公开(公告)号：US5809042A

公开(公告)日：1998-09-15

申请号：US634337

申请日：1996-04-12

申请人： Akio Nakamura ,  Masayuki Murakami ,  Tsutomu Numata

发明人： Akio Nakamura ,  Masayuki Murakami ,  Tsutomu Numata

IPC分类号： H03M13/27 ,  H03M13/29 ,  H04L1/00 ,  G06F11/10

CPC分类号： H04L1/007 ,  H03M13/27 ,  H03M13/29 ,  H04L1/0071 ,  H04L1/0057

摘要： An improvement in an interleave type error correction method in which more errors can be corrected with less correction codes is provided. Array patterns of code words constituting the information code is form by interleaving. The array patterns comprise a plurality of sequences of a plurality of code words. Correction codes are added to the sequences so that a total number of the correction codes added to a selected sequence is greater than a total number of the correction codes added to the other sequences. An error correction is executed in the selected sequence by identifying a position of an error as a consecutive error code position, when the selected sequence is determined to contain said error having a characteristic feature that the error extends over other sequences. A code word of a position corresponding to said consecutive error code position of the selected sequence among code words in the other sequences is recognized as an erasure. Error correction in the other sequences are executed by a method of correcting a disappearance error based on information on the recognized erasure. In addition, an encoder, decoder, and data communication system which implements the error correction method are provided.

摘要翻译： 提供了一种交叉型错误校正方法的改进，其中可以用较少的校正码校正更多的错误。 构成信息码的码字的阵列图案是通过交错形成的。 阵列图案包括多个码字的多个序列。 将校正码添加到序列，使得添加到所选序列的校正码的总数大于添加到其他序列的校正码的总数。 当选择的序列被确定为包含具有该误差在其它序列上延伸的特征的所述误差时，通过将错误的位置识别为连续的错误代码位置，在所选择的序列中执行错误校正。 对应于其他序列中的代码字中所选序列的所述连续错误代码位置的位置的代码字被识别为擦除。 通过基于对识别的擦除的信息来校正消失误差的方法来执行其他序列中的纠错。 此外，提供了实现纠错方法的编码器，解码器和数据通信系统。

公开(公告)号：US08841572B2

公开(公告)日：2014-09-23

申请号：US13541889

申请日：2012-07-05

申请人： Daiei Iwamoto ,  Takashi Yuba ,  Koichi Kiryu ,  SeungSeok Beak ,  Akio Nakamura

发明人： Daiei Iwamoto ,  Takashi Yuba ,  Koichi Kiryu ,  SeungSeok Beak ,  Akio Nakamura

IPC分类号： H01H33/16 ,  H01H9/44 ,  H01H1/26 ,  H01H15/10 ,  H01H15/24 ,  H01H13/52

CPC分类号： H01H1/26 ,  H01H9/443 ,  H01H13/52 ,  H01H15/102 ,  H01H15/24

摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions configured to contact the first and second fixed contacting portions, respectively and provided to be adjacent from each other; and a magnet unit provided such that a first pole is positioned to face the first contacting portion and a second pole is positioned to face the second contacting portion to generate magnetic fields between the first fixed contacting portion and the first movable contacting portion and between the second fixed contacting portion and the second movable contacting portion, respectively.

摘要翻译： 开关装置包括第一和第二接触部分，第一和第二接触部分包括第一和第二固定接触部分，第一和第二可动接触部分分别被配置成接触第一和第二固定接触部分并被设置为彼此相邻; 以及设置成使得第一极定位成面对第一接触部分并且第二极被定位成面对第二接触部分以在第一固定接触部分和第一可动接触部分之间以及在第二接触部分之间产生磁场的磁体单元 固定接触部分和第二可动接触部分。

公开(公告)号：US20130037401A1

公开(公告)日：2013-02-14

申请号：US13541826

申请日：2012-07-05

申请人： Takashi Yuba ,  Daiei Iwamoto ,  SeungSeok Beak ,  Koichi Kiryu ,  Akio Nakamura

