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公开(公告)号：US20070101572A1
公开(公告)日：2007-05-10
申请号：US10564275
申请日：2004-08-25
CPC分类号： H01L21/67144 , H01L21/67132 , H01L2221/68322 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： A component mounting apparatus is provided with a board holding device for holding a board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.
摘要翻译： 元件安装装置具有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板上的板上 保持位置的第二安装头，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持各个部件的晶片的晶片保持台的部件供给装置 进给，使得晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。
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公开(公告)号：US07637714B2
公开(公告)日：2009-12-29
申请号：US10568501
申请日：2004-09-07
IPC分类号： B29C63/00
CPC分类号： H01L21/67132 , Y10T156/1132 , Y10T156/1944
摘要： While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the adhesion region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change an adhesive surface bond of the semiconductor chip to the adhesive sheet to point bonding. Further, the removing member is moved along the bottom surface of the semiconductor chip so as to change the position of the point bonding and decrease the adhesive bonding force to the adhesive sheet. Then, the semiconductor chip is removed from the adhesive sheet.
摘要翻译： 在与半导体芯片的粘接区域相对应的压敏粘合片的底面侧区域的附近被吸引保持时，移除部件的多个突出部与底面 的半导体芯片通过粘合片在粘合区域。 此外，粘合片被吸入各个突出部分之间，以便改变半导体芯片与粘合片的粘合表面粘结以进行点焊。 此外，移除构件沿着半导体芯片的底表面移动，以便改变点接合的位置，并降低粘合剂粘合力。 然后，将半导体芯片从粘合片上取出。
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公开(公告)号：US20060285965A1
公开(公告)日：2006-12-21
申请号：US10568501
申请日：2004-09-07
IPC分类号： B65G1/133
CPC分类号： H01L21/67132 , Y10T156/1132 , Y10T156/1944
摘要： While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by-adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.
摘要翻译： 在与半导体芯片（1）的粘合区域（R 1）对应的粘合片（3）的底面侧区域的附近被吸住并保持的情况下，将多个突起部（30） 移除部件（21）通过该区域的粘合片与半导体芯片的底面接触。 此外，粘合片被吸入各个突出部分之间，以便将半导体芯片与粘合片的表面粘合改变为点粘合，并且还可以沿着半导体的底表面移动移除构件 从而改变点粘合的位置，并通过粘合降低粘合片的粘合力。 然后，将半导体芯片从粘合片上取出。
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公开(公告)号：US07437818B2
公开(公告)日：2008-10-21
申请号：US10564275
申请日：2004-08-25
IPC分类号： H05K3/30
CPC分类号： H01L21/67144 , H01L21/67132 , H01L2221/68322 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.
摘要翻译： 一种用于将多个部件安装在板上的部件安装装置和方法。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。
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公开(公告)号：US08001678B2
公开(公告)日：2011-08-23
申请号：US12202594
申请日：2008-09-02
IPC分类号： B23P19/00
CPC分类号： H01L21/67144 , H01L21/67132 , H01L2221/68322 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.
摘要翻译： 一种用于将多个部件安装在板上的部件安装装置。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。
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公开(公告)号：US20090007420A1
公开(公告)日：2009-01-08
申请号：US12202594
申请日：2008-09-02
IPC分类号： B23P19/00
CPC分类号： H01L21/67144 , H01L21/67132 , H01L2221/68322 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191
摘要： A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.
摘要翻译： 一种用于将多个部件安装在板上的部件安装装置。 该装置设置有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板保持位置的板上 ，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持其上供给各个部件的晶片的晶片保持台的部件供给装置， 晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。
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7.发明授权公开(公告)号：US06836960B2
公开(公告)日：2005-01-04
申请号：US09853681
申请日：2001-05-14
申请人： Kurayasu Hamasaki , Makito Seno , Kunio Sakurai , Hiroshi Ota , Akiko Katsui , Yoshiyuki Nagai
发明人： Kurayasu Hamasaki , Makito Seno , Kunio Sakurai , Hiroshi Ota , Akiko Katsui , Yoshiyuki Nagai
CPC分类号： H05K13/0069 , Y10T29/4913 , Y10T29/53 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/5337
摘要： The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.
摘要翻译： 本发明的目的是提供一种用于传送板的装置和方法，以及一种部件安装装置，由此可以根据要生产的板的类型提高生产效率。 为了实现该目的，布置了能够将安装的板从加工板传送路径移动到未处理的板传送路径的移位装置，用于控制该移动的控制器和识别装置。 通过这种布置，能够根据要制造的板的种类切换传送板的方法，并且控制向部件安装装置的板的供给，从而根据板的种类提高生产效率。
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公开(公告)号：US07296344B2
公开(公告)日：2007-11-20
申请号：US10795978
申请日：2004-03-10
IPC分类号： B23P19/00
CPC分类号： H05K13/0413 , H05K13/041 , H05K13/0813 , H05K13/0853 , Y10T29/49004 , Y10T29/4913 , Y10T29/5137 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191 , Y10T29/5323
摘要： Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-held by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.
摘要翻译： 用于安装部件的装置，即使部件具有窄的部件间距离，也不会在已经安装的部件和由吸嘴吸引的吸嘴或部件之间产生任何干扰。 用于拾取从部件供应部分通过附接到安装头上的吸嘴并将电子部件安装在印刷电路板上的电子部件的部件安装装置包括：控制部分，其包含与要安装和控制的部件有关的信息，基于 该信息，吸嘴，安装头和印刷电路板的位置，使得要安装的部件以高度的升序安装。
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公开(公告)号：US06729018B1
公开(公告)日：2004-05-04
申请号：US09654043
申请日：2000-09-01
IPC分类号： H05K330
CPC分类号： H05K13/0413 , H05K13/041 , H05K13/0813 , H05K13/0853 , Y10T29/49004 , Y10T29/4913 , Y10T29/5137 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191 , Y10T29/5323
摘要： Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-hold by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.
摘要翻译： 用于安装部件的装置，即使部件具有窄的部件间距离，也不会在已经安装的部件和吸嘴之间产生任何干扰，或者通过吸嘴吸附保持部件。 用于拾取从部件供应部分通过附接到安装头上的吸嘴并将电子部件安装在印刷电路板上的电子部件的部件安装装置包括：控制部分，其包含与要安装和控制的部件有关的信息，基于 该信息，吸嘴，安装头和印刷电路板的位置，使得要安装的部件以高度的升序安装。
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公开(公告)号：US5524812A
公开(公告)日：1996-06-11
申请号：US442886
申请日：1995-05-17
申请人： Masahiro Taniguchi , Youichi Nakamura , Kazumi Ishimoto , Kimihito Kuwabara , Toshinori Mimura , Kurayasu Hamasaki , Kenichi Nakano , Manabu Ando
发明人： Masahiro Taniguchi , Youichi Nakamura , Kazumi Ishimoto , Kimihito Kuwabara , Toshinori Mimura , Kurayasu Hamasaki , Kenichi Nakano , Manabu Ando
CPC分类号： H02K3/34 , B23K1/008 , B23K1/012 , B23K2201/40 , B23K2201/42
摘要： The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.
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