公开(公告)号：US5758686A

公开(公告)日：1998-06-02

申请号：US864846

申请日：1997-05-29

申请人： Akira Ohtsuka ,  Chosei Kaseda

发明人： Akira Ohtsuka ,  Chosei Kaseda

IPC分类号： G01M13/00 ,  G05B23/02 ,  G05D16/20 ,  F16K31/12

CPC分类号： G05D7/005 ,  Y10T137/7762 ,  Y10T137/7769 ,  Y10T137/777

摘要： In a control valve abnormality detection method of detecting abnormality in a control valve, a characteristic expression representing the relationship between three factors in the normal state of the control valve is pre-set. The three factors consist of the displacement of the valve stem, a driving force from the valve stem driving device which changes upon displacement of the valve stem, and the force of the fluid which acts on one end of the valve stem through the valve. The three factors are detected on the basis of measurement result. On the basis of two factors selected from the detected three factors, the estimated value of one factor, which is not selected, is calculated by using the pre-set characteristic expression. The detected value of one factor, which is not selected, is compared with the calculated estimated value, and abnormality in the control valve is determined on the basis of the comparison result. A control valve abnormality detection apparatus is also disclosed.

摘要翻译： 在检测控制阀的异常的控制阀异常检测方法中，预先设定代表控制阀的正常状态的三个因素之间的关系的特征表达式。 这三个因素包括阀杆的位移，来自阀杆驱动装置的驱动力，其在阀杆的位移上变化，以及通过阀门作用在阀杆的一端上的流体的力。 在测量结果的基础上检测出三个因素。 基于从检测到的三个因素中选择的两个因素，通过使用预设的特征表达式来计算未选择的一个因子的估计值。 将未选择的一个因子的检测值与计算出的估计值进行比较，并且基于比较结果确定控制阀中的异常。 还公开了一种控制阀异常检测装置。

公开(公告)号：US5750879A

公开(公告)日：1998-05-12

申请号：US864242

申请日：1997-05-28

申请人： Akira Ohtsuka ,  Chosei Kaseda

发明人： Akira Ohtsuka ,  Chosei Kaseda

IPC分类号： G01M13/00 ,  F15B20/00 ,  G01N19/02 ,  G01N19/04

CPC分类号： G01N19/02

摘要： In a stick-slip detection method, the displacement of a movable member having a slidable contact portion is detected. A first quantity of state is calculated on the basis of the detected displacement of the movable member. A second quantity of state, which can be estimated from the first quantity of state, is calculated on the basis of the detected displacement of the movable member. An estimated quantity of state is calculated by estimating a second quantity of state from the calculated first quantity of state by using the relationship between the first and second predetermined quantities of state which are obtained from the displacement of the movable member in a normal sliding state. The calculated second quantity of state is compared with the estimated quantity of state to determine an abnormal sliding operation of the movable member on the basis of the comparison result. A stick-slip detection apparatus is also disclosed.

摘要翻译： 在粘滑检测方法中，检测具有可滑动接触部分的可移动部件的位移。 基于检测到的可动构件的位移来计算第一数量的状态。 基于检测到的可动构件的位移来计算可以从第一数量状态估计的第二数量的状态。 通过使用从正常滑动状态下的可动件的位移获得的第一和第二预定状态量之间的关系，通过从计算的第一状态量估计第二数量的状态来计算估计的状态量。 将计算出的第二状态量与估计的状态量进行比较，以根据比较结果确定可动构件的异常滑动操作。 还公开了粘滑检测装置。

公开(公告)号：US5563101A

公开(公告)日：1996-10-08

申请号：US368636

申请日：1995-01-04

申请人： Mituo Osada ,  Yoshinari Amano ,  Nobuo Ogasa ,  Akira Ohtsuka

发明人： Mituo Osada ,  Yoshinari Amano ,  Nobuo Ogasa ,  Akira Ohtsuka

IPC分类号： B22F3/24 ,  H01L21/52 ,  H01L21/58 ,  H01L23/14 ,  H01L23/373 ,  H01L21/60

CPC分类号： H01L24/83 ,  B22F3/24 ,  H01L23/142 ,  H01L23/3733 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T428/12014 ,  Y10T428/12056 ,  Y10T428/12493

摘要： This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in an integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the substrate having the heat radiation capable of efficiently radiating heat developed from the loaded semiconductor chip and thermal expansion coefficient similar to those of semiconductor chip and other enclosure material except for the substrate.

