:2012-02-15
申请人: Michinobu INOUE , Izuru Komatsu , Yasuhide Okada , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama
发明人: Michinobu INOUE , Izuru Komatsu , Yasuhide Okada , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama
CPC分类号: F21V3/00 , F21K9/232 , F21K9/64 , F21V3/061 , F21V3/062 , F21V29/87 , F21V29/89 , F21Y2105/10 , F21Y2115/10
摘要: According to one embodiment, a lighting device includes a body section, a light source, a globe, and a heat transfer section. The light source is provided on one end portion of the body section. The light source includes a light emitting element. The globe is provided so as to cover the light source. The heat transfer section in thermal contacts with at least one of an inner surface of the globe and a heat dissipation surface on the end portion side of the body section.
摘要翻译: 根据一个实施例,照明装置包括主体部分,光源,球体和传热部分。 光源设置在主体部分的一个端部上。 光源包括发光元件。 提供球体以覆盖光源。 与球体的内表面中的至少一个热敏接触的传热部和主体部的端部侧的散热面。
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公开(公告)号:US08956017B2
公开(公告)日:2015-02-17
申请号:US13405668
申请日:2012-02-27
申请人: Kumiko Ioka , Michinobu Inoue , Hideo Nishiuchi , Kazuki Tateyama , Koki Moriya
发明人: Kumiko Ioka , Michinobu Inoue , Hideo Nishiuchi , Kazuki Tateyama , Koki Moriya
CPC分类号: F21K9/1355 , F21K9/23 , F21V23/02 , F21V29/75 , F21V29/76 , F21Y2115/10
摘要: A lighting apparatus includes a case, a power source unit, and a light emitting unit. The case has a side portion provided around a first axis parallel to a direction from the power source unit toward the light emitting unit. The side portion has a first portion and a second portion disposed around a central axis parallel to the first axis. The first portion has a long distance to the central axis. The second portion has a short distance to the central axis. An end portion of an inner surface of the second portion is configured to have at least one selected from a portion perpendicular to the central axis and a portion has a recessed configuration with respect to the central axis when the inner surface is cut by a cross-section perpendicular to the central axis.
摘要翻译: 照明装置包括壳体,电源单元和发光单元。 壳体具有围绕平行于从电源单元朝向发光单元的方向的第一轴线设置的侧部。 侧部具有围绕平行于第一轴线的中心轴线设置的第一部分和第二部分。 第一部分与中心轴的距离很长。 第二部分与中心轴的距离很短。 第二部分的内表面的端部构造成具有从垂直于中心轴线的部分中选择的至少一个部分,并且当内表面被切断时,部分具有相对于中心轴线的凹陷构造, 垂直于中心轴的截面。
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公开(公告)号:US07278199B2
公开(公告)日:2007-10-09
申请号:US11344118
申请日:2006-02-01
申请人: Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
发明人: Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Akihiro Hara
IPC分类号: H01S4/00
CPC分类号: H01L35/06 , H01L35/30 , H01L35/32 , H01L35/34 , H05K1/0204 , H05K2201/10219 , Y10T29/49002 , Y10T29/4913 , Y10T29/49144
摘要: In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.
摘要翻译: 为了提供高度可靠的热电装置,在热电装置中,按照各个热电元件的位置排列的多个散热侧电极排列成阵列方式在平面的 散热侧板。 多个p型热电元件和n型热电元件和散热侧电极的散热侧端面通过焊料接合在一起。 吸热侧电极与这些热电元件的吸热侧端面滑动接触。
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公开(公告)号:US20060118159A1
公开(公告)日:2006-06-08
申请号:US11256158
申请日:2005-10-24
IPC分类号: H01L35/28
摘要: A thermoelectric direct conversion device is foemed of a plurality of thermoelectric direct conversion semiconductor pairs each including a p-type semiconductor and an n-type semiconductor; a plurality of high-temperature electrodes and a plurality of low-temperature electrodes each electrically connecting the p-type semiconductor and the n-type semiconductor; a high-temperature insulating plate and a low-temperature insulating plate each thermally connected to the plurality of thermoelectric direct conversion semiconductor pairs via the plurality of high-temperature electrodes and the plurality of low-temperature electrodes, respectively; at least one diffusion barrier layer is disposed between the high- or low-temperature electrodes and the thermoelectric direct conversion semiconductor pairs, and the entire device is hermetically sealed up within an airtight case containing a vacuum or inert gas atmosphere, whereby diffusion between the electrodes and the semiconductor pairs is prevented to provide a thermoelectric conversion devise exhibiting excellent power generation performances for a long time period.