发明人： Takashi Yuba ,  Daiei Iwamoto ,  SeungSeok Beak ,  Koichi Kiryu ,  Akio Nakamura

IPC分类号： H01R13/70 ,  H01H33/20

CPC分类号： H01H13/52 ,  H01H1/24 ,  H01H9/44 ,  H01H9/46 ,  H01H15/102 ,  H01H15/24

摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions, respectively, the first fixed contacting portion and the second fixed contacting portion being configured to be electrically connected to one of a power source and an electronic device while the first movable contacting portion and the second movable contacting portion are configured to be electrically connected to the other of the power source and the electronic device; a first electric arc runner provided near at least one of the first fixed contacting portion and the first movable contacting portion; and a second electric arc runner provided near at least one of the second fixed contacting portion and the second movable contacting portion.

摘要翻译： 开关装置包括分别包括第一和第二固定接触部分以及第一和第二可动接触部分的第一和第二接触部分，第一固定接触部分和第二固定接触部分被构造成电连接到电源和 电子设备，同时第一可动接触部分和第二可动接触部分被配置为电连接到电源和电子设备中的另一个; 设置在第一固定接触部分和第一可动接触部分中的至少一个附近的第一电弧流道; 以及设置在第二固定接触部分和第二可动接触部分中的至少一个附近的第二电弧流道。

公开(公告)号：US07719516B2

公开(公告)日：2010-05-18

申请号：US10909329

申请日：2004-08-03

申请人： Noboru Fujii ,  Takashi Arita ,  Nobuyoshi Shimizu ,  Akio Nakamura ,  Shinichiro Akieda ,  Shigemi Kurashima

发明人： Noboru Fujii ,  Takashi Arita ,  Nobuyoshi Shimizu ,  Akio Nakamura ,  Shinichiro Akieda ,  Shigemi Kurashima

IPC分类号： G09G5/00

CPC分类号： H02K41/0354 ,  H02K2201/18

摘要： An actuator includes: a magnetic field generator that has different magnetic poles alternately arranged in a plane, with a predetermined position being the center of the magnetic poles; a coil holder that holds a plurality of coils that are radially arranged and face the magnetic field generator, relative motion being caused between the magnetic field generator and the coil holder; and an electromagnetic conversion unit that detects the relative motion and is mounted on either the magnetic field generator or the coil holder.

摘要翻译： 致动器包括：具有交替布置在平面中的不同磁极的磁场发生器，其中预定位置是磁极的中心; 保持径向布置并面对磁场发生器的多个线圈的线圈架，在磁场发生器和线圈架之间产生相对运动; 以及电磁转换单元，其检测相对运动并安装在磁场发生器或线圈架上。

公开(公告)号：US07663151B2

公开(公告)日：2010-02-16

申请号：US11587632

申请日：2005-04-13

申请人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

发明人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

IPC分类号： H01L33/00

CPC分类号： H01L33/22 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/30

摘要： A light emitting device chip is obtained by dicing a light emitting device wafer having a light emitting layer section 24 based on a double heterostructure in which a first-conductivity-type cladding layer 6, an active layer 5 and an second-conductivity-type cladding layer 4, each of which being composed of a compound semiconductor having a composition allowing lattice matching with GaAs, out of compound semiconductors expressed by formula (AlxGa1-x)yIn1-yP (where, 0≦x≦1, 0≦y≦1), are stacked in this order, and having the (100) surface appeared on the main surface thereof, and GaP transparent semiconductor layers 20, 90 stacked on the light emitting layer section 24 as being agreed with the crystal orientation thereof, so that the {100} surfaces appear on the side faces of the GaP transparent semiconductor layer. Accordingly, there can be provided a method of fabricating a light emitting device having the AlGaInP light emitting layer section and the GaP transparent semiconductor layers, less causative of failures such as edge chipping during the dicing.