公开(公告)号：US07343401B2

公开(公告)日：2008-03-11

申请号：US09813962

申请日：2001-03-22

申请人： Ikuko Tachibana ,  Akira Ohtsuka ,  Hideki Ise ,  Kazuhiro Matsushita ,  Hideki Yoshida ,  Kazuhiko Itoh

发明人： Ikuko Tachibana ,  Akira Ohtsuka ,  Hideki Ise ,  Kazuhiro Matsushita ,  Hideki Yoshida ,  Kazuhiko Itoh

IPC分类号： G06F15/177

CPC分类号： G06F11/2294 ,  G06F11/0709 ,  G06F11/0748

摘要： A remote maintenance apparatus is provided. The remote maintenance apparatus includes: a first obtaining part which obtains configuration information of terminals sent from the terminals; a storing part which stores the configuration information while bringing the configuration information into correspondence with generation information; a second obtaining part which obtains configuration information of a failed terminal; and an extraction part which extracts difference information between configuration information obtained by the second obtaining part and configuration information stored in the storing part which has older generation.

摘要翻译： 提供远程维护设备。 远程维护装置包括：第一获取部，其获得从终端发送的终端的配置信息; 存储部，其在将所述配置信息与生成信息对应的同时存储所述配置信息; 获取故障终端的配置信息的第二获取部; 以及提取部，其提取由第二获取部获得的配置信息与存储在具有较早一代的存储部中的配置信息之间的差分信息。

公开(公告)号：US5708959A

公开(公告)日：1998-01-13

申请号：US635651

申请日：1996-04-22

申请人： Mituo Osada ,  Yoshinari Amano ,  Nobuo Ogasa ,  Akira Ohtsuka

发明人： Mituo Osada ,  Yoshinari Amano ,  Nobuo Ogasa ,  Akira Ohtsuka

IPC分类号： B22F3/24 ,  H01L21/52 ,  H01L21/58 ,  H01L23/14 ,  H01L23/373 ,  B22F3/26 ,  B22F7/04

CPC分类号： H01L24/83 ,  B22F3/24 ,  H01L23/142 ,  H01L23/3733 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T428/12014 ,  Y10T428/12056 ,  Y10T428/12493

摘要： This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the substrate having the heat radiation capable of efficiently radiating heat developed from the loaded semiconductor chip and thermal expansion coefficient similar to those of semiconductor chip and other enclosure material except for the substrate.

摘要翻译： 本发明涉及在集成电路装置中加载半导体芯片的半导体装置用基板，其特征在于，含有2〜30重量％ 使用钨和/或钼中的％作为具有能够有效地辐射从负载的半导体芯片显影的热的热辐射的基板和与除了基板以外的半导体芯片和其它外壳材料相似的热膨胀系数。

公开(公告)号：US5525428A

公开(公告)日：1996-06-11

申请号：US368657

申请日：1995-01-04

申请人： Mituo Osada ,  Yoshinari Amano ,  Nobuo Ogasa ,  Akira Ohtsuka

发明人： Mituo Osada ,  Yoshinari Amano ,  Nobuo Ogasa ,  Akira Ohtsuka

IPC分类号： B22F3/24 ,  H01L21/52 ,  H01L21/58 ,  H01L23/14 ,  H01L23/373 ,  B22F7/04

CPC分类号： H01L24/83 ,  B22F3/24 ,  H01L23/142 ,  H01L23/3733 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T428/12014 ,  Y10T428/12056 ,  Y10T428/12493

摘要： This invention relates to a substrate for semiconductor apparatus loading a semiconductor chip in an integrated circuit apparatus and is characterized in that a sintered compact containing copper of 2 to 30 wt. % in tungsten and/or molybdenum is used as the substrate having the heat radiation capable of efficiently radiating heat developed from the loaded semiconductor chip and thermal expansion coefficient similar to those of semiconductor chip and other enclosure material except for the substrate.

摘要翻译： 本发明涉及用于在集成电路装置中加载半导体芯片的半导体装置用基板，其特征在于，含有2〜30重量％ 使用钨和/或钼中的％作为具有能够有效地辐射从负载的半导体芯片显影的热的热辐射的基板和与除了基板以外的半导体芯片和其它外壳材料相似的热膨胀系数。

公开(公告)号：US5409864A

公开(公告)日：1995-04-25

申请号：US284277

申请日：1994-08-02

申请人： Mituo Osada ,  Yoshinari Amano ,  Nobuo Ogasa ,  Akira Ohtsuka

发明人： Mituo Osada ,  Yoshinari Amano ,  Nobuo Ogasa ,  Akira Ohtsuka

IPC分类号： B22F3/24 ,  H01L21/52 ,  H01L21/58 ,  H01L23/14 ,  H01L23/373 ,  H01L21/60

CPC分类号： H01L24/83 ,  B22F3/24 ,  H01L23/142 ,  H01L23/3733 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T428/12014 ,  Y10T428/12056 ,  Y10T428/12493

摘要： This invention relates to a substrate for mounting a semiconductor chip in an integrated circuit wherein a sintered compact containing copper at 2 to 30 wt. % and tungsten and/or molybdenum is employed as a substrate which efficiently radiates heat developed from the semiconductor chip mounted thereon and said substrate having a thermal expansion coefficient similar to those of semiconductor chip and other enclosure materials.

摘要翻译： 本发明涉及用于将半导体芯片安装在集成电路中的基板，其中含有2-30重量％的铜的烧结体 ％和钨和/或钼用作有效辐射从其上安装的半导体芯片展开的热的衬底，并且所述衬底具有与半导体芯片和其它外壳材料相似的热膨胀系数。

公开(公告)号：US4588836A

公开(公告)日：1986-05-13

申请号：US526031

申请日：1983-08-24

申请人： Kunio Matsumoto ,  Yoshitaka Kagimoto ,  Tsutomu Hirata ,  Susumu Watanabe ,  Akira Ohtsuka ,  Kiyoharu Takahashi

发明人： Kunio Matsumoto ,  Yoshitaka Kagimoto ,  Tsutomu Hirata ,  Susumu Watanabe ,  Akira Ohtsuka ,  Kiyoharu Takahashi

IPC分类号： C12Q1/26 ,  C12Q1/37 ,  C12Q1/52 ,  C07C101/72 ,  C12Q1/48

CPC分类号： C12Q1/52 ,  C12Q1/26 ,  C12Q1/37 ,  C12Q2337/10 ,  Y10S435/817

摘要： A compound of the formula ##STR1## wherein R is L-leucyl or .gamma.-L-glutamyl and X and Y are halogen and are the same or different, or a salt thereof. These compounds are useful as synthetic substrates for assaying peptidase activity.

摘要翻译： 其中R为L-亮氨酰或γ--L-谷氨酰基且X和Y为卤素并且相同或不同，或其盐的式IMA化合物。 这些化合物可用作测定肽酶活性的合成底物。

公开(公告)号：US5297263A

公开(公告)日：1994-03-22

申请号：US871598

申请日：1992-04-17

申请人： Akira Ohtsuka ,  Toru Shimizu

发明人： Akira Ohtsuka ,  Toru Shimizu

IPC分类号： G06F9/38 ,  G06F11/00

CPC分类号： G06F9/3865 ,  G06F9/3867

摘要： A method and apparatus for processing exceptions in a microprocessor having a plurality of pipelined stages. The method comprises the steps of generating an exception processing code at a given stage to indicate the occurrence of an exception at the given stage; temporarily stopping processing at the given stage; transferring the exception processing code to a special stage; decoding said exception processing code at the special stage; and causing the pipeline to execute exception processing when the exception processing code is decoded at the special stage. Using the invention, the microprocessor can avoid much of the delay and complexity resulting from using an external circuit to control exception processing and can cope with the occurrence of an exception at any stage without prematurely cancelling or reexecuting processing steps. The invention is simplified in both hardware and software, and can easily cope with expansion of the number of stages.

摘要翻译： 一种在具有多个流水线阶段的微处理器中处理异常的方法和装置。 该方法包括以下步骤：在给定阶段产生异常处理代码，以指示给定阶段发生异常; 在给定阶段临时停止处理; 将异常处理代码转移到特殊阶段; 在特殊阶段解码所述异常处理代码; 并且在异常处理代码在特殊阶段被解码时使得流水线执行异常处理。 使用本发明，微处理器可以避免使用外部电路来控制异常处理的大部分延迟和复杂性，并且可以在任何阶段处理异常的发生，而不会过早地取消或重新执行处理步骤。 本发明在硬件和软件方面都被简化，并且可以容易地应付阶段的扩展。

公开(公告)号：US5122197A

公开(公告)日：1992-06-16

申请号：US573565

申请日：1990-08-28

申请人： Hiroshi Asai ,  Ichiro Kitayama ,  Kouji Mineshita ,  Ken Okazaki ,  Akira Ohtsuka ,  Yuichi Nishiyama ,  Yasuo Uosaki

发明人： Hiroshi Asai ,  Ichiro Kitayama ,  Kouji Mineshita ,  Ken Okazaki ,  Akira Ohtsuka ,  Yuichi Nishiyama ,  Yasuo Uosaki

IPC分类号： C22C37/06 ,  F16D69/02

CPC分类号： F16D69/027 ,  C22C37/06

摘要： A cast-iron product has a composition of 4.3-4.9 wt. % Carbon Equivalent (CE), 0.25-0.5 wt. % Chromium (Cr), 0.05-0.12 wt. % Tin (Sn), 0.4-1.2 wt. % Manganese (Mn), 0-0.1 wt. % Phosphorus (P), and 0-0.15 wt. % Sulfur (S), with the balance being Iron (Fe). A brake assembly comprises a sliding element made of such a cast iron, and the sliding element is adapted to slideably contact with a friction element or elements made of non-asbestos material and constitute the assembly. Further, a method of producing a cast iron product comprises the steps of casting a cast iron having a composition of 4.3-4.9 wt. % Carbon Equivalent (CE), 0.25-0.5 wt. % Chromium (Cr), 0.05-0.12 wt. % Tin (Sn), 0.4-1.2 wt. % Manganese (Mn), 0-0.1 wt. % Phosphorus (P), and 0-0.15 wt. % Sulfur (S), with the balance being Iron (Fe), releasing a mold at a temperature not less than A.sub.1 allotropic transformation temperature, and cooling the cast iron at a relatively high cooling rate.

摘要翻译： 铸铁产品的组成为4.3-4.9wt。 ％碳当量（CE），0.25-0.5重量％ ％铬（Cr），0.05-0.12重量％ ％锡（Sn），0.4-1.2重量％ ％锰（Mn），0-0.1重量％ 磷（P）和0-0.15重量％ ％硫（S），余量为铁（Fe）。 制动组件包括由这种铸铁制成的滑动元件，并且滑动元件适于与由非石棉材料制成的摩擦元件滑动接触并构成组件。 此外，制造铸铁制品的方法包括以下步骤：铸造组成为4.3-4.9重量％的铸铁。 ％碳当量（CE），0.25-0.5重量％ ％铬（Cr），0.05-0.12重量％ ％锡（Sn），0.4-1.2重量％ ％锰（Mn），0-0.1重量％ 磷（P）和0-0.15重量％ ％硫（S），余量为铁（Fe），在不低于A1同素异形转变温度的温度下释放模具，并以相对较高的冷却速度冷却铸铁。