摘要翻译: 多个热电直接转换半导体对,其中包括p型半导体和n型半导体; 多个高温电极和多个低温电极,每个电连接p型半导体和n型半导体; 分别经由多个高温电极和多个低温电极与多个热电直接转换半导体对热连接的高温绝缘板和低温绝缘板; 至少一个扩散阻挡层设置在高温或低温电极与热电直接转换半导体对之间,并且整个器件被气密地密封在包含真空或惰性气体气氛的气密的壳体内,由此电极之间的扩散 并且防止半导体对提供长时间显示出优异的发电性能的热电转换装置。
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公开(公告)号:US5914536A
公开(公告)日:1999-06-22
申请号:US678536
申请日:1996-07-05
申请人: Yasushi Shizuki , Yuji Iseki , Naoko Ono , Kunio Yoshihara , Masayuki Saito , Hiroshi Yamada , Kazuki Tateyama
发明人: Yasushi Shizuki , Yuji Iseki , Naoko Ono , Kunio Yoshihara , Masayuki Saito , Hiroshi Yamada , Kazuki Tateyama
IPC分类号: G01R31/04 , H01L21/60 , H01L21/66 , H01L23/485 , H01L23/498 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/34 , H05K3/36 , H01L23/48
CPC分类号: H01L24/13 , G01R31/048 , H01L23/49816 , H01L24/16 , H01L24/81 , H05K3/3436 , H05K3/3442 , H05K3/3452 , H01L2224/05568 , H01L2224/13099 , H01L2224/131 , H01L2224/16058 , H01L2224/16225 , H01L2224/171 , H01L2224/48091 , H01L2224/48227 , H01L2224/81801 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/0101 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/10336 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/16152 , H01L2924/19105 , H05K1/0203 , H05K1/0269 , H05K2201/0367 , H05K2201/09381 , H05K2201/09427 , H05K2201/0989 , H05K2201/10674 , H05K2201/10727 , H05K2201/10969 , H05K2203/0465 , H05K3/3431 , H05K3/368 , Y02P70/613
摘要: A semiconductor device includes a wiring board having a main surface and a plurality of pad electrodes formed on the main surface, a rectangular semiconductor element having a main surface facing the main surface of the wiring board and mounted on the main surface of the wiring board, a solder resist formed to surround the semiconductor element with a preset distance therefrom on the main surface of the wiring board, a plurality of terminal electrodes formed on the end portion of the main surface of the semiconductor element, and a plurality of solder bumps for electrically connecting the plurality of pad electrodes to the plurality of terminal electrodes with a gap provided between the main surface of the wiring board and the main surface of the semiconductor element, wherein each of the plurality of pad electrodes includes at least a portion which extends from substantially under a corresponding one of the plurality of terminal electrodes of the semiconductor element to the solder resist lying outside the semiconductor element and each of the plurality of solder bumps includes a portion extending over part of a corresponding one of the plurality of pads which lies outside the semiconductor element.