摘要翻译： 通过基于双异质结构对具有发光层部分24的发光器件晶片进行切割来获得发光器件芯片，其中第一导电型包覆层6，有源层5和第二导电型包层 （Al x Ga 1-x）y In 1-y P表示的化合物半导体中的每一个由具有允许与GaAs晶格匹配的组成的化合物半导体构成，其中，0≤x≤1,0< y <= 1）按顺序堆叠，并且在其主表面上出现（100）表面，并且与发光层部分24堆叠在一起的GaP透明半导体层20,90与晶体取向一致 ，使得{100}表面出现在GaP透明半导体层的侧面上。 因此，可以提供一种制造具有AlGaInP发光层部分和GaP透明半导体层的发光器件的方法，其不利于在切割期间的边缘切屑等故障。

公开(公告)号：US07595557B2

公开(公告)日：2009-09-29

申请号：US11453827

申请日：2006-06-16

申请人： Kazumi Watase ,  Akio Nakamura ,  Katsumi Ootani

发明人： Kazumi Watase ,  Akio Nakamura ,  Katsumi Ootani

IPC分类号： H01L29/40

CPC分类号： H01L22/14 ,  G01R31/2853 ,  H01L23/3114 ,  H01L23/5228 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/00

摘要： A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal wire for inspection and the electrode for inspection electrically detect an open failure, a short-circuit failure and a leakage failure of the metal wire and a connection failure between an element electrode and the metal wire. A semiconductor wafer is subjected to an electrical test, so that it is possible to detect the aforementioned failures with good accuracy during a manufacturing process.

摘要翻译： 在不形成金属线和外部连接用电极的半导体基板的区域上形成检查用金属线和检查用电极。 用于检查的金属线和用于检查的电极电检测金属线的开路故障，短路故障和漏电故障以及元件电极和金属线之间的连接故障。 对半导体晶片进行电气测试，从而可以在制造过程中以高精度检测上述故障。

公开(公告)号：US07579205B2

公开(公告)日：2009-08-25

申请号：US11587635

申请日：2005-04-13

申请人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

发明人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L33/30 ,  H01L24/03 ,  H01L24/05 ,  H01L33/22 ,  H01L2224/48091 ,  Y10S438/964 ,  H01L2924/00014

摘要： A light emitting device wafer having a light emitting layer section 24 having an AlGaInP-base double heterostructure, and a GaP light extraction layer 20 disposed on the light emitting layer section so as to allow a first main surface thereof to compose a first main surface of the wafer is fabricated so that the first main surface of the GaP light extraction layer appears as the (100) surface. The first main surface of the GaP light extraction layer 20 composed of the (100) surface is etched using an etching solution for surface roughening to thereby form surface roughening projections 40f. Accordingly, there can be provided a method of fabricating a light emitting device having the GaP light extraction layer agreed with the (100) main surface, capable of readily subjecting the (100) main surface to surface roughening.

摘要翻译： 一种发光器件晶片，具有具有AlGaInP基双异质结构的发光层部分24和设置在发光层部分上的GaP光提取层20，以便允许其第一主表面组成第一主表面 制造晶片，使得GaP光提取层的第一主表面显示为（100）表面。 使用用于表面粗糙化的蚀刻溶液蚀刻由（100）表面构成的GaP光提取层20的第一主表面，从而形成表面粗糙化突起40f。 因此，可以提供一种制造具有与（100）主表面一致的GaP光提取层的发光器件的方法，能够容易地使（100）主表面粗糙化。

公开(公告)号：US07416805B2

公开(公告)日：2008-08-26

申请号：US10677353

申请日：2003-10-03

申请人： Akio Nakamura ,  Takashi Arita

发明人： Akio Nakamura ,  Takashi Arita

IPC分类号： H01M2/00 ,  H01M2/14 ,  H01M8/00

CPC分类号： H01M8/2475 ,  H01M8/248

摘要： A fuel cell device is disclosed that is capable of being made compact when being transported and in storage. The fuel cell device includes a fuel cell unit including a number of fuel cells arranged sequentially in a case. The case includes a holder frame for holding the fuel cells, a first hemi-case, and a second hemi-case. The width of the case is adjustable in the direction in which the fuel cells are arranged in a line. When the fuel cell device is being transported or in storage, the first hemi-case and the second hemi-case are pushed to approach each other, making the size of the case small. When the fuel cell device is used to generate electrical power, the first hemi-case and the second hemi-case are pulled apart from each other and, accordingly, the fuel cells are separated from each other by a springy plate.

摘要翻译： 公开了一种燃料电池装置，其能够在运输和存储时被制造得紧凑。 燃料电池装置包括燃料电池单元，该燃料电池单元包括在壳体中顺次布置的多个燃料电池。 壳体包括用于保持燃料电池的保持架，第一半壳体和第二半壳体。 壳体的宽度可以在燃料电池排列成一行的方向上调节。 当燃料电池装置被运输或储存时，第一半箱和第二半壳被推动以彼此靠近，使得壳体的尺寸小。 当燃料电池装置用于产生电力时，第一半壳体和第二半壳体彼此分离，因此燃料电池通过弹性板彼此分离。

公开(公告)号：US20080179723A1

公开(公告)日：2008-07-31

申请号：US11947169

申请日：2007-11-29

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device includes a die pad section having a surface and a back surface, a first semiconductor chip having a surface on which a first electrode section is formed, and a back surface fixed to the surface of the die pad section, a second semiconductor chip having a surface on which a second electrode section is formed, and a back surface fixed to the surface of the first semiconductor chip, lead terminal sections respectively electrically connected to the first and second electrode sections, and a resin encapsulating body that seals the die pad section and the first and second semiconductor chips. An edge portion of the second semiconductor chip protrudes from an edge portion of the first semiconductor chip. An edge portion of the die pad section protrudes from an edge portion of the first semiconductor chip.

摘要翻译： 半导体器件包括具有表面和背面的芯片焊盘部分，具有形成有第一电极部分的表面的第一半导体芯片和固定到芯片焊盘部分的表面的后表面，第二半导体芯片 具有形成第二电极部分的表面和固定到第一半导体芯片的表面的背面，分别电连接到第一和第二电极部分的引线端子部分和密封芯片焊盘的树脂封装体 以及第一和第二半导体芯片。 第二半导体芯片的边缘部分从第一半导体芯片的边缘部分突出。 芯片焊盘部分的边缘部分从第一半导体芯片的边缘部分突出。

公开(公告)号：US07310081B2

公开(公告)日：2007-12-18

申请号：US10815666

申请日：2004-04-02

申请人： Akio Nakamura ,  Yuriko Nishiyama ,  Shinichiro Akieda ,  Shigemi Kurashima ,  Nobuyoshi Shimizu ,  Takashi Arita

发明人： Akio Nakamura ,  Yuriko Nishiyama ,  Shinichiro Akieda ,  Shigemi Kurashima ,  Nobuyoshi Shimizu ,  Takashi Arita

IPC分类号： G09G5/00

CPC分类号： G06F3/011 ,  G05G9/047 ,  G05G2009/04755 ,  G05G2009/04766 ,  G06F3/0202 ,  G06F3/0338 ,  H01H25/041 ,  H01H2215/05

摘要： In an inputting apparatus which is manipulated with a finger placed on a manipulating section included in the inputting apparatus, the manipulating section is configured to stimulate the tactile sense of the finger used in the manipulating, enabling to confirm the inputting.

摘要翻译： 在用设置在输入装置中的操作部分上的手指进行操作的输入装置中，操作部被配置为刺激在操纵中使用的手指的触感，能够确认输入。