摘要:
A semiconductor integrated circuit device is divided into a plurality of blocks, which are individually equipped with signal generate units such that the signal generate units are distributed in the semiconductor integrated circuit device. The semiconductor integrated circuit device is preferably constructed to generate the pulse signal by the pulse generate units which are provided for the individual blocks, after all initial logic operations on the data and control signals have been taken. Thanks to this construction, an SRAM, for example, can have its write recovery time minimized to 0 so that it can achieve high-speed operations. Moreover, since predecoders are provided for the individual blocks, the wiring line number and area in the chip can be reduced to improve the degree of integration of the semiconductor integrated circuit device. Still moreover, signal delay and skew can be reduced in the chip so that high-speed can be achieved. Another feature is that either the input/output pads of the data into or out of the semiconductor integrated circuit device or their accompanying circuit units are distributed in the semiconductor integrated circuit device. The individual features described above can be used solely or in combination, if necessary, to achieve the above-specified objects.
摘要:
A semiconductor integrated circuit device includes a dielectric breakdown prevention circuit coupled to an external terminal for protecting an input stage circuit. The prevention circuit has bipolar transistors and complementary MISFETs including a first MISFET of a first conductivity type and a second MISFET of a second conductivity type. A first semiconductor region of the first conductivity type is formed by the same layer as a well region in which the second MISFET is formed. A second semiconductor region of the second conductivity type is formed in said first semiconductor region by the same layer as source and drain regions of the second MISFET. These first and second semiconductor regions form a first PN junction diode. The external terminal is electrically coupled to one end portion of said second semiconductor region. A high impurity conductivity type buried third semiconductor region underlies the said second semiconductor region, and is formed by the same layer as a region isolating the bipolar transistors. This third region is disposed at the bottom surface of said first semiconductor region. A fourth semiconductor region of the second conductivity type is also formed in said first semiconductor region by the same layer used for collector contact regions of the bipolar transistors, and is connected with another end portion of said second semiconductor region, in contact with the third semiconductor region. The fourth semiconductor region is coupled to the input stage circuit, and the third and fourth semiconductor regions form a second PN junction diode.
摘要:
A monolithic semiconductor integrated circuit device includes bipolar transistors and MOS transistors constituting plural blocks formed in a single semiconductor substrate and capable of performing different functions. The bipolar transistors in the blocks have different breakdown voltages and different operation speeds due to the selection of different resistances of their collector regions.
摘要:
The device has, on a single substrate, plural internal circuits, plural input circuits for receiving external input signals and outputting the same to the internal circuit, and plural output circuits for receiving signals outputted from the internal circuits and externally outputting the same, in which at least one of the circuits includes a totem-pole output stage of a first NPN bipolar transistor, on the power supply terminal side, and a second NPN bipolar transistor, on the ground side; a first differentiator circuit for providing pulsing action to the base of the first NPN transistor; a pair of series-connected PMOS transistors for controllably driving the second NPN transistor; and feedback MOS transistors for quickening turn-off of the output stage transistors. The circuit can be effected with a second differentiator circuit in place of the series-connected pair of PMOS transistors. Arrangements of circuits can also be effected in which the totem-pole connection is constituted by a PNP transistor, on the power source terminal side, and an NPN or NMOS transistor on the ground or pull-down side. With such circuit configurations, the output signal swing is maximized, and the differentiator circuit provides for temporary saturation along with a quickened recovery therefrom, thereby reducing transmission delay time and achieving low power consumption. The device can be implemented by circuitry which employs the bootstrap effect as well as IIL (I.sup.2 L) design schemes.
摘要:
An improved bipolar transistor is provided which can be formed using a number of process steps which are similar to those used for forming MOSFETs. As such, the bipolar transistor is particularly useful in BiCMOS device arrangements. In accordance with one embodiment, a bipolar transistor is formed so that at least one of the emitter and collector regions has a high impurity region and a low impurity region. The collector and emitter regions of the device are formed in the base region to be spaced apart from one another, and the base electrode is arranged to cover the area of the base region between them. In an alternative embodiment, two collector regions can be provided in a base region on opposite sides of an emitter which is also formed in the base region. Two base electrodes can then be respectively provided in the areas between the two collectors and the emitter region. The bipolar transistors are particularly useful for forming a horizontal bipolar transistor structure. Because the bipolar transistors can be formed using the same types of steps used in the manufacture of MOSFETs, the manufacturing costs of the device can be reduced without sacrificing operational capabilities. This is particularly true in the manufacture of BiCMOS devices because many simultaneous manufacturing steps can be used for manufacturing the bipolar transistors and the MOSFETs.
摘要:
The semiconductor IC device has a circuit arrangement constituted by a first CMOS logic gate having input and output terminals, and a second CMOS logic gate which performs the same logic operation as that of the first CMOS logic gate and which has an input terminal connected to the input terminal of the first CMOS logic gate. The arrangement also requires a differentiator circuit which has an input terminal thereof connected to an output terminal of the second CMOS logic gate and has an output terminal connected to the output terminal of the first CMOS logic gate. With such an arrangement, the dependency of the effective gate propagation delay time on an output load is lowered. As a result, therefore, the arrangement can be effected using a low power supply voltage while securing a high operation speed as well as a low power consumption. The CMOS logic gates can also be facilitated in combination with NPN bipolar transistors which are connected therewith in an emitter follower circuit form. This type of arrangement is used to effect a BiNMOS type of logic (inverter) circuit. In accordance with another structural scheme, in place of the first CMOS logic gate, a BiCMOS type of arrangement is effected in combination with the second CMOS logic gate and differentiator.
摘要:
The semiconductor IC device has a circuit arrangement in which one or more of the circuits, such as on a single substrate, include a totem-pole series connection of bipolar transistors which are driven by arrangements of complementary MOS circuits in a manner such that high-speed logic/switching operation is effected. Arrangements of circuits can also be effected in which the totem-pole series connection is constituted by a PNP transistor, on the power source terminal side, and an NPN or NMOS transistor on the ground or pull-down side thereof. With such configurations, the output signal swing at low operating voltages can be maximized while achieving the same with reduced propagation delay time and low power consumption. The device can also be implemented by circuitry employing capacitance bootstrapping effect as well as IIL (I.sup.2 L) design schemes.
摘要:
A semiconductor integrated circuit device is equipped with a DRAM whose memory cell is formed as a series circuit of a memory cell selection MISFET and a data storage capacitance element of a stacked structure. A complementary data line extends on an upper electrode layer of the data storage capacitance element of the stacked structure through an inter-level insulation film which is connected to a semiconductor region of the memory cell selection MISFET. To reduce parasitic capacitance the wiring width of the complementary data line is formed to be smaller than the film thickness of the inter-level insulation film between the complementary data line and the upper electrode layer of said data storage capacitance element of the stacked structure.
摘要:
An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.
摘要:
A semiconductor module in which a lead electrode is integrally formed with or pressed into resin separated from a resin case, and a connector securing a pad for bonding a metal wire to the lead electrode is bonded to a substrate with a power semiconductor element mounted thereon by an adhesive, and the like in a similar manner as the module case. According to the present invention, an electrode can be disposed in an appropriate position in the semiconductor module, and the scope of the free layout is enhanced.