摘要翻译: 半导体器件包括具有主表面和形成在主表面上的多个焊盘电极的布线板,具有面向布线板的主表面的主表面并且安装在布线板的主表面上的矩形半导体元件, 在该布线基板的主面上形成有围绕半导体元件与预定距离的阻焊剂,形成于该半导体元件的主面的端部的多个端子电极和多个用于电连接的焊料凸块 将所述多个焊盘电极连接到所述多个端子电极,所述间隙设置在所述布线板的主表面和所述半导体元件的主表面之间,其中所述多个焊盘电极中的每一个包括至少一部分, 在半导体元件的多个端子电极中的对应的一个到焊料re 位于半导体元件外侧的多个焊料块中的每一个包括在位于半导体元件外部的多个焊盘中相应的一个焊盘的一部分上延伸的部分。
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公开(公告)号:US20070028955A1
公开(公告)日:2007-02-08
申请号:US11494529
申请日:2006-07-28
申请人: Takahiro Sogou , Kazuki Tateyama , Hiroyoshi Hanada , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Naokazu Iwanade
发明人: Takahiro Sogou , Kazuki Tateyama , Hiroyoshi Hanada , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka , Naokazu Iwanade
IPC分类号: H01L35/00
CPC分类号: H01L35/32 , H01L35/10 , H05K1/0204 , H05K1/0373 , H05K1/056 , H05K2201/066 , H05K2201/10219
摘要: There is provided a thermoelectric device capable of improving a power generation performance while keeping a hermetic sealing after a heat cycle is applied, and also achieving simplification of a structure and improvement in productivity and reliability of a device by reducing the number of articles, and a method of manufacturing the same. A thermoelectric device, includes a metal substrate 2, a thermoelectric element 3 mounted on a center portion of a surface of the metal substrate 2, a metal lid 4 for covering an upper surface and side surfaces of the thermoelectric element 3, and a joining metal member 5 provided to a peripheral portion of a surface of the metal substrate 2 to hermetically seal a space between the metal substrate 2 and the lid 4.
摘要翻译: 提供了一种能够在施加热循环之后保持气密密封的同时提高发电性能的热电装置,并且通过减少物品的数量也实现了结构的简化和设备的生产率和可靠性的提高,并且 制造方法 热电装置包括金属基板2,安装在金属基板2的表面的中心部分的热电元件3,用于覆盖热电元件3的上表面和侧面的金属盖4和接合金属 构件5设置在金属基板2的表面的周边部分,以密封金属基板2和盖4之间的空间。
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公开(公告)号:US20050211288A1
公开(公告)日:2005-09-29
申请号:US11069952
申请日:2005-03-03
申请人: Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Hiroyoshi Hanada , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka
发明人: Kazuki Tateyama , Takahiro Sogou , Tomohiro Iguchi , Hiroyoshi Hanada , Yasuhito Saito , Masayuki Arakawa , Naruhito Kondo , Osamu Tsuneoka
摘要: In a thermoelectric device, metal fiber nets as conductive members having elasticity are placed between first electrodes and thermoelectric elements, in order to increase productivity and make it possible to reduce variations in performance without impairing the reliability of a slidable structure even if each component is heated to be thermally deformed. This placement prevents the temperature of the metal fiber nets from becoming high in the operation of the thermoelectric device and prevents the elasticity of the metal fiber nets from being lost. Further, this constitution eliminates the necessity for bonding the first electrodes to the thermoelectric elements using solder. Moreover, the elasticity of the metal fiber nets makes it possible to accommodate variations in height among the respective thermoelectric elements when the thermoelectric device is assembled.
摘要翻译: 在热电装置中,作为具有弹性的导电构件的金属纤维网设置在第一电极和热电元件之间,以便提高生产率,并且即使各组件被加热,也可能降低可滑动结构的可靠性而降低性能的变化 被热变形。 该布置防止金属纤维网的温度在热电装置的操作中变高,并且防止金属纤维网的弹性损失。 此外,该结构消除了使用焊料将第一电极与热电元件接合的必要性。 此外,当组装热电装置时,金属纤维网的弹性使得可以适应各热电元件之间的高度变化。
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