Method of manufacturing vertical power device
    1.
    发明授权
    Method of manufacturing vertical power device 失效
    垂直功率器件的制造方法

    公开(公告)号:US5985708A

    公开(公告)日:1999-11-16

    申请号:US816596

    申请日:1997-03-13

    摘要: A semiconductor apparatus comprising a vertical type semiconductor device having a first conducting type semiconductor substrate, a drain layer formed on the surface of the semiconductor substrate, a drain electrode formed on the surface of the drain layer, a second conducting type base layer selectively formed on the surface of the semiconductor substrate opposite to the drain layer, a first conducting type source layer selectively formed on the surface of the second conducting type base layer, a source electrode formed on the first conducting type source layer and the second conducting type base layer, and a gate electrode formed in contact with the first conducting type source layer, the second conducting type base layer and the semiconductor substrate through a gate insulating film and a lateral semiconductor device having an insulating layer formed in a region of the surface of the semiconductor substrate different from the second conducting type base layer, and a polycrystalline semiconductor layer formed on the insulating layer and having a first conducting type region and a second conducting type region, wherein the first conducting type source layer of the vertical semiconductor device and the first conducting type region of the polycrystalline semiconductor layer are simultaneously formed.

    摘要翻译: 一种半导体装置,包括具有第一导电型半导体衬底的垂直型半导体器件,形成在半导体衬底的表面上的漏极层,形成在漏极层的表面上的漏电极,第二导电型基极层, 所述半导体衬底的与所述漏极层相对的表面,选择性地形成在所述第二导电型基极层的表面上的第一导电型源极层,形成在所述第一导电型源极层和所述第二导电型基极层上的源电极, 以及通过栅极绝缘膜与第一导电型源极层,第二导电型基极层和半导体基板接触形成的栅电极,以及在半导体基板的表面的区域中形成有绝缘层的侧面半导体装置 不同于第二导电型基底层,和多晶 半导体层形成在绝缘层上并具有第一导电类型区域和第二导电类型区域,其中垂直半导体器件的第一导电型源极层和多晶半导体层的第一导电类型区域同时形成。

    Thyristor
    2.
    发明授权
    Thyristor 失效
    晶闸管

    公开(公告)号:US5751022A

    公开(公告)日:1998-05-12

    申请号:US806153

    申请日:1997-02-25

    摘要: A semiconductor device is disclosed having a thyristor region coupled to a semiconductor switching device and a semiconductor rectifier. During turn-off operation, holes are drained from the p-type base region of the thyristor region through the semiconductor rectifier and to the cathode of the thyristor. During turn-on, electrons are supplied to an n-type emitter region of the thyristor from the cathode electrode through the semiconductor switching device.

    摘要翻译: 公开了具有耦合到半导体开关器件和半导体整流器的晶闸管区域的半导体器件。 在关断操作期间,从晶闸管区域的p型基极区域通过半导体整流器和晶闸管的阴极排出孔。 在导通期间,电子通过半导体开关器件从阴极电极提供给晶闸管的n型发射极区域。

    Semiconductor device having lateral IGBT
    3.
    发明授权
    Semiconductor device having lateral IGBT 失效
    具有横向IGBT的半导体器件

    公开(公告)号:US6064086A

    公开(公告)日:2000-05-16

    申请号:US72460

    申请日:1998-05-05

    摘要: An n-type buffer layer and a p-type base layer are formed in the surface of the n.sup.- -type drift layer. A p.sup.+ -type drain layer is formed in the surface of the n-type buffer layer. An n.sup.+ -type source layer and a p.sup.+ -type contact layer are formed in the surface of the p-type base layer. A main gate electrode is arranged to face, through a gate oxide film, a surface of the p-type base layer which is interposed between the n.sup.+ -type source layer and the n.sup.- -type drift layer. An n-type relay layer is formed in the surface of the n.sup.- -type drift layer to face the n.sup.+ -type source layer through the p-type base layer under the main gate electrode. The n-type relay layer extends from the n.sup.- -type drift layer into the p-type base layer. The n-type relay layer decreases the channel resistance.

    摘要翻译: 在n型漂移层的表面形成n型缓冲层和p型基底层。 在n型缓冲层的表面形成p +型漏极层。 在p型基底层的表面形成n +型源极层和p +型接触层。 主栅极布置成通过栅极氧化膜面对介于n +型源极层和n型漂移层之间的p型基极层的表面。 在n型漂移层的表面形成n型继电器层,通过主栅电极下方的p型基极层面对n +型源极层。 n型继电器层从n型漂移层延伸到p型基极层。 n型继电器层降低了通道电阻。

    High breakdown voltage semiconductor device
    6.
    发明授权
    High breakdown voltage semiconductor device 失效
    高击穿电压半导体器件

    公开(公告)号:US6163051A

    公开(公告)日:2000-12-19

    申请号:US154041

    申请日:1998-09-16

    摘要: A high breakdown voltage semiconductor device comprising a first base region of a first conductivity type, a second base region of a second conductivity type, which is formed in a surface region of the first base region, a first gate insulation film formed on an inner wall of a first LOCOS groove formed passing through the second base region to reach the first base region, a first gate electrode formed on the first gate insulation film, a first source region of a first conductivity type, which is formed in a surface region of the second base region around the first LOCOS groove in such a manner as to contact with the first gate insulating film, a first drain region formed in a surface region of the first base region in such a manner as to be spaced apart from the second base region, a source electrode formed on the first source region and on the second base region, and a drain electrode formed on the first drain region.

    摘要翻译: 一种高耐压电压半导体器件,包括第一导电类型的第一基极区域和形成在第一基极区域的表面区域中的第二导电类型的第二基极区域,形成在内壁上的第一栅极绝缘膜 形成为穿过第二基极区域以到达第一基极区域的第一LOCOS沟槽,形成在第一栅极绝缘膜上的第一栅极电极,形成在第一栅极绝缘膜的表面区域中的第一导电类型的第一源极区域, 第二基区,以与第一栅极绝缘膜接触的方式围绕第一LOCOS沟槽;第一漏极区,形成在第一基极区域的表面区域中,以与第二基极区域隔开; 形成在第一源极区域和第二基极区域上的源电极以及形成在第一漏极区域上的漏电